CMOS Vision Sensors: Embedding Computer Vision at Imaging Front-Ends

CMOS Image Sensors (CIS) are key for imaging technol-ogies. These chips are conceived for capturing opticalscenes focused on their surface, and for delivering elec-trical images, commonly in digital format. CISs may incor-porate intelligence; however, their smartness basicallyconcerns calibration, error correction and other similartasks. The term CVISs (CMOS VIsion Sensors) definesother class of sensor front-ends which are aimed at per-forming vision tasks right at the focal plane. They havebeen running under names such as computational imagesensors, vision sensors and silicon retinas, among others. CVIS and CISs are similar regarding physical imple-mentation. However, while inputs of both CIS and CVISare images captured by photo-sensors placed at thefocal-plane, CVISs primary outputs may not be imagesbut either image features or even decisions based on thespatial-temporal analysis of the scenes. We may hencestate that CVISs are more “intelligent” than CISs as theyfocus on information instead of on raw data. Actually,CVIS architectures capable of extracting and interpretingthe information contained in images, and prompting reac-tion commands thereof, have been explored for years inacademia, and industrial applications are recently ramp-ing up.One of the challenges of CVISs architects is incorporat-ing computer vision concepts into the design flow. Theendeavor is ambitious because imaging and computervision communities are rather disjoint groups talking dif-ferent languages. The Cellular Nonlinear Network Univer-sal Machine (CNNUM) paradigm, proposed by Profs.Chua and Roska, defined an adequate framework forsuch conciliation as it is particularly well suited for hard-ware-software co-design [1]-[4]. This paper overviewsCVISs chips that were conceived and prototyped at IMSEVision Lab over the past twenty years. Some of them fitthe CNNUM paradigm while others are tangential to it. Allthem employ per-pixel mixed-signal processing circuitryto achieve sensor-processing concurrency in the quest offast operation with reduced energy budget.Junta de Andalucía TIC 2012-2338Ministerio de Economía y Competitividad TEC 2015-66878-C3-1-R y TEC 2015-66878-C3-3-

Advanced sensors technology survey

This project assesses the state-of-the-art in advanced or 'smart' sensors technology for NASA Life Sciences research applications with an emphasis on those sensors with potential applications on the space station freedom (SSF). The objectives are: (1) to conduct literature reviews on relevant advanced sensor technology; (2) to interview various scientists and engineers in industry, academia, and government who are knowledgeable on this topic; (3) to provide viewpoints and opinions regarding the potential applications of this technology on the SSF; and (4) to provide summary charts of relevant technologies and centers where these technologies are being developed

Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].

Arah aliran pempakejan sistem-sistem dan subsistem mikroelektronik adalah kearah pengurangan saiz dan peningkatan prestasi, di mana kedua-duanya menyumbang kepada peningkatan kadar penjanaan haba. The trend in packaging microelectronic systems and subsystems has been to reduce size and increase performance, both of which contribute to increase heat generation