17,626 research outputs found

    Thermal impedance plots of micro-scaled devices

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    Optimizing construction of scheduled data flow graph for on-line testability

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    The objective of this work is to develop a new methodology for behavioural synthesis using a flow of synthesis, better suited to the scheduling of independent calculations and non-concurrent online testing. The traditional behavioural synthesis process can be defined as the compilation of an algorithmic specification into an architecture composed of a data path and a controller. This stream of synthesis generally involves scheduling, resource allocation, generation of the data path and controller synthesis. Experiments showed that optimization started at the high level synthesis improves the performance of the result, yet the current tools do not offer synthesis optimizations that from the RTL level. This justifies the development of an optimization methodology which takes effect from the behavioural specification and accompanying the synthesis process in its various stages. In this paper we propose the use of algebraic properties (commutativity, associativity and distributivity) to transform readable mathematical formulas of algorithmic specifications into mathematical formulas evaluated efficiently. This will effectively reduce the execution time of scheduling calculations and increase the possibilities of testability

    Thick-Film and LTCC Passive Components for High-Temperature Electronics

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    At this very moment an increasing interest in the field of high-temperature electronics is observed. This is a result of development in the area of wide-band semiconductors’ engineering but this also generates needs for passives with appropriate characteristics. This paper presents fabrication as well as electrical and stability properties of passive components (resistors, capacitors, inductors) made in thick-film or Low-Temperature Co-fired Ceramics (LTCC) technologies fulfilling demands of high-temperature electronics. Passives with standard dimensions usually are prepared by screen-printing whereas combination of standard screen-printing with photolithography or laser shaping are recommenced for fabrication of micropassives. Attainment of proper characteristics versus temperature as well as satisfactory long-term high-temperature stability of micropassives is more difficult than for structures with typical dimensions for thick-film and LTCC technologies because of increase of interfacial processes’ importance. However it is shown that proper selection of thick-film inks together with proper deposition method permit to prepare thick-film micropassives (microresistors, air-cored microinductors and interdigital microcapacitors) suitable for the temperature range between 150°C and 400°C

    Design, processing and testing of LSI arrays, hybrid microelectronics task

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    Mathematical cost models previously developed for hybrid microelectronic subsystems were refined and expanded. Rework terms related to substrate fabrication, nonrecurring developmental and manufacturing operations, and prototype production are included. Sample computer programs were written to demonstrate hybrid microelectric applications of these cost models. Computer programs were generated to calculate and analyze values for the total microelectronics costs. Large scale integrated (LST) chips utilizing tape chip carrier technology were studied. The feasibility of interconnecting arrays of LSU chips utilizing tape chip carrier and semiautomatic wire bonding technology was demonstrated

    Contamination Control in Hybrid Microelectronic Modules. Part 1: Identification of Critical Process and Contaminants

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    Various hybrid processing steps, handling procedures, and materials are examined in an attempt to identify sources of contamination and to propose methods for the control of these contaminants. It is found that package sealing, assembly, and rework are especially susceptible to contamination. Moisture and loose particles are identified as the worst contaminants. The points at which contaminants are most likely to enter the hybrid package are also identified, and both general and specific methods for their detection and control are developed. In general, the most effective controls for contaminants are: clean working areas, visual inspection at each step of the process, and effective cleaning at critical process steps. Specific methods suggested include the detection of loose particles by a precap visual inspection, by preseal and post-seal electrical testing, and by a particle impact noise test. Moisture is best controlled by sealing all packages in a clean, dry, inert atmosphere after a thorough bake-out of all parts

    NASA guidelines on report literature

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    NASA seeks for inclusion in its Scientific and Technical Information System research reports, conference proceedings, meeting papers, monographs, and doctoral and post graduate theses which relate to the NASA mission and objectives. Topics of interest to NASA are presented
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