24,804 research outputs found

    Saxony's capital Dresden: On the way to become Eastern Germany's first Innovative Milieu?

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    In this paper, the chances of Saxonys capital city Dresden to become Eastern Germanys first high-tech-region is discussed. A presentation of the theoretical background of innovative milieux is followed by an overview of the regions universities, R&D institutes and other facilities relevant for milieu formation. Afterwards, the establishment of high-tech enterprises in the Dresden area is analyzed. The paper concludes giving a view of the regions further development potential. --

    Warpage issues in large area mould embedding technologies

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    The need for higher communications speed, heterogeneous integration and further miniaturisation have increased demand in developing new 3D integrated packaging technologies which include wafer-level moulding and chip-to-wafer interconnections . Wafer-level moulding refers to the embedding of multiple chips or heterogeneous systems on the wafer scale. This can be achieved through a relatively new technology consisting of thermal compression moulding of granular or liquid epoxy moulding compounds. Experimental measurements from compression moulding on 8” blank wafers have shown an unexpected tendency to warp into a cylindrical-shape following cooling from the moulding temperature to room temperature. Wafer warpage occurs primarily as a result of a mismatch between the coefficient of thermal expansion of the resin compound and the Si wafer. This paper will delve into possible causes of such asymmetric warpage related to mould, dimensional and material characteristics using finite element (FE) software (ANSYS Mechanical). The FE model of the resin on wafer deposition will be validated against the measurement results and will be used to deduce appropriate guidelines for low warpage wafer encapsulation.peer-reviewe

    VLSI Revisited - Revival in Japan

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    This paper describes the abundance of semiconductor consortia that have come into existence in Japan since the mid-1990s. They clearly reflect the ambition of the government - through its reorganized ministry METI and company initiatives - to regain some of the industrial and technological leadership that Japan has lost. The consortia landscape is very different in Japan compared with EU and the US. Outside Japan the universities play a much bigger and very important role. In Europe there has emerged close collaboration, among national government agencies, companies and the EU Commission in supporting the IT sector with considerable attention to semiconductor technologies. Another major difference, and possibly the most important one, is the fact that US and EU consortia include and mix partners from different areas of the semiconductor landscape including wafer makers, material suppliers, equipment producers and integrated device makers.semiconductors, Hitachi, Sony, Toshiba, Elpida, Renesas, Sematech, VLSI, JESSI, MEDEA, ASPLA, MIRAI, innovation system

    The relevance of point defects in studying silica-based materials from bulk to nanosystems

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    The macroscopic properties of silica can be modified by the presence of local microscopic modifications at the scale of the basic molecular units (point defects). Such defects can be generated during the production of glass, devices, or by the environments where the latter have to operate, impacting on the devices’ performance. For these reasons, the identification of defects, their generation processes, and the knowledge of their electrical and optical features are relevant for microelectronics and optoelectronics. The aim of this manuscript is to report some examples of how defects can be generated, how they can impact device performance, and how a defect species or a physical phenomenon that is a disadvantage in some fields can be used as an advantage in others

    VLSI REVISITED – REVIVAL IN JAPAN

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    This paper describes the abundance of semiconductor consortia that have come into existence in Japan since the mid-1990s. They clearly reflect the ambition of the government – through its reorganized ministry METI and company initiatives - to regain some of the industrial and technological leadership that Japan has lost. The consortia landscape is very different in Japan compared with EU and the US. Outside Japan the universities play a much bigger and very important role. In Europe there has emerged close collaboration, among national government agencies, companies and the EU Commission in supporting the IT sector with considerable attention to semiconductor technologies. Another major difference, and possibly the most important one, is the fact that US and EU consortia include and mix partners from different areas of the semiconductor landscape including wafer makers, material suppliers, equipment producers and integrated device makers.semiconductors; Hitachi; Sony; Toshiba; Elpida; Renesas; Sematech; VLSI; JESSI; MEDEA; ASPLA; MIRAI; innovation system

    Data production methods for harmonized patent statistics : patentee name harmonization.

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    Patent documents are one of the most comprehensive data sources on technology development. As such, they provide a unique source of information to analyze and monitor technological performance. Patent indicators are now used by companies and by policy and government agencies alike to assess technological progress on the level of regions, countries, domains, and even specific entities such as companies, universities and individual inventors. In this paper, we develop a comprehensive method to achieve harmonization of patentee names in an automated way so that analysis at the level of patentees can be facilitated. The method has been applied to an extensive set of all patentee names found for all EPO patent applications published between 1978 and 2004 and all granted USPTO patents published between 1991 and 2003. As completeness (the extent to which the name-harmonization procedure is able to capture all name variants of the same patentee ) and accuracy (the extent to which the name-harmonization procedure correctly allocates name variants to a single, harmonized patentee name ) do not go hand in hand, priority has been given to accuracy. Before discussing in detail the methodology and its effects as applied to the EPO and USPTO patentee name list, we will first clarify the difference between patentee name harmonization and legal entity identification. In addition, we will briefly expand on the methods and approaches previously developed to address the issue of patentee name harmonization, in order to shed light on our specific contribution. Finally, future refinements and extensions are discussed.Agency; Applications; EPO; USPTO; Name harmonization; Information;

    Viscoelastic effects and anomalous transient levelling exponents in thin films

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    We study theoretically the profile evolution of a thin viscoelastic film supported onto a no-slip flat substrate. Due to the nonconstant initial curvature at the free surface, there is a flow driven by Laplace pressure and mediated by viscoelasticity. In the framework of lubrication theory, we derive a thin film equation that contains local viscoelastic stress through the Maxwell model. Then, considering a sufficiently regular small perturbation of the free surface, we linearise the equation and derive its general solution. We analyse and discuss in details the behaviour of this function. We then use it to study the viscoelastic evolution of a Gaussian initial perturbation through its transient levelling exponent. For initial widths of the profile that are smaller than a characteristic length scale involving both the film thickness and the elastocapillary length, this exponent is shown to reach anomalously high values at the elastic-to-viscous transition. This prediction should in particular be observed at sufficiently short times in experiments on thin polymer films.Comment: 4 figure

    NASA guidelines on report literature

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    NASA seeks for inclusion in its Scientific and Technical Information System research reports, conference proceedings, meeting papers, monographs, and doctoral and post graduate theses which relate to the NASA mission and objectives. Topics of interest to NASA are presented

    White paper on the future of plasma science and technology in plastics and textiles

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    This is the peer reviewed version of the following article: “Uros, C., Walsh, J., Cernák, M., Labay, C., Canal, J.M., Canal, C. (2019) White paper on the future of plasma science and technology in plastics and textiles. Plasma processes and polymers, 16 1 which has been published in final form at [doi: 10.1002/ppap.201700228]. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Self-Archiving."This white paper considers the future of plasma science and technology related to the manufacturing and modifications of plastics and textiles, summarizing existing efforts and the current state‐of‐art for major topics related to plasma processing techniques. It draws on the frontier of plasma technologies in order to see beyond and identify the grand challenges which we face in the following 5–10 years. To progress and move the frontier forward, the paper highlights the major enabling technologies and topics related to the design of surfaces, coatings and materials with non‐equilibrium plasmas. The aim is to progress the field of plastics and textile production using advanced plasma processing as the key enabling technology which is environmentally friendly, cost efficient, and offers high‐speed processingPeer ReviewedPostprint (author's final draft
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