GPU devices for safety-critical systems: a survey

Graphics Processing Unit (GPU) devices and their associated software programming languages and frameworks can deliver the computing performance required to facilitate the development of next-generation high-performance safety-critical systems such as autonomous driving systems. However, the integration of complex, parallel, and computationally demanding software functions with different safety-criticality levels on GPU devices with shared hardware resources contributes to several safety certification challenges. This survey categorizes and provides an overview of research contributions that address GPU devices’ random hardware failures, systematic failures, and independence of execution.This work has been partially supported by the European Research Council with Horizon 2020 (grant agreements No. 772773 and 871465), the Spanish Ministry of Science and Innovation under grant PID2019-107255GB, the HiPEAC Network of Excellence and the Basque Government under grant KK-2019-00035. The Spanish Ministry of Economy and Competitiveness has also partially supported Leonidas Kosmidis with a Juan de la Cierva Incorporación postdoctoral fellowship (FJCI-2020- 045931-I).Peer ReviewedPostprint (author's final draft

Reliable Software for Unreliable Hardware - A Cross-Layer Approach

A novel cross-layer reliability analysis, modeling, and optimization approach is proposed in this thesis that leverages multiple layers in the system design abstraction (i.e. hardware, compiler, system software, and application program) to exploit the available reliability enhancing potential at each system layer and to exchange this information across multiple system layers

Aggressive undervolting of FPGAs : power & reliability trade-offs

In this work, we evaluate aggressive undervolting, i.e., voltage underscaling below the nominal level to reduce the energy consumption of Field Programmable Gate Arrays (FPGAs). Usually, voltage guardbands are added by chip vendors to ensure the worst-case process and environmental scenarios. Through experimenting on several FPGA architectures, we con¿rm a large voltage guardband for several FPGA components, which in turn, delivers signi¿cant power savings. However, further undervolting below the voltage guardband may cause reliability issues as the result of the circuit delay increase, and faults might start to appear. We extensively characterize the behavior of these faults in terms of the rate, location, type, as well as sensitivity to environmental temperature, primarily focusing on FPGA on-chip memories, or Block RAMs (BRAMs). Understanding this behavior can allow to deploy ef¿cient mitigation techniques, and in turn, FPGA-based designs can be improved for better energy, reliability, and performance trade-offs. Finally, as a case study, we evaluate a typical FPGA-based Neural Network (NN) accelerator when the FPGA voltage is underscaled. In consequence, the substantial NN energy savings come with the cost of NN accuracy loss. To attain power savings without NN accuracy loss below the voltage guardband gap, we proposed an application-aware technique and we also, evaluated the built-in Error-Correcting Code (ECC) mechanism. Hence, First, we developed an application-dependent BRAMs placement technique that relies on the deterministic behavior of undervolting faults, and mitigates these faults by mapping the most reliability sensitive NN parameters to BRAM blocks that are relatively more resistant to undervolting faults. Second, as a more general technique, we applied the built-in ECC of BRAMs and observed a signi¿cant fault coverage capability thanks to the behavior of undervolting faults, with a negligible power consumption overhead.En este trabajo, evaluamos el reducir el voltaje en forma agresiva, es decir, bajar la tensión por debajo del nivel nominal para reducir el consumo de energía en Field Programmable Gate Arrays (FPGA). Por lo general, los vendedores de chips establecen margen de seguridad al voltaje para garantizar el funcionamiento de los mismos en el peor de los casos y en los peores escenarios ambientales. Mediante la experimentación en varias arquitecturas FPGA, confirmamos que hay un margen de seguridad de voltaje grande en varios de los componentes de la FPGA, que a su vez, nos ofrece ahorros de energía significativos. Sin embargo, un trabajar a un voltaje por debajo del margen de seguridad del voltaje puede causar problemas de confiabilidad a medida ya que aumenta el retardo del circuito y pueden comenzar a aparecer fallos. Caracterizamos ampliamente el comportamiento de estos fallos en términos de velocidad, ubicación, tipo, así como la sensibilidad a la temperatura ambiental, centrándonos principalmente en memorias internas de la FPGA, o Block RAM (BRAM). Comprender este comportamiento puede permitir el desarrollo de técnicas eficientes de mitigación y, a su vez, mejorar los diseños basados en FPGA para obtener ahorros en energía, una mayor confiabilidad y un mayor rendimiento. Finalmente, como caso de estudio, evaluamos un acelerador típico de Redes Neuronales basado en FPGA cuando el voltaje de la FPGA esta por debajo del nivel mínimo de seguridad. En consecuencia, los considerables ahorros de energía de la red neuronal vienen asociados con la pérdida de precisión de la red neuronal. Para obtener ahorros de energía sin una pérdida de precisión en la red neuronal por debajo del margen de seguridad del voltaje, proponemos una técnica que tiene en cuenta la aplicación, asi mismo, evaluamos el mecanismo integrado en las BRAMs de Error Correction Code (ECC). Por lo tanto, en primer lugar, desarrollamos una técnica de colocación de BRAM dependiente de la aplicación que se basa en el comportamiento determinista de las fallos cuando la FPGA funciona por debajo del margen de seguridad, y se mitigan estos fallos asignando los parámetros de la red neuronal más sensibles a producir fallos a los bloques BRAM que son relativamente más resistentes a los fallos. En segundo lugar, como técnica más general, aplicamos el ECC incorporado de los BRAM y observamos una capacidad de cobertura de fallos significativo gracias a las características de comportamiento de fallos, con una sobrecoste de consumo de energía insignificantePostprint (published version

Reliability-aware and energy-efficient system level design for networks-on-chip

2015 Spring.Includes bibliographical references.With CMOS technology aggressively scaling into the ultra-deep sub-micron (UDSM) regime and application complexity growing rapidly in recent years, processors today are being driven to integrate multiple cores on a chip. Such chip multiprocessor (CMP) architectures offer unprecedented levels of computing performance for highly parallel emerging applications in the era of digital convergence. However, a major challenge facing the designers of these emerging multicore architectures is the increased likelihood of failure due to the rise in transient, permanent, and intermittent faults caused by a variety of factors that are becoming more and more prevalent with technology scaling. On-chip interconnect architectures are particularly susceptible to faults that can corrupt transmitted data or prevent it from reaching its destination. Reliability concerns in UDSM nodes have in part contributed to the shift from traditional bus-based communication fabrics to network-on-chip (NoC) architectures that provide better scalability, performance, and utilization than buses. In this thesis, to overcome potential faults in NoCs, my research began by exploring fault-tolerant routing algorithms. Under the constraint of deadlock freedom, we make use of the inherent redundancy in NoCs due to multiple paths between packet sources and sinks and propose different fault-tolerant routing schemes to achieve much better fault tolerance capabilities than possible with traditional routing schemes. The proposed schemes also use replication opportunistically to optimize the balance between energy overhead and arrival rate. As 3D integrated circuit (3D-IC) technology with wafer-to-wafer bonding has been recently proposed as a promising candidate for future CMPs, we also propose a fault-tolerant routing scheme for 3D NoCs which outperforms the existing popular routing schemes in terms of energy consumption, performance and reliability. To quantify reliability and provide different levels of intelligent protection, for the first time, we propose the network vulnerability factor (NVF) metric to characterize the vulnerability of NoC components to faults. NVF determines the probabilities that faults in NoC components manifest as errors in the final program output of the CMP system. With NVF aware partial protection for NoC components, almost 50% energy cost can be saved compared to the traditional approach of comprehensively protecting all NoC components. Lastly, we focus on the problem of fault-tolerant NoC design, that involves many NP-hard sub-problems such as core mapping, fault-tolerant routing, and fault-tolerant router configuration. We propose a novel design-time (RESYN) and a hybrid design and runtime (HEFT) synthesis framework to trade-off energy consumption and reliability in the NoC fabric at the system level for CMPs. Together, our research in fault-tolerant NoC routing, reliability modeling, and reliability aware NoC synthesis substantially enhances NoC reliability and energy-efficiency beyond what is possible with traditional approaches and state-of-the-art strategies from prior work

Techniques for Aging, Soft Errors and Temperature to Increase the Reliability of Embedded On-Chip Systems

This thesis investigates the challenge of providing an abstracted, yet sufficiently accurate reliability estimation for embedded on-chip systems. In addition, it also proposes new techniques to increase the reliability of register files within processors against aging effects and soft errors. It also introduces a novel thermal measurement setup that perspicuously captures the infrared images of modern multi-core processors

Energy-Aware Data Movement In Non-Volatile Memory Hierarchies

While technology scaling enables increased density for memory cells, the intrinsic high leakage power of conventional CMOS technology and the demand for reduced energy consumption inspires the use of emerging technology alternatives such as eDRAM and Non-Volatile Memory (NVM) including STT-MRAM, PCM, and RRAM. The utilization of emerging technology in Last Level Cache (LLC) designs which occupies a signifcant fraction of total die area in Chip Multi Processors (CMPs) introduces new dimensions of vulnerability, energy consumption, and performance delivery. To be specific, a part of this research focuses on eDRAM Bit Upset Vulnerability Factor (BUVF) to assess vulnerable portion of the eDRAM refresh cycle where the critical charge varies depending on the write voltage, storage and bit-line capacitance. This dissertation broaden the study on vulnerability assessment of LLC through investigating the impact of Process Variations (PV) on narrow resistive sensing margins in high-density NVM arrays, including on-chip cache and primary memory. Large-latency and power-hungry Sense Amplifers (SAs) have been adapted to combat PV in the past. Herein, a novel approach is proposed to leverage the PV in NVM arrays using Self-Organized Sub-bank (SOS) design. SOS engages the preferred SA alternative based on the intrinsic as-built behavior of the resistive sensing timing margin to reduce the latency and power consumption while maintaining acceptable access time. On the other hand, this dissertation investigates a novel technique to prioritize the service to 1) Extensive Read Reused Accessed blocks of the LLC that are silently dropped from higher levels of cache, and 2) the portion of the working set that may exhibit distant re-reference interval in L2. In particular, we develop a lightweight Multi-level Access History Profiler to effciently identify ERRA blocks through aggregating the LLC block addresses tagged with identical Most Signifcant Bits into a single entry. Experimental results indicate that the proposed technique can reduce the L2 read miss ratio by 51.7% on average across PARSEC and SPEC2006 workloads. In addition, this dissertation will broaden and apply advancements in theories of subspace recovery to pioneer computationally-aware in-situ operand reconstruction via the novel Logic In Interconnect (LI2) scheme. LI2 will be developed, validated, and re?ned both theoretically and experimentally to realize a radically different approach to post-Moore\u27s Law computing by leveraging low-rank matrices features offering data reconstruction instead of fetching data from main memory to reduce energy/latency cost per data movement. We propose LI2 enhancement to attain high performance delivery in the post-Moore\u27s Law era through equipping the contemporary micro-architecture design with a customized memory controller which orchestrates the memory request for fetching low-rank matrices to customized Fine Grain Reconfigurable Accelerator (FGRA) for reconstruction while the other memory requests are serviced as before. The goal of LI2 is to conquer the high latency/energy required to traverse main memory arrays in the case of LLC miss, by using in-situ construction of the requested data dealing with low-rank matrices. Thus, LI2 exchanges a high volume of data transfers with a novel lightweight reconstruction method under specific conditions using a cross-layer hardware/algorithm approach

A Framework for TSV based 3D-IC to Analyze Aging and TSV Thermo-mechanical stress on Soft Errors

The CMOS aging, transient effects, and TSV thermomechanical stress degrade the resilience of 3D-ICs. The transients effects lead to soft errors and aggravated with the CMOS Bias temperature instability (BTI). In this paper, we analyze detrimental transient and BTI effect on soft error rate (SER) in 3D-ICs. However, TSV thermomechanical stress presents a considerable benefit by enhancing the critical charge (Qc) and reduce the SER due to decrease in the threshold voltage and increase in mobility of carriers in transistor present out of keep-out-zone and useful range. Therefore we propose a framework to evaluate the effect of transient, BTI, and TSV thermomechanical stress on critical charge and SER in 3D-ICs. Subsequently, through HSPICE simulation we show that for a lifetime of ten years and on the topmost layer of stacked 3D-IC, the reduction in SER of NAND gate by 5.12% - 9.05% and in 6T SRAM 2.51% - 4.76% and 3.77% - 5.64% decrease for storing 0 and 1 respectively

Body of Knowledge for Graphics Processing Units (GPUs)

Graphics Processing Units (GPU) have emerged as a proven technology that enables high performance computing and parallel processing in a small form factor. GPUs enhance the traditional computer paradigm by permitting acceleration of complex mathematics and providing the capability to perform weighted calculations, such as those in artificial intelligence systems. Despite the performance enhancements provided by this type of microprocessor, there exist tradeoffs in regards to reliability and radiation susceptibility, which may impact mission success. This report provides an insight into GPU architecture and its potential applications in space and other similar markets. It also discusses reliability, qualification, and radiation considerations for testing GPUs

Practical Gpgpu Application Resilience Estimation And Fortification

Graphics Processing Units (GPUs) are becoming a de facto solution for accelerating a wide range of applications but remain susceptible to transient hardware faults (soft errors) that can easily compromise application output. One of the major challenges in the domain of GPU reliability is to accurately measure general purpose GPU (GPGPU) application resilience to transient faults. This challenge stems from the fact that a typical GPGPU application spawns a huge number of threads and then utilizes a large amount of potentially unreliable compute and memory resources available on the GPUs. As the number of possible fault locations can be in the billions, evaluating every fault and examining its effect on the application error resilience is impractical. Alternatively, fault site selection techniques have been proposed to approach high accuracy with less fault injection experiments. However, most of the existing methods in the literature only focus on the single-bit fault model and only one input. In this dissertation, we offer solutions to the two problems above. We extend a progressive fault site pruning technique for two multi-bit fault models: (a) multi-bit faults in the same word; (b) multiple single-bit faults in different words accessed by the same thread. We devise a methodology, SUGAR (Speeding Up GPGPU Application Resilience Estimation with input sizing), that dramatically speeds up the evaluation of application error resilience. Key of the SUGAR estimation methodology is the identification of repeating thread patterns that develop as a function of the size of the input. These patterns allow for accurate prediction of application error resilience for arbitrarily large inputs. With the presence of input-aware estimation strategies, we are able to pinpoint the vulnerabilities in a GPGPU application and propose low overhead protection techniques accordingly. Based on the variety of thread resilience in GPGPU applications, we propose a methodology that identifies the resilience of threads and aims to map threads with the same resilience characteristics to the same warp. Our technique allows engaging partial protection mechanisms at the warp level. We illustrate that threads can be remapped into reliable or unreliable warps with only minimal introduced overhead, and then selective protection via replication is applied in unreliable warps. We show how this remapping facilitates warp replication for error detection and correction and achieves a significant reduction of execution cycles, comparing to standard techniques. In addition to input-aware estimation and fortification, we present a detailed characterization comparing microarchitecture-level and software-level fault injection and show the gap of resilience estimation introduced by injecting faults into different layers in the system execution stack. We also implement a software-level redundancy protection mechanism and measure its effectiveness using microarchitecture-level and software-level fault injection