Electricity from photovoltaic solar cells: Flat-Plate Solar Array Project final report. Volume VI: Engineering sciences and reliability

The Flat-Plate Solar Array (FSA) Project, funded by the U.S. Government and managed by the Jet Propulsion Laboratory, was formed in 1975 to develop the module/array technology needed to attain widespread terrestrial use of photovoltaics by 1985. To accomplish this, the FSA Project established and managed an Industry, University, and Federal Government Team to perform the needed research and development. This volume of the series of final reports documenting the FSA Project deals with the Project's activities directed at developing the engineering technology base required to achieve modules that meet the functional, safety and reliability requirements of large-scale terrestrial photovoltaic systems applications. These activities included: (1) development of functional, safety, and reliability requirements for such applications; (2) development of the engineering analytical approaches, test techniques, and design solutions required to meet the requirements; (3) synthesis and procurement of candidate designs for test and evaluation; and (4) performance of extensive testing, evaluation, and failure analysis to define design shortfalls and, thus, areas requiring additional research and development. During the life of the FSA Project, these activities were known by and included a variety of evolving organizational titles: Design and Test, Large-Scale Procurements, Engineering, Engineering Sciences, Operations, Module Performance and Failure Analysis, and at the end of the Project, Reliability and Engineering Sciences. This volume provides both a summary of the approach and technical outcome of these activities and provides a complete Bibliography (Appendix A) of the published documentation covering the detailed accomplishments and technologies developed

Wafer level reliability for high-performance VLSI design

As very large scale integration architecture requires higher package density, reliability of these devices has approached a critical level. Previous processing techniques allowed a large window for varying reliability. However, as scaling and higher current densities push reliability to its limit, tighter control and instant feedback becomes critical. Several test structures developed to monitor reliability at the wafer level are described. For example, a test structure was developed to monitor metal integrity in seconds as opposed to weeks or months for conventional testing. Another structure monitors mobile ion contamination at critical steps in the process. Thus the reliability jeopardy can be assessed during fabrication preventing defective devices from ever being placed in the field. Most importantly, the reliability can be assessed on each wafer as opposed to an occasional sample

Flat-plate solar array project. Volume 6: Engineering sciences and reliability

The Flat-Plate Solar Array (FSA) Project activities directed at developing the engineering technology base required to achieve modules that meet the functional, safety, and reliability requirements of large scale terrestrial photovoltaic systems applications are reported. These activities included: (1) development of functional, safety, and reliability requirements for such applications; (2) development of the engineering analytical approaches, test techniques, and design solutions required to meet the requirements; (3) synthesis and procurement of candidate designs for test and evaluation; and (4) performance of extensive testing, evaluation, and failure analysis of define design shortfalls and, thus, areas requiring additional research and development. A summary of the approach and technical outcome of these activities are provided along with a complete bibliography of the published documentation covering the detailed accomplishments and technologies developed

Advanced Computer Dormant Reliability Study Final Report

Reliability of integrated circuits and discrete components of electronics for computer and dormant module for Minuteman

Saturn integrated circuit reliability test program Final report, 28 Jun. 1966 - 1 Jul. 1967

Literature survey and test program to study reliability of linear integrated circuit

Parts, materials, and processes experience summary, volume 2

This summary provides the general engineering community with the accumulated experience from ALERT reports issued by NASA and the Government-Industry. Data Exchange Program, and related experience gained by Government and industry. It provides expanded information on selected topics by relating the problem area (failure) to the cause, the investigation and findings, the suggestions for avoidance (inspections, screening tests, proper part applications, requirements for manufacturer's plant facilities, etc.), and failure analysis procedures. Diodes, integrated circuits, and transistors are covered in this volume