MODELING THE PHYSICS OF FAILURE FOR ELECTRONIC PACKAGING COMPONENTS SUBJECTED TO THERMAL AND MECHANICAL LOADING

This dissertation presents three separate studies that examined electronic components using numerical modeling approaches. The use of modeling techniques provided a deeper understanding of the physical phenomena that contribute to the formation of cracks inside ceramic capacitors, damage inside plated through holes, and to dynamic fracture of MEMS structures. The modeling yielded numerical substantiations for previously proposed theoretical explanations. Multi-Layer Ceramic Capacitors (MLCCs) mounted with stiffer lead-free solder have shown greater tolerance than tin-lead solder for single cycle board bending loads with low strain rates. In contrast, flexible terminations have greater tolerance than stiffer standard terminations under the same conditions. It has been proposed that residual stresses in the capacitor account for this disparity. These stresses have been attributed to the higher solidification temperature of lead free solders coupled with the CTE mismatch between the board and the capacitor ceramic. This research indicated that the higher solidification temperatures affected the residual stresses. Inaccuracies in predicting barrel failures of plated through holes are suspected to arise from neglecting the effects of the reflow process on the copper material. This research used thermo mechanical analysis (TMA) results to model the damage in the copper above the glass transition temperature (Tg) during reflow. Damage estimates from the hysteresis plots were used to improve failure predictions. Modeling was performed to examine the theory that brittle fracture in MEMS structures is not affected by strain rates. Numerical modeling was conducted to predict the probability of dynamic failure caused by shock loads. The models used a quasi-static global gravitational load to predict the probability of brittle fracture. The research presented in this dissertation explored drivers for failure mechanisms in flex cracking of capacitors, barrel failures in plated through holes, and dynamic fracture of MEMS. The studies used numerical modeling to provide new insights into underlying physical phenomena. In each case, theoretical explanations were examined where difficult geometries and complex material properties made it difficult or impossible to obtain direct measurements

Vibration Fatigue of Leaded Solder Joint Interconnects for PCB Electronics

With the increasing prevalence of electronic equipment worldwide, there is also a decrease in the size of the components on their printed circuit boards (PCBs), leading to an increase in the density of these components. A significant amount of failure in electronic equipment is vibration fatigue of solder joints and their attachments. However, the complexity of these PCBs and their components has made finite element modeling (FEM) more complex, adding considerable time to create and analyze a model. This paper aims to provide a literature review for the vibration fatigue of leaded solder components, create a test setup, and validate an analytical solder joint stress model. The literature review provides a walkthrough on modeling PCBs and their components using FEMs and analytical models, fatigue modeling methodology, and fatigue testing data and highlights gaps in the literature. This review was important to compile due to the limited data and the rigor required to find it all when searching. With this literature review collected, testing was to be completed using an analytical model highlighted. Therefore, a setup and procedure have been developed to test the vibration fatigue of leaded solder attachments. The setup combines a test specimen, specimen mounting head, and preliminary model correlation between the test specimen and FEM. Using initial model correlations, an analytical solder joints stress model, and fatigue curves from literature, a vibration fatigue life prediction was made for the test specimen, and tests were run. However, the results were inconclusive and further testing is deemed necessary. Suggestions have been made, such as picking other analytical models to test, modifying the test setup, and increasing the fidelity of local areas in the FEM

Development of a Rapid Fatigue Life Testing Method for Reliability Assessment of Flip-Chip Solder Interconnects

The underlying physics of failure are critical in assessing the long term reliability of power packages in their intended field applications, yet traditional reliability determination methods are largely inadequate when considering thermomechanical failures. With current reliability determination methods, long test durations, high costs, and a conglomerate of concurrent reliability degrading threat factors make effective understanding of device reliability difficult and expensive. In this work, an alternative reliability testing apparatus and associated protocol was developed to address these concerns; targeting rapid testing times with minimal cost while preserving fatigue life prediction accuracy. Two test stands were fabricated to evaluate device reliability at high frequency (60 cycles/minute) with the first being a single-directional unit capable of exerting large forces (up to 20 N) on solder interconnects in one direction. The second test stand was developed to allow for bi-directional application of stress and the integration of an oven to enable testing at elevated steady-state temperatures. Given the high frequency of testing, elevated temperatures are used to emulate the effects of creep on solder fatigue lifetime. Utilizing the mechanical force of springs to apply shear loads to solder interconnects within the devices, the reliability of a given device to withstand repeated cycling was studied using resistance monitoring techniques to detect the number of cycles-to-failure (CTF). Resistance monitoring was performed using specially designed and fabricated, device analogous test vehicles assembled with the ability to monitor circuit resistance in situ. When a resistance rise of 30 % was recorded, the device was said to have failed. A mathematical method for quantifying the plastic work density (amount of damage) sustained by the solder interconnects prior to failure was developed relying on the relationship between Hooke’s Law for springs and damage deflection to accurately assess the mechanical strength of tested devices

COMPARISON OF INTERCONNECT FAILURES OF ELECTRONIC COMPONENTS MOUNTED ON FR-4 BOARDS WITH SN37PB AND SN3.0AG0.5CU SOLDERS UNDER RAPID LOADING CONDITIONS.

Electronic circuit boards can experience rapid loading through shock or vibration events during their lives; these events can happen in transportation, manufacture, or in field conditions. Due to the lead-free migration, it is necessary to evaluate how this rapid loading affects the durability of a leading lead free solder alternative (Sn3.0Ag0.5Cu) assemblies as compared with traditional eutectic lead based solder Sn37Pb assemblies. A literature review showed that there is little agreement on the fatigue behavior of Sn37Pb solder assemblies and Sn3.0Ag0.5Cu solder assemblies subjected to rapid loading. To evaluate the failure behavior of Sn37Pb and Sn3.0Ag0.5Cu solder assemblies under rapid loading conditions, leadless chip resistors (LCR), ball grid arrays (BGA), small outline integrated circuits (SOIC), and small outline transistors (SOT) were subjected to four point bend tests via a servo-hydraulic testing machine at printed wiring board (PWB) strain rates greater than 0.1/s. The PWB strain was the metric used to evaluate the failures. The PBGAs and LCRs were examined with both Sn37Pb and Sn3.0Ag0.5Cu solders. There was no significant difference found in the resulting test data for the behavior of the two solder assembly types in the high cycle fatigue regime. PBGA assemblies with both solders were also evaluated at a higher strain rate, approximately 1/s, using drop testing. There was no discernable difference found between the assemblies as well as no difference in the failure rate of the PBGAs at this higher strain rate. The PWB strain was converted to an equivalent solder stress index using finite element analysis. This equivalent stress index value was used to compare the results from the LCR and BGA testing for Sn37Pb and Sn3.0Ag0.5Cu. Independently generated BGA data that differed with respect to many testing variables was adjusted and incorporated to this comparison. The resulting plot did not show any significant differences between the behaviors of the two solder assemblies under rapid loading outside of the ultra low cycle fatigue regime, where the assemblies with Sn37Pb solder outperformed the assemblies with SnAgCu solder

Peripheral soldering of flip chip joints on passive RFID tags

Flip chip is the main component of a RFID tag. It is used in billions each year in electronic packaging industries because of its small size, high performance and reliability as well as low cost. They are used in microprocessors, cell phones, watches and automobiles. RFID tags are applied to or incorporated into a product, animal, or person for identification and tracking using radio waves. Some tags can be read from several meters away or even beyond the line of sight of the reader. Passive RFID tags are the most common type in use that employ external power source to transmit signals. Joining chips by laser beam welding have wide advantages over other methods of joining, but they are seen limited to transparent substrates. However, connecting solder bumps with anisotropic conductive adhesives (ACA) produces majority of the joints. A high percentage of them fail in couple of months, particularly when exposed to vibration. In the present work, failure of RFID tags under dynamic loading or vibration was studied; as it was identified as one of the key issue to explore. Earlier investigators focused more on joining chip to the bump, but less on its assembly, i.e., attaching to the substrate. Either of the joints, between chip and bump or between antenna and bump can fail. However, the latter is more vulnerable to failure. Antenna is attached to substrate, relatively fixed when subjected to oscillation. It is the flip chip not the antenna moves during vibration. So, the joint with antenna suffers higher stresses. In addition to this, the strength of the bonding agent i.e., ACA also much smaller compared to the metallic bond at the other end of the bump. Natural frequency of RFID tags was calculated both analytically and numerically, found to be in kilohertz range, high enough to cause resonance. Experimental investigations were also carried out to determine the same. However, the test results for frequency were seen to be in hundred hertz range, common to some applications. It was recognized that the adhesive material, commonly used for joining chips, was primarily accountable for their failures. Since components to which the RFID tags are attached to experience low frequency vibration, chip joints fail as they face resonance during oscillation. Adhesives having much lower modulus than metals are used for attaching bumps to the substrate antennas, and thus mostly responsible for this reduction in natural frequency. Poor adhesive bonding strength at the interface and possible rise in temperature were attributed to failures under vibration. In order to overcome the early failure of RFID tag joints, Peripheral Soldering, an alternative chip joining method was devised. Peripheral Soldering would replace the traditional adhesive joining by bonding the peripheral surface of the bump to the substrate antenna. Instead of joining solder bump directly to the antenna, holes are to be drilled through antenna and substrate. S-bond material, a less familiar but more compatible with aluminum and copper, would be poured in liquid form through the holes on the chip pad. However, substrates compatible to high temperature are to be used; otherwise temperature control would be necessary to avoid damage to substrate. This S-bond would form metallic joints between chip and antenna. Having higher strength and better adhesion property, S-bond material provides better bonding capability. The strength of a chip joined by Peripheral Soldering was determined by analytical, numerical and experimental studies. Strength results were then compared to those of ACA. For a pad size of 60 micron on a 0.5 mm square chip, the new chip joints with Sbond provide an average strength of 0.233N analytically. Numerical results using finite element analysis in ANSYS 11.0 were about 1% less than the closed form solutions. Whereas, ACA connected joints show the maximum strength of 0.113N analytically and 0.1N numerically. Both the estimates indicate Peripheral Soldering is more than twice stronger than adhesive joints. Experimental investigation was carried out to find the strength attained with S-bond by joining similar surfaces as those of chip pad and antenna, but in larger scale due to limitation in facilities. Results obtained were moderated to incorporate the effect of size. Findings authenticate earlier predictions of superior strengths with S-bond. A comparison with ACA strength, extracted from previous investigations, further indicates that S-bond joints are more than 10 times stronger. Having higher bonding strength than in ACA joints, Peripheral Soldering would provide better reliability of the chip connections, i.e., RFID tags. The benefits attained would pay off complexities involved in tweaking

Influence of the microstructure on the creep behaviour of Tin-Silver-Copper solder

A common failure mode of electronic printed circuit boards (PCB’s) is the appearance of cold solder joints between the component and PCB, during product life. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of thermal expansion (CTE) of component-solder-PCB assembly. With today’s solder joint thickness decreasing and increasing working temperatures, among others, the stresses and strains due to temperature changes are growing, leading to limited fatigue life of the products. As fatigue life decreases with increasing plastic strain, creep occurrence should have significant impact, especially during thermal cycles and, thus, should be studied. Through the cooling phase, on the production of PCB assembly’s by the reflow technology, the hoven atmosphere temperature is adjusted in order to control the cooling rate. Narrow criteria is used so as to control the inter-metallic compounds (IMC) thickness, PCB assembly distortion and defects due to thermal shock. The cooling rate also affects solder microstructure, which has direct impact on creep behaviour and, thus, on the soldered joint reliability. In this paper, a dynamic mechanical analyser (DMA) is used to study the influence of the solder cooling rate on its creep behaviour. SAC405 samples with two distinct cooling rates were produced: inside a hoven cooling and by water quenching. Creep tests were made on three-point-bending clamp configuration, isothermally at 25 °C, 50 °C and 75 °C and under three separate levels of stress, 3, 5 and 9 MPa. The results show that creep behaviour has a noticeable cooling rate dependence. It was also noticed that creep propensity is exacerbated by the temperature at which stresses are applied, especially for the slower cooling rates. Creep mechanisms were related to the solder microstructural constituents, namely by the amount of phases ant their morphology.The authors would like to express his acknowledgments for the support given by the Portugal Incentive System for Research and Technological Development. Project in co-promotion This research is sponsored by the Portugal Incentive System for Research and Technological Development. This work is supported by: European Structural and Investment Funds in the FEDER component, through the Operational Competitiveness and Internationalization Programme (COMPETE 2020) [Project nº 002814; Funding Reference: POCI-01-0247-FEDER-002814]. This work was financed by FCT, under the Strategic Project UID/SEM/04077/2013; PEst2015-2020 with the reference UID/CEC/00319/2013 and UID/FIS/04650/2013

Dynamic Mechanical and Failure Properties of Solder Joints

Ph.DDOCTOR OF PHILOSOPH

Structural analysis of silicon solar arrays

Engineering mechanics in structural design of silicon solar array

Feasibility study of a 110 watt per kilogram lightweight solar array system

An investigation of the feasibility of a solar array panel subsystem which will produce 10,000 watts of electrical output at 1 A.U. with an overall beginning-of-life power-to-weight ratio of at least 110 watt/kg is reported. A description of the current baseline configuration which meets these requirements is presented. A parametric analysis of the single boom, two blanket planar solar array system was performed to arrive at the optimum system aspect ratio. A novel concept for the stiffening of a lightweight solar array by canting the solar cell blankets at a small angle to take advantage of the inherent in-plane stiffness to increase the symmetric out-of-plane frequency is introduced along with a preliminary analysis of the stiffening effect. A comparison of welded and soldered solar cell interconnections leads to the conclusion that welding is required on this ultralightweight solar array. The use of a boron/aluminum composite material in a BI-STEM type deployable boom is investigated as a possible advancement in the state-of-the-art

Joining of Dissimilar Materials

Material manufacturers and engineering structure designers are currently focusing new ways to exploit the benefits of light-weight, hybrid materials with improved properties at a low cost. The ability to join dissimilar materials is enabling the design engineers to develop light-weight and efficient automobiles, aircraft and space vehicles. The objective of this PhD research study was to produce alternative and efficient joining solutions for automotive and aerospace applications. The joining of dissimilar material was experimented to obtain light-weight Fibre Reinforced Polymer (FRP) sandwich composites, Al-foam sandwich (AFS) composites, hybrid dynamic FRP epoxy/polyurethane composites and the joining of Ti6Al4V alloy with and without surface modification to Ceramic Matrix Composite (CMC) and itself. The joining of Al-foam and Al-honeycomb to FRP skins was performed. The experimental results show that higher flexural properties can be achieved by replacing Al-honeycomb with low-cost Al-foam as a core material in the sandwich structures. Compared to FRP-honeycomb sandwich panels, FRP-Al foam sandwich panels display ~25 % and ~65 % higher flexural strength in a long and short span three-point bending tests respectively. AFS composites with complete metallic character, to withstand high-temperature application conditions, were produced by soldering/brazing techniques using Zn-based and Al-based joining alloys. A post-brazing thermal treatment was designed to recover the mechanical properties of AFS composites, lost during the soldering/brazing process. The microstructural analysis of the Al-skin/Al-foam interface revealed that the diffusion of joining materials into the joining substrates (Al-sheet and Al-foam) was achieved. Around 80% higher bending load before failure was observed when the AFS specimens produced with Zn-based joining alloys were subjected to flexural load compared to those produced with Al-based joining alloys. Hybrid dynamic Carbon Fibre Reinforced Polymer (CFRP) composites with enhanced impact properties were produced by exploiting the reversible cross-linking functionalities of dynamic epoxy and dynamic PU resin systems. By joining dynamic CFRP-epoxy and dynamic CFR-PU laminates, hybrid dynamic composite in three different configurations and a non-hybrid composite were obtained. The four dynamic composites were characterised for structural, thermal, flexural and impact properties. The damage initiation upon impact was observed at around 95% higher energy level in the hybrid configuration (CFRP-4), compared to the non-hybrid configuration. The hybrid configuration CFRP-3 responded with around 55% higher perforation threshold energy compared the non-hybrid configuration. Preliminary work on Adhesive joining of the Ti6Al4V alloy to itself was performed to analyse the effect micro-machining on adhesion and the effect of shape/design of micro-slots on an adhesive joint strength. Three types of micro-slots: V, semi-circle and U-shaped micro-slots were produced on Ti6Al4V sheet surface by using an in-house developed Micro-Electro-Discharge Machining (Micro-EDM) setup. Ti6Al4V alloy specimens with and without micro-machined surfaces were bonded together using a commercial epoxy adhesive. The Single Lap Offset (SLO) shear test results revealed that the micro-slot oriented perpendicular to the applied load displayed ~23 % higher joining strength compared to when the micro-slots were oriented parallel to the applied load. U-shaped micro-slots configuration displayed ~30 % improvement in the joint shear strength compared to the specimens with un-modified surfaces. The fractured surfaces analysis revealed mix (adhesive-cohesive) with cohesive dominated failure in bonded specimens with micro-machined surfaces compared to the as-received where pure adhesive failure was observed. The joining of CMCs (C/SiC and SiC/SiC) to Ti6Al4V alloy was experimented using active brazing alloy (Cusil-ABA) and Zr-based brazing alloy (TiB590) in a pressure-less argon atmosphere. The CMC-Ti6Al4V joint strength was further improved by modifying the surface of Ti6Al4V alloy using an in-house built Micro-EDM setup. Around 40% higher joining strength was recorded when the Zr-based brazing alloy was used as a joining material compared to the conventional active brazing alloy, Cusil-ABA. Improvement in the joining strength was noticed when the Ti6Al4V surface was modified prior to joining