A Novel Nanocomposite with Photo-Polymerization for Wafer Level Application

©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.A novel nanocomposite photo-curable material which can act both as a photoresist and a stress redistribution layer applied on the wafer level was synthesized and studied. In the experiments, 20-nm silica fillers were modified by a silane coupling agent through a hydrolysis and condensation reaction and then incorporated into the epoxy matrix. A photo-sensitive initiator was added into the formulation which can release cations after ultraviolet exposure and initiate the epoxy crosslinking reaction. The photo-crosslinking reaction of the epoxy made it a negative tone photoresist. The curing reaction of the nanocomposites was monitored by a differential scanning calorimeter with the photo-calorimetric accessory. The thermal mechanical properties of photo-cured nanocomposites thin film were also measured. It was found that the moduli change of the nanocomposites as the filler loading increasing did not follow the Mori–Tanaka model, which indicated that the nanocomposite was not a simple two-phase structure as the composite with micron size filler. The addition of nano-sized silica fillers reduced the thermal expansion and improved the stiffness of the epoxy, with only a minimal effect on the optical transparency of the epoxy, which facilitated the complete photo reaction in the epoxy

New Nanocomposite Materials with Improved Mechanical Strength and Tailored Coefficient of Thermal Expansion for Electro-Packaging Applications

In this research, copper nanocomposites reinforced by graphene nanoplatelets (GNPs) were fabricated using a wet mixing method followed by a classical powder metallurgy route. In order to find the best dispersion technique, ball milling and wet mixing were chosen. Qualitative evaluation of the structure of the graphene after mixing indicated that the wet mixing is an appropriate technique to disperse the GNPs. Thereafter, the influence of graphene content on microstructure, density, hardness, elastic modulus, and thermal expansion coefficient of composites was investigated. It was shown that by increasing the graphene content the aggregation of graphene is more obvious and, thus, these agglomerates affect the final properties adversely. In comparison with the unreinforced Cu, Cu–GNP composites were lighter, and their hardness and Young’s modulus were higher as a consequence of graphene addition. According to the microstructural observation of pure copper and its composites after sintering, it was concluded that grain refinement is the main mechanism of strengthening in this research. Apart from the mechanical characteristics, the coefficient of thermal expansion of composites decreased remarkably and the combination of this feature with appropriate mechanical properties can make them a promising candidate for use in electronic packaging applications

Development of Thermoplastic Polyurethane-Hexagonal Boron Nitride Composite Foams with Enhanced Effective Thermal Conductivity

Thermoplastic polyurethane (TPU)-hexagonal boron nitride (hBN) composites fabricated by batch foaming were studied in this study. The results of this research demonstrated that by CO2 foaming it was possible to produce TPU foams at relatively low temperatures (60C). The results indicated that the cell size and cell density range are significantly wider at lower saturation pressures to varying foaming temperatures. While TPU foams usually yield extremely high cell population density and small cell size, by applying the appropriate foaming conditions, we prepared foams with a wide range of cell sizes, from 21 to 170 m, and cell population density from 105 to 108 pore/cm3. These conditions have been used to investigate the foaming-assisted filler alignment in TPU composite and nanocomposite foams for tailoring the thermal conductivity. Foamed samples at lower saturation temperatures (i.e. 20 and 40C) yielded higher thermal conductivity than solid counterparts

Cellulosic materials as natural fillers in starch-containing matrix-based films: a review

In this work, the different cellulosic materials, namely cellulose and lignin are analyzed. In addition, the starch-containing matrices (isolated starch and flour) reinforced with cellulosic materials to be used in packaging applications are described. Many efforts have been exerted to develop biopackaging based on renewable polymers, since these could reduce the environmental impact caused by petrochemical resources. Special attention has had the starch as macromolecule for forming biodegradable packaging. For these reasons, shall also be subject of this review the effect of each type of cellulosic material on the starch-containing matrix-based thermoplastic materials. In this manner, this review contains a description of films based on starch-containing matrices and biocomposites, and then has a review of cellulosic material-based fillers. In the same way, this review contains an analysis of the works carried out on starch-containing matrices reinforced with cellulose and lignin. Finally, the manufacturing processes of starch/cellulose composites are provided as well as the conclusions and the outlook for future works.Fil: Gutiérrez Carmona, Tomy José. Universidad Central de Venezuela; Venezuela. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Mar del Plata. Instituto de Investigaciones en Ciencia y Tecnología de Materiales. Universidad Nacional de Mar del Plata. Facultad de Ingeniería. Instituto de Investigaciones en Ciencia y Tecnología de Materiales; ArgentinaFil: Alvarez, Vera Alejandra. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Mar del Plata. Instituto de Investigaciones en Ciencia y Tecnología de Materiales. Universidad Nacional de Mar del Plata. Facultad de Ingeniería. Instituto de Investigaciones en Ciencia y Tecnología de Materiales; Argentin

An Overview of Metal Matrix Nanocomposites Reinforced with Graphene Nanoplatelets; Mechanical, Electrical and Thermophysical Properties

Two-dimensional graphene nanoplatelets with unique electrical, mechanical and thermophysical characteristics are considered as an interesting reinforcement to develop new lightweight, high-strength, and high-performance metal matrix nanocomposites. On the other hand, by the rapid progress of technology in recent years, development of advanced materials like new metal matrix nanocomposites for structural engineering and functional device applications is a priority for various industries. This article provides an overview of research efforts with an emphasis on the fabrication and characterization of different metal matrix nanocomposites reinforced by graphene nanoplatelets (GNPs). Particular attention is devoted to find the role of GNPs on the final electrical and thermal conductivity, the coefficient of thermal expansion, and mechanical responses of aluminum, magnesium and copper matrix nanocomposites. In sum, this review pays specific attention to the structure-property relationship of these novel nanocomposites

Functional Materials for Thermal Management Applications

The inefficient dissipation of heat is a crucial problem that limits the reliability and performance of all electronic systems. As electronic devices get smaller and more powerful, and moving components of machinery operate at higher speeds, the need for better thermal management strategies is becoming increasingly important. Heat removal during the operation of electronic, electrochemical, and mechanical devices is facilitated by high-performance thermal interface materials (TIMs), which are utilized to couple devices to heat sinks. Herein, we report a new class of TIMs involving the chemical integration of boron nitride nanosheets (BNNS), soft organic linkers, and a metal matrix - which are prepared by chemisorption coupled electrodeposition approach. Thermal and mechanical characterization of the copper-based hybrid nanocomposites involving thiosemicarbazide demonstrates bulk thermal conductivities ranging from 211 to 277 W/(m.K), which are very high considering their relatively low elastic modulus values on the order of 15 to 30 GPa. The synergistic combination of these properties leads to the lowest measured total thermal resistivity to date for a TIM with a typical bondline thickness of 30-50 μm: 0.38 to 0.56 mm^2.K/W. Moreover, its coefficient of thermal expansion (CTE) is 11 ppm/K, forming a mediation zone with a low thermally-induced axial stress due to its close proximity to the CTE of most coupling surfaces needing thermal management. Furthermore, preliminary electrochemical tests revealed that the presence of organic ligands and BNNS in the hybrid nanocomposite TIMs improves the corrosion protection behavior of the TIMs by nearly 72%. Further analysis of the hybrid nanocomposite TIMs included the replacement of thiosemicarbazide with various organic ligands and the replacement of copper matrix with silver. Compared to all the ligands that were used in copper-based hybrid nanocomposites, the most promising thermal and mechanical test results were obtained from thiosemicarbazide. On the other hand, the best silver-based nanocomposite TIM was determined to be the one involving the ligand 2-mercapto-5-benzimidazolecarboxylic acid, in which the thermal conductivity was near 360 W/m.K, and elastic modulus and hardness were about 35 GPa and 0.25 GPa, respectively. The promising results indicate that metal-inorganic-organic nanocomposite TIMs can be great alternatives to currently used TIMs in the market. Additionally, polystannane nanocomposite involving graphene nano particles as fillers were synthesized, which showed thermal conductivities up to 40 W/m.K at 10 wt% loading. Also, these composites were found to have higher stability in ambient conditions towards humidity and light where the degradation kinetics of first order showed 10-fold decrease in rate constant. These improvements in thermal properties and stability can allow the polymeric metals in application towards thermal management

Nanocomposites Derived from Polymers and Inorganic Nanoparticles

Polymers are considered to be good hosting matrices for composite materials because they can easily be tailored to yield a variety of bulk physical properties. Moreover, organic polymers generally have long-term stability and good processability. Inorganic nanoparticles possess outstanding optical, catalytic, electronic and magnetic properties, which are significantly different their bulk states. By combining the attractive functionalities of both components, nanocomposites derived from organic polymers and inorganic nanoparticles are expected to display synergistically improved properties. The potential applications of the resultant nanocomposites are various, e.g. automotive, aerospace, opto-electronics, etc. Here, we review recent progress in polymer-based inorganic nanoparticle composites.open565

An Overview of Key Challenges in the Fabrication of Metal Matrix Nanocomposites Reinforced by Graphene Nanoplatelets

This article provides an overview of research efforts with an emphasis on the fabrication of metal matrix nanocomposites (MMNCs) reinforced by graphene nanoplatelets (GNPs). Particular attention is devoted to finding the challenges in the production of MMNCs through the powder metallurgy techniques. The main technical challenges can be listed as: (I) reinforcement selection; (II) dispersion of reinforcement within the matrix; (III) reactivity between the reinforcement and matrix; (IV) interfacial bonding; (V) preferred orientation of reinforcement. It is found that some of these difficulties can be attributed to the nature of the materials involved, while the others are related to the preparation routes. It is reported that the challenges related to the process can often be addressed by changing the production process or by using post-processing techniques. More challenging issues instead are related to the composition of the matrix and reinforcement, their reactivity and the dispersion of reinforcement. These topics still bring significant challenges to the materials scientists, and it would be worth mentioning that the fabrication of MMNCs with a uniform dispersion of reinforcement, strong interfacial bonding, without detrimental reactions and improved isotropic properties is still a puzzling issu