A Review of Micro-Contact Physics for Microelectromechanical Systems (MEMS) Metal Contact Switches

Innovations in relevant micro-contact areas are highlighted, these include, design, contact resistance modeling, contact materials, performance and reliability. For each area the basic theory and relevant innovations are explored. A brief comparison of actuation methods is provided to show why electrostatic actuation is most commonly used by radio frequency microelectromechanical systems designers. An examination of the important characteristics of the contact interface such as modeling and material choice is discussed. Micro-contact resistance models based on plastic, elastic-plastic and elastic deformations are reviewed. Much of the modeling for metal contact micro-switches centers around contact area and surface roughness. Surface roughness and its effect on contact area is stressed when considering micro-contact resistance modeling. Finite element models and various approaches for describing surface roughness are compared. Different contact materials to include gold, gold alloys, carbon nanotubes, composite gold-carbon nanotubes, ruthenium, ruthenium oxide, as well as tungsten have been shown to enhance contact performance and reliability with distinct trade offs for each. Finally, a review of physical and electrical failure modes witnessed by researchers are detailed and examined

Standalone Tensile Testing of Thin Film Materials for MEMS/NEMS Applications

The microelectronics industry has been consistently driven by the scaling roadmap, colloquially referred to as the Moore’s law. Consequently, during the past decades, integrated circuits have scaled down further. This shrinkage could have never been possible without the efficient integration and exploitation of thin film materials. Thin film materials, on the other hand, are the essential building blocks of the micro- and nano-electromechanical systems (MEMS and NEMS). Utilization of thin film materials provides a unique capability of further miniaturizing electromechanical devices in micro- and nano-scale. These devices are the main components of many sensors and actuators that perform electrical, mechanical, chemical, and biological functions. In addition to the wide application of thin film materials in micro- and nano-systems, this class of materials has been historically utilized in optical components, wear resistant coatings, protective and decorative coatings, as well as thermal barrier coatings on gas turbine blades. In some applications, thin film materials are used mainly as the load-bearing component of the device. Microelectromechanical systems (MEMS) are the example of these applications. Thin film materials carry mechanical loads in thermal actuators, switches and capacitors in RF MEMS, optical switches, micro-mirror hinges, micro-motors, and many other miniaturized devices. In these applications, one of the main criteria to choose a specific material is its ability to perform the mechanical requirements. Therefore, a clear understanding of the mechanical behavior of thin film materials is of great importance in these applications. This understanding helps better analyze the creep in thermal actuators (Tuck et al., 2005; Paryab et al., 2006), to investigate the fatigue of polysilicon (Mulhstein et al., 2001; Shrotriya et al., 2004) and metallic micro-structures (Eberl et al., 2006; Larsen et al., 2003), to scrutinize the relaxation and creep behavior of switches made of aluminum (Park et al., 2006; Modlinski et al., 2004) and gold films (Gall et al., 2004), to study the hinge memory effect (creep) in micro-mirrors (Sontheimer, 2002), and to address the wear issues in micro-motors. (van Spengen, 2003) In some other applications, the thin film material is not necessarily performing a mechanical function. However, during the fabrication process or over the normal life, the device experiences mechanical loads and hence may suffer from any of the mechanical failure issues. Examples of these cases are the thermal fatigue in IC interconnects (Gudmundson & Wikstrom, 2002), strain ratcheting in passivated films (Huang et al., 2002; He et al., 2000), the fracture and delamination of thin films on flexible substrates (Li & Suo, 2006), the fracture of porous low-k dielectrics (Tsui et al., 2005), electromigration (He et al., 2004), the chip-package-interaction (CPI) (Wang & Ho, 2005), and thin film buckling and delamination (Sridhar et al., 2001). In order to address the above-mentioned failure issues and to design a device that has mechanical integrity and material reliability, an in-depth knowledge of the mechanical behavior of thin film materials is required. This information will help engineers integrate materials and design devices that are mechanically reliable and can perform their specific functions during their life-time without any mechanical failure. In addition to the tremendous industrial and technological driving force that was mentioned earlier, there is a strong scientific motivation to study the mechanical behavior of thin film materials. The mechanical behavior of thin film structures have been known to drastically differ from their bulk counterparts. (Xiang, 2005) This discrepancy that has been referred to as the length-scale effect has been one of the main motivations in the scientific society to study the mechanical behavior of thin film materials. In order to provide fundamental mechanistic understanding of this class of materials, old problems and many of the known physical laws in materials science and mechanical engineering have to be revisited from a different and multidisciplinary prospective. These investigations will not be possible unless a concrete understanding of the mechanical behavior of thin film materials is achieved through rigorous experimental and theoretical research in this area.Natural Sciences and Engineering Research Council (NSERC) of Canad

A Nanoindentation Study of the Fatigue Properties of Al/a-Si Core-Shell Nanostructures

Nanostructure-textured surfaces can reduce friction and increase the reliability of micro- and nanoelectromechanical systems (NEMS/MEMS). For MEMS incorporating moving parts, the fatigue properties of nanostructures pose a challenge to their reliability in long-term applications. In this study, the fatigue behavior of hemispherical Al/a-Si core-shell nanostructures (CSNs), bare hemispherical Al nanodots, and a flat Al/a-Si layered thin film have been studied using nanoindentation and nano-scale dynamic mechanical analysis (nano-DMA) techniques. Fatigue testing with nano-DMA shows that the deformation resistance of CSNs persists through 5.0 × 104 loading cycles at estimated contact pressures greater than 15 GPa. When the a-Si shell is removed, as in the Al nanodots, significant nanostructure deformation results due to repeated cyclic loading. In addition, for the Al/a-Si layered thin film, which lacks the geometry and core-confinement properties of CSNs, cyclic loading results in fatigue failure of the a-Si layer. CSNs demonstrate none of the failure mechanisms exhibited by these control structures. The unique properties displayed by CSNs when subjected to fatigue testing establish their prolonged durability when implemented in micro- and nano-scale applications

Ultra Thin AlN Piezoelectric Nano-Actuators

This paper reports the first implementation of ultra thin (100 nm) Aluminum Nitride (AlN) piezoelectric layers for the fabrication of vertically deflecting nano-actuators. An average piezoelectric coefficient (d31~ 1.9 pC/N) that is comparable to its microscale counterpart has been demonstrated in nanoscale thin AlN films. Vertical deflections as large as 40 nm have been obtained in 18 μm long and 350 nm thick cantilever beams under bimorph actuation with 2 V. Furthermore, in-plane stress and stress gradients have been simultaneously controlled. Leakage current lower than 2 nA/cm2 at 1 V has been recorded and an average relative dielectric constant of approximately 9.2 (as in thicker films) has been measured. These material characteristics and preliminary actuation results make the AlN nano-films ideal candidates for the realization of nanoelectromechanical switches for low power logic applications

The Boston University Photonics Center annual report 2013-2014

This repository item contains an annual report that summarizes activities of the Boston University Photonics Center in the 2013-2014 academic year. The report provides quantitative and descriptive information regarding photonics programs in education, interdisciplinary research, business innovation, and technology development. The Boston University Photonics Center (BUPC) is an interdisciplinary hub for education, research, scholarship, innovation, and technology development associated with practical uses of light.This annual report summarizes activities of the Boston University Photonics Center in the 2013–2014 academic year.This has been a good year for the Photonics Center. In the following pages, you will see that the center’s faculty received prodigious honors and awards, generated more than 100 notable scholarly publications in the leading journals in our field, and attracted $14.5M in new research grants and contracts this year. Faculty and staff also expanded their efforts in education and training, through National Science Foundation–sponsored sites for Research Experiences for Undergraduates and for Teachers. As a community, we hosted a compelling series of distinguished invited speakers, and emphasized the theme of Innovations at the Intersections of Micro/Nanofabrication Technology, Biology, and Biomedicine at our annual Future of Light Symposium. We took a leadership role in running national workshops on emerging photonic fields, including an OSA Incubator on Controlled Light Propagation through Complex Media, and an NSF Workshop on Noninvasive Imaging of Brain Function. Highlights of our research achievements for the year include a distinctive Presidential Early Career Award for Scientists and Engineers (PECASE) for Assistant Professor Xue Han, an ambitious new DoD-sponsored grant for Multi-Scale Multi-Disciplinary Modeling of Electronic Materials led by Professor Enrico Bellotti, launch of our NIH-sponsored Center for Innovation in Point of Care Technologies for the Future of Cancer Care led by Professor Cathy Klapperich, and successful completion of the ambitious IARPA-funded contract for Next Generation Solid Immersion Microscopy for Fault Isolation in Back-Side Circuit Analysis led by Professor Bennett Goldberg. These three programs, which represent more than$20M in research funding for the University, are indicative of the breadth of Photonics Center research interests: from fundamental modeling of optoelectronic materials to practical development of cancer diagnostics, from exciting new discoveries in optogenetics for understanding brain function to the achievement of world-record resolution in semiconductor circuit microscopy. Our community welcomed an auspicious cohort of new faculty members, including a newly hired assistant professor and a newly hired professor (and Chair of the Mechanical Engineering Department). The Industry/University Cooperative Research Center—the centerpiece of our translational biophotonics program—continues to focus on advancing the health care and medical device industries, and has entered its fourth year of operation with a strong record of achievement and with the support of an enthusiastic industrial membership base