Mjerenje radne temperature IGBT-a u stvarnom vremenu

Temperature management and control are among the most critical functions in power electronic devices. Knowledge of power semiconductor’s operating temperature is important for circuit design, as well as for converter control. Virtual junction temperature measurement or estimation is not an easy task, therefore designing the appropriate circuitry for virtual junction temperature in the real operating conditions not affecting regular circuit operation is a demanding task for engineers. The proposed method enables virtual junction temperature estimation based on the real-time measurement of semiconductor’s quasi-threshold voltage using dedicated modified gate driver circuit.Upravljanje temperaturom je jedna od najkritičnijih funkcija kod učinskih poluvodičkih komponenata. Poznavanje radne temperature učinske poluvodičke sklopke vrlo je važno pri projektiranju sklopa, kao i za upravljanje učinskim pretvaračem. Mjerenje ili estimacija nadomjesne temperature silicija nije lagan zadatak, stoga je projektiranje odgovarajućeg sklopovlja za određivanje nadomjesne temperature silicija u stvarnim radnim uvjetima, koje ne utječe na normalan rad sklopa, vrlo zahtjevan inženjerski zadatak. Predložena metoda omogućava određivanje nadomjesne temperature silicija utemeljeno na mjerenju kvazi-napona praga u stvarnom vremenu pomoću posebno prilagođenog pobudnog stupnja IGBT-a

Real-time temperature estimation for power MOSFETs considering thermal ageing effects

This paper presents a novel real-time power-device temperature estimation method that monitors the power MOSFET's junction temperature shift arising from thermal aging effects and incorporates the updated electrothermal models of power modules into digital controllers. Currently, the real-time estimator is emerging as an important tool for active control of device junction temperature as well as online health monitoring for power electronic systems, but its thermal model fails to address the device's ongoing degradation. Because of a mismatch of coefficients of thermal expansion between layers of power devices, repetitive thermal cycling will cause cracks, voids, and even delamination within the device components, particularly in the solder and thermal grease layers. Consequently, the thermal resistance of power devices will increase, making it possible to use thermal resistance (and junction temperature) as key indicators for condition monitoring and control purposes. In this paper, the predicted device temperature via threshold voltage measurements is compared with the real-time estimated ones, and the difference is attributed to the aging of the device. The thermal models in digital controllers are frequently updated to correct the shift caused by thermal aging effects. Experimental results on three power MOSFETs confirm that the proposed methodologies are effective to incorporate the thermal aging effects in the power-device temperature estimator with good accuracy. The developed adaptive technologies can be applied to other power devices such as IGBTs and SiC MOSFETs, and have significant economic implications

Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters – A Review

This paper proposes a synthesis of different electrical methods used to estimate the temperature of power semiconductor devices. The following measurement methods are introduced: the voltage under low current levels, the threshold voltage, the voltage under high current levels, the gate-emitter voltage, the saturation current, and the switching times. All these methods are then compared in terms of sensitivity, linearity, accuracy, genericity, calibration needs, and possibility of characterizing the thermal impedance or the temperature during the operation of the converter. The measurement of thermo-sensitive parameters of wide bandgap semiconductors is also discussed. Chip temperature; thermo-sensitive electrical paramete

SIC BASED SOLID STATE POWER CONTROLLER

The latest generation of fighter aircraft utilizes a 270Vdc power system [1]. Such high voltage DC power systems are difficult to protect with conventional circuit breakers because the current does not automatically go to zero twice per cycle during a fault like it does in an AC power system and thus arcing of the contacts is a problem. Solid state power controllers (SSPCs) are the solid state equivalent of a circuit breaker that do not arc and which can respond more rapidly to a fault than a mechanical breaker [2]. Present SSPCs are limited to lower voltages and currents by the available power semiconductors [8,9]. This dissertation presents design and experimental results for a SSPC that utilizes SiC power JFETs for the SSPC power switch to extend SSPC capability to higher voltages and currents in a space that is smaller than what is practically achievable with a Si power switch. The research started with the thermal analysis of the SSPCs power switch, which will guide the development of a SiC JFET multi-chip power module to be fabricated by Solid State Devices Inc. (SSDI) using JFETs from SiCED and/or Semisouth LLC. Multiple multi-chip power modules will be paralleled to make the SSPC switch. Fabricated devices were evaluated thermally both statically and dynamically and electrically both statically and dynamically. In addition to the SiC module research a detailed design of the high voltage SSPC control circuit capable of operating at 200andamp;ordm;C was completed including detailed analysis, modeling and simulations, detailed schematic diagrams and detailed drawings. Finally breadboards of selected control circuits were fabricated and tested to verify simulation results. Methods for testing SiC JFET devices under transient thermal conditions unique to the SSPC application was also developed

Characterization Methodology, Modeling, and Converter Design for 600 V Enhancement-Mode GaN FETs

Gallium Nitride (GaN) power devices are an emerging technology that have only become available commercially in the past few years. This new technology enables the design of converters at higher frequencies and efficiencies than those achievable with conventional Si devices. This dissertation reviews the unique characteristics, commercial status, and design challenges that surround GaN FETs, in order to provide sufficient background to potential GaN-based converter designers.Methodology for experimentally characterizing a GaN FET was also presented, including static characterization with a curve tracer and impedance analyzer, as well as dynamic characterization in a double pulse test setup. This methodology was supplemented by additional tests to determine losses caused by Miller-induced cross talk, and the tradeoff between these losses and overlap losses was studied for one example device.Based on analysis of characterization results, a simplified model was developed to describe the overall switching behavior and some unique features of the device. The impact of the Miller effect during the turn-on transient was studied, as well as the dynamic performance of GaN at elevated temperature.Furthermore, solutions were proposed for several key design challenges in GaN-based converters. First, a driver-integrated overcurrent and short-circuit protection scheme was developed, based on the relationship between gate voltage and drain current in GaN gate injection transistors. Second, the limitations on maximum utilization of current and voltage in a GaN FET were studied, particularly the voltage overshoots following turn-on and turn-off switching transients, and the effective cooling of GaN FETs in higher power operation. A thermal design was developed for heat extraction from bottom-cooled surface-mount devices. These solutions were verified in a GaN-based full-bridge single-phase inverter

Design and Assessment of a Grid Connected Industrial Full-SiC Converter for 690 V Grids

Die Bedeutung von Leistungshalbleitern mit großem Bandabstand (Wide Band Gap, WBG) nahm in den letzten drei Jahrzehnten kontinuierlich zu. Diese Bauelemente haben das Potenzial, Silizium (Si) - Bauelemente in bestimmten Anwendungen sowie Leistungs- und Frequenzbereichen zu ersetzen. Siliziumkarbid (SiC)-Leistungshalbleiter sind die gegenwärtig am Weitesten entwickelten WBG-Leistungshalbleiter. Dank besonderer Materialeigenschaften zeichnen sich SiC-Leistungshalbleiter im Vergleich zu Si-Bauelementen durch einen geringeren spezifischen Widerstand, eine höhere Schaltgeschwindigkeit, geringere schaltverluste sowie eine höhere maximale Sperrschichttemperatur aus. Die deutlich erhöhten Herstellungskosten limitieren den Einsatz von SiC-Leistungshalbleitern auf Anwendungen, in denen die Vorteile dieser Bauelemente die höheren Kosten überkompensieren und Systemvorteile ermöglichen. Heute werden SiC-Leistungshalbleiter z.B. in Solarwechselrichtern oder in Elektrofahrzeugen verwendet. Für Stromrichter industrieller elektrischer Antriebe ist die Kosten-Nutzen-Bilanz des Einsatzes von SiC-Leistungshalbleitern gegenwärtig nicht bekannt. Diese Fragestellung motiviert diese Arbeit. Die Auslegung sowie die daraus resultierenden Vor- und Nachteile eines Stromrichters mit SiC-Leistungshalbleitern für elektrische Industrieantriebe ist der Untersuchungsgegenstand dieser Arbeit. Zu diesem Zweck wurde unter Einhaltung industrieller Auslegungskriterien ein 240 kVA SiC-basierter Stromrichterdemonstrator als aktiver Gleichrichter am dreiphasigen 690 V Niederspannungsnetz untersucht. Auf der Basis einer Stromrichterauslegung für SiC- und Si-Leistungshalbleiter wurde ein theoretischer Vergleich von Kosten, Effizienz, Größe und Gewicht durchgeführt. Die Arbeit stellt zunächst den Stand der Technik für SiC-Leistungshalbleiter dar. Anschließend wird ein geeignetes SiC-MOSFET Module für den industriellen Stromrichter ausgewählt und bezüglich des Schaltverhaltens sowie der Parallelschaltung charakterisiert. Der Auslegung des Stromrichterleistungsteils liegen industrielle Anforderungen zu Grunde. Ein realisierter Demonstrator für einen netzseitigen Stromrichter (Active Front End) ist durch eine symmetrische Parallelschaltung von zwei SiC-Modulen, geeignete Ansteuerschaltungen (Gate Drive Units), eine niedrige Streuinduktivität im Kommutierungskreis sowie ein LCL-Filter mit Standard-Kernmaterialien gekennzeichnet. Der Stromrichtervergleich zeigt, dass der betrachtete Stromrichter mit SiC-Leistungshalbleitern im gesamten Betriebsbereich geringere Verluste verursacht als ein vergleichbarer Stromrichter mit Si-Leistungshalbleitern. Der SiC - basierte Stromichter ermöglicht auch eine deutliche Gewichtsreduktion bei ca. 89% der Systemkosten. Somit stellen SiC-Leistungshalbleiter eine attraktive technische Lösung für die untersuchte Anwendung eines aktiven Gleichrichters für industrielle elektrische Antriebe dar.Wide bandgap (WBG) power semiconductors have drawn steadily increasing interest in power electronics in the last three decades. These devices have shown the potential of replacing silicon as the default semiconductor solution for several applications in determined power and frequency ranges. Among them the most mature WBG semiconductor material is silicon carbide (SiC), which presents several characteristics at the crystal level that translate in the potential of presenting lower resistivity, be able to switch faster with lower switching loss, and present both higher characteristics to tolerate and dissipate heat when com pared with silicon. However, the same characteristics that make it great also present a different set of drawbacks to be considered, which aligned with its increased cost make it challenging to assess if its advantages are justified for a particular application. Applications that highly value efficiency and/or power density are the most benefited, and converter solutions featuring the technology have already breached into these application markets. However in other applica tions, the line from which silicon carbide starts making sense in the cost/benefits/drawbacks balance is not clear. This is typically the case of industrial applications, which were the main focus and motivation of this work. Hence, in this work the main goal has been to determine the basic characteristics, advantages and limitations that SiC technology designs for industrial low voltage high power grid connected converters present. To that end, a 690 V, 240 kVA SiC-based grid-tied converter demonstrator following industrial design criteria has been developed. Then, based on this design procedure a theoretical comparison between a 690 V, 190 kVA SiC-based converter against a silicon-based converter designed for the same power output has been performed to compare them regarding cost, efficiency, size and weight. This work also comprises a thorough revision of the state of art of SiC devices, which led to the selection of the switching device. Additionally, a characterization of both single and parallel-connected operation of the semiconductor modules was performed, to determine the module characteristics and its suitability to build the SiC converter demonstrator. Results show that the converter demonstrator operates as designed, proving that is possible with the corresponding precautions to achieve: a low inductive power loop, balanced parallel connection of SiC modules, adequate driving circuits for the parallel-connected modules and an adequate filtering solution in compliance with grid-codes based on standard core materials for the selected switching frequency. Finally, the theoretical comparison between the two designed power converters shows that, attained to the conditions of the comparison, the SiC converter solution presents efficiency gains over the whole operating range, while presenting substantial weight savings at 89% of the costs of the Si-IGBT design, presenting itself as the cost-effective solution for the presented application requirements under the given design constraints