The Development of Novel Interconnection Technologies for 3D Packaging of Wire Bondless Silicon Carbide Power Modules

This dissertation advances the cause for the 3D packaging and integration of silicon carbide power modules. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power packaging. Current efforts pursuing 3D wire bondless SiC power modules were investigated, and the concept for a novel SiC power module was discussed. This highly-integrated SiC power module was assessed for feasibility, with a focus on achieving ultralow parasitic inductances in the critical switching loops. This will enable higher switching frequencies, leading to a reduction in the size of the passive devices in the system and resulting in systems with lower weight and volume. The proposed concept yielded an order-of-magnitude reduction in system parasitics, alongside the possibility of a compact system integration. The technological barriers to realizing these concepts were identified, and solutions for novel interconnection schemes were proposed and evaluated. A novel sintered silver preform was developed to facilitate flip-chip interconnections for a bare-die power device while operating in a high ambient temperature. The preform was demonstrated to have 3.75× more bonding strength than a conventional sintered silver bond and passed rigorous thermal shock tests. A chip-scale and flip-chip capable power device was also developed. The novel package combined the ease of assembly of a discrete device with a performance exceeding a wire bonded module. It occupied a 14× smaller footprint than a discrete device, and offered power loop inductances which were less than a third of a conventional wire bonded module. A detailed manufacturing process flow and qualification is included in this dissertation. These novel devices were implemented in various electrical systems—a discrete Schottky barrier diode package, a half-bridge module with external gate drive, and finally a half-bridge with integrated gate driver in-module. The results of these investigations have been reported and their benefits assessed. The wire bondless modules showed \u3c 5% overshoot under all test conditions. No observable detrimental effects due to dv/dt were observed for any of the modules even under aggressive voltage slew rates of 20-25 V/ns

1-D broadside-radiating leaky-wave antenna based on a numerically synthesized impedance surface

A newly-developed deterministic numerical technique for the automated design of metasurface antennas is applied here for the first time to the design of a 1-D printed Leaky-Wave Antenna (LWA) for broadside radiation. The surface impedance synthesis process does not require any a priori knowledge on the impedance pattern, and starts from a mask constraint on the desired far-field and practical bounds on the unit cell impedance values. The designed reactance surface for broadside radiation exhibits a non conventional patterning; this highlights the merit of using an automated design process for a design well known to be challenging for analytical methods. The antenna is physically implemented with an array of metal strips with varying gap widths and simulation results show very good agreement with the predicted performance

Beam scanning by liquid-crystal biasing in a modified SIW structure

A fixed-frequency beam-scanning 1D antenna based on Liquid Crystals (LCs) is designed for application in 2D scanning with lateral alignment. The 2D array environment imposes full decoupling of adjacent 1D antennas, which often conflicts with the LC requirement of DC biasing: the proposed design accommodates both. The LC medium is placed inside a Substrate Integrated Waveguide (SIW) modified to work as a Groove Gap Waveguide, with radiating slots etched on the upper broad wall, that radiates as a Leaky-Wave Antenna (LWA). This allows effective application of the DC bias voltage needed for tuning the LCs. At the same time, the RF field remains laterally confined, enabling the possibility to lay several antennas in parallel and achieve 2D beam scanning. The design is validated by simulation employing the actual properties of a commercial LC medium