3,850 research outputs found

    Cost Model-Driven Test Resource Partitioning for SoCs

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    The increasing complexity of modern SoCs and quality expectations are making the cost of test represent an significant fraction of the manufacturing cost. The main factors contributing to the cost of test are the required number of tester pins, the test application time, the tester memory requirements and the area overhead required by the test resources. These factors contribute with different weights, depending on the cost model of each product. Several methods have been proposed to optimize each of these factors, however none of them allows an objective function derived from the actual cost model of each product. In this paper, we propose a cost model-driven test resource allocation and scheduling method that minimizes the cost of test

    DeSyRe: on-Demand System Reliability

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    The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints

    Test exploration and validation using transaction level models

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    The complexity of the test infrastructure and test strategies in systems-on-chip approaches the complexity of the functional design space. This paper presents test design space exploration and validation of test strategies and schedules using transaction level models (TLMs). Since many aspects of testing involve the transfer of a significant amount of test stimuli and responses, the communication-centric view of TLMs suits this purpose exceptionally wel

    IEEE Standard 1500 Compliance Verification for Embedded Cores

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    Core-based design and reuse are the two key elements for an efficient system-on-chip (SoC) development. Unfortunately, they also introduce new challenges in SoC testing, such as core test reuse and the need of a common test infrastructure working with cores originating from different vendors. The IEEE 1500 Standard for Embedded Core Testing addresses these issues by proposing a flexible hardware test wrapper architecture for embedded cores, together with a core test language (CTL) used to describe the implemented wrapper functionalities. Several intellectual property providers have already announced IEEE Standard 1500 compliance in both existing and future design blocks. In this paper, we address the problem of guaranteeing the compliance of a wrapper architecture and its CTL description to the IEEE Standard 1500. This step is mandatory to fully trust the wrapper functionalities in applying the test sequences to the core. We present a systematic methodology to build a verification framework for IEEE Standard 1500 compliant cores, allowing core providers and/or integrators to verify the compliance of their products (sold or purchased) to the standar

    Securing the Participation of Safety-Critical SCADA Systems in the Industrial Internet of Things

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    In the past, industrial control systems were ‘air gapped’ and isolated from more conventional networks. They used specialist protocols, such as Modbus, that are very different from TCP/IP. Individual devices used proprietary operating systems rather than the more familiar Linux or Windows. However, things are changing. There is a move for greater connectivity – for instance so that higher-level enterprise management systems can exchange information that helps optimise production processes. At the same time, industrial systems have been influenced by concepts from the Internet of Things; where the information derived from sensors and actuators in domestic and industrial components can be addressed through network interfaces. This paper identifies a range of cyber security and safety concerns that arise from these developments. The closing sections introduce potential solutions and identify areas for future research

    E-QED: Electrical Bug Localization During Post-Silicon Validation Enabled by Quick Error Detection and Formal Methods

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    During post-silicon validation, manufactured integrated circuits are extensively tested in actual system environments to detect design bugs. Bug localization involves identification of a bug trace (a sequence of inputs that activates and detects the bug) and a hardware design block where the bug is located. Existing bug localization practices during post-silicon validation are mostly manual and ad hoc, and, hence, extremely expensive and time consuming. This is particularly true for subtle electrical bugs caused by unexpected interactions between a design and its electrical state. We present E-QED, a new approach that automatically localizes electrical bugs during post-silicon validation. Our results on the OpenSPARC T2, an open-source 500-million-transistor multicore chip design, demonstrate the effectiveness and practicality of E-QED: starting with a failed post-silicon test, in a few hours (9 hours on average) we can automatically narrow the location of the bug to (the fan-in logic cone of) a handful of candidate flip-flops (18 flip-flops on average for a design with ~ 1 Million flip-flops) and also obtain the corresponding bug trace. The area impact of E-QED is ~2.5%. In contrast, deter-mining this same information might take weeks (or even months) of mostly manual work using traditional approaches
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