Extending systems-on-chip to the third dimension : performance, cost and technological tradeoffs.

Because of the today's market demand for high-performance, high-density portable hand-held applications, electronic system design technology has shifted the focus from 2-D planar SoC single-chip solutions to different alternative options as tiled silicon and single-level embedded modules as well as 3-D integration. Among the various choices, finding an optimal solution for system implementation dealt usually with cost, performance and other technological trade-off analysis at the system conceptual level. It has been identified that the decisions made within the first 20% of the total design cycle time will ultimately result up to 80% of the final product cost. In this paper, we discuss appropriate and realistic metric for performance and cost trade-off analysis both at system conceptual level (up-front in the design phase) and at implementation phase for verification in the three-dimensional integration. In order to validate the methodology, two ubiquitous electronic systems are analyzed under various implementation schemes and discuss the pros and cons of each of them

DFT and BIST of a multichip module for high-energy physics experiments

Engineers at Politecnico di Torino designed a multichip module for high-energy physics experiments conducted on the Large Hadron Collider. An array of these MCMs handles multichannel data acquisition and signal processing. Testing the MCM from board to die level required a combination of DFT strategie

Two- and Three-dimensional High Performance, Patterned Overlay Multi-chip Module Technology

A two- and three-dimensional multi-chip module technology was developed in response to the continuum in demand for increased performance in electronic systems, as well as the desire to reduce the size, weight, and power of space systems. Though developed to satisfy the needs of military programs, such as the Strategic Defense Initiative Organization, the technology, referred to as High Density Interconnect, can also be advantageously exploited for a wide variety of commercial applications, ranging from computer workstations to instrumentation and microwave telecommunications. The robustness of the technology, as well as its high performance, make this generality in application possible. More encouraging is the possibility of this technology for achieving low cost through high volume usage

SR-4000 and CamCube3.0 Time of Flight (ToF) Cameras: Tests and Comparison

In this paper experimental comparisons between two Time-of-Flight (ToF) cameras are reported in order to test their performance and to give some procedures for testing data delivered by this kind of technology. In particular, the SR-4000 camera by Mesa Imaging AG and the CamCube3.0 by PMD Technologies have been evaluated since they have good performances and are well known to researchers dealing with Time-of- Flight (ToF) cameras. After a brief overview of commercial ToF cameras available on the market and the main specifications of the tested devices, two topics are presented in this paper. First, the influence of camera warm-up on distance measurement is analyzed: a warm-up of 40 minutes is suggested to obtain the measurement stability, especially in the case of the CamCube3.0 camera, that exhibits distance measurement variations of several centimeters. Secondly, the variation of distance measurement precision variation over integration time is presented: distance measurement precisions of some millimeters are obtained in both cases. Finally, a comparison between the two cameras based on the experiments and some information about future work on evaluation of sunlight influence on distance measurements are reporte