A Low-Power Sigma-Delta Modulator for Healthcare and Medical Diagnostic Applications

This paper presents a switched-capacitor Sigma-Delta modulator designed in 90-nm CMOS technology, operating at 1.2-V supply voltage. The modulator targets healthcare and medical diagnostic applications where the readout of small-bandwidth signals is required. The design of the proposed A/D converter was optimized to achieve the minimum power consumption and area. A remarkable performance improvement is obtained through the integration of a low-noise amplifier with modified Miller compensation and rail-to-rail output stage. The manuscript also presents a set of design equations, from the small-signal analysis of the amplifier, for an easy design of the modulator in different technology nodes. The Sigma-Delta converter achieves a measured 96-dB dynamic range, over a 250-Hz signal bandwidth, with an oversampling ratio of 500. The power consumption is 30 μW, with a silicon area of 0.39 mm²

Doctor of Philosophy

dissertationAdvancements in process technology and circuit techniques have enabled the creation of small chemical microsystems for use in a wide variety of biomedical and sensing applications. For applications requiring a small microsystem, many components can be integrated onto a single chip. This dissertation presents many low-power circuits, digital and analog, integrated onto a single chip called the Utah Microcontroller. To guide the design decisions for each of these components, two specific microsystems have been selected as target applications: a Smart Intravaginal Ring (S-IVR) and an NO releasing catheter. Both of these applications share the challenging requirements of integrating a large variety of low-power mixed-signal circuitry onto a single chip. These applications represent the requirements of a broad variety of small low-power sensing systems. In the course of the development of the Utah Microcontroller, several unique and significant contributions were made. A central component of the Utah Microcontroller is the WIMS Microprocessor, which incorporates a low-power feature called a scratchpad memory. For the first time, an analysis of scaling trends projected that scratchpad memories will continue to save power for the foreseeable future. This conclusion was bolstered by measured data from a fabricated microcontroller. In a 32 nm version of the WIMS Microprocessor, the scratchpad memory is projected to save ~10-30% of memory access energy depending upon the characteristics of the embedded program. Close examination of application requirements informed the design of an analog-to-digital converter, and a unique single-opamp buffered charge scaling DAC was developed to minimize power consumption. The opamp was designed to simultaneously meet the varied demands of many chip components to maximize circuit reuse. Each of these components are functional, have been integrated, fabricated, and tested. This dissertation successfully demonstrates that the needs of emerging small low-power microsystems can be met in advanced process nodes with the incorporation of low-power circuit techniques and design choices driven by application requirements

A VCO-based CMOS readout circuit for capacitive MEMS microphones

Microelectromechanical systems (MEMS) microphone sensors have significantly improved in the past years, while the readout electronic is mainly implemented using switched-capacitor technology. The development of new battery powered 'always-on” applications increasingly requires a low power consumption. In this paper, we show a new readout circuit approach which is based on a mostly digital Sigma Delta (SigmaDelta) analog-to-digital converter (ADC). The operating principle of the readout circuit consists of coupling the MEMS sensor to an impedance converter that modulates the frequency of a stacked-ring oscillator—a new voltage-controlled oscillator (VCO) circuit featuring a good trade-off between phase noise and power consumption. The frequency coded signal is then sampled and converted into a noise-shaped digital sequence by a time-to-digital converter (TDC). A time-efficient design methodology has been used to optimize the sensitivity of the oscillator combined with the phase noise induced by 1/𝑓 and thermal noise. The circuit has been prototyped in a 130 nm CMOS process and directly bonded to a standard MEMS microphone. The proposed VCO-based analog-to-digital converter (VCO-ADC) has been characterized electrically and acoustically. The peak signal-to-noise and distortion ratio (SNDR) obtained from measurements is 77.9 dB-A and the dynamic range (DR) is 100 dB-A. The current consumption is 750 muA at 1.8 V and the effective area is 0.12 mm2. This new readout circuit may represent an enabling advance for low-cost digital MEMS microphones.This research was funded by project TEC2017-82653-R of CICYT, Spain

A review of advances in pixel detectors for experiments with high rate and radiation

The Large Hadron Collider (LHC) experiments ATLAS and CMS have established hybrid pixel detectors as the instrument of choice for particle tracking and vertexing in high rate and radiation environments, as they operate close to the LHC interaction points. With the High Luminosity-LHC upgrade now in sight, for which the tracking detectors will be completely replaced, new generations of pixel detectors are being devised. They have to address enormous challenges in terms of data throughput and radiation levels, ionizing and non-ionizing, that harm the sensing and readout parts of pixel detectors alike. Advances in microelectronics and microprocessing technologies now enable large scale detector designs with unprecedented performance in measurement precision (space and time), radiation hard sensors and readout chips, hybridization techniques, lightweight supports, and fully monolithic approaches to meet these challenges. This paper reviews the world-wide effort on these developments.Comment: 84 pages with 46 figures. Review article.For submission to Rep. Prog. Phy

RF MEMS reference oscillators platform for wireless communications

A complete platform for RF MEMS reference oscillator is built to replace bulky quartz from mobile devices, thus reducing size and cost. The design targets LTE transceivers. A low phase noise 76.8 MHz reference oscillator is designed using material temperature compensated AlN-on-silicon resonator. The thesis proposes a system combining piezoelectric resonator with low loading CMOS cross coupled series resonance oscillator to reach state-of-the-art LTE phase noise specifications. The designed resonator is a two port fundamental width extensional mode resonator. The resonator characterized by high unloaded quality factor in vacuum is designed with low temperature coefficient of frequency (TCF) using as compensation material which enhances the TCF from - 3000 ppm to 105 ppm across temperature ranges of -40˚C to 85˚C. By using a series resonant CMOS oscillator, phase noise of -123 dBc/Hz at 1 kHz, and -162 dBc/Hz at 1MHz offset is achieved. The oscillator’s integrated RMS jitter is 106 fs (10 kHz–20 MHz), consuming 850 μA, with startup time is 250μs, achieving a Figure-of-merit (FOM) of 216 dB. Electronic frequency compensation is presented to further enhance the frequency stability of the oscillator. Initial frequency offset of 8000 ppm and temperature drift errors are combined and further addressed electronically. A simple digital compensation circuitry generates a compensation word as an input to 21 bit MASH 1 -1-1 sigma delta modulator incorporated in RF LTE fractional N-PLL for frequency compensation. Temperature is sensed using low power BJT band-gap front end circuitry with 12 bit temperature to digital converter characterized by a resolution of 0.075˚C. The smart temperature sensor consumes only 4.6 μA. 700 MHz band LTE signal proved to have the stringent phase noise and frequency resolution specifications among all LTE bands. For this band, the achieved jitter value is 1.29 ps and the output frequency stability is 0.5 ppm over temperature ranges from -40˚C to 85˚C. The system is built on 32nm CMOS technology using 1.8V IO device

Interface Circuits for Microsensor Integrated Systems

ca. 200 words; this text will present the book in all promotional forms (e.g. flyers). Please describe the book in straightforward and consumer-friendly terms. [Recent advances in sensing technologies, especially those for Microsensor Integrated Systems, have led to several new commercial applications. Among these, low voltage and low power circuit architectures have gained growing attention, being suitable for portable long battery life devices. The aim is to improve the performances of actual interface circuits and systems, both in terms of voltage mode and current mode, in order to overcome the potential problems due to technology scaling and different technology integrations. Related problems, especially those concerning parasitics, lead to a severe interface design attention, especially concerning the analog front-end and novel and smart architecture must be explored and tested, both at simulation and prototype level. Moreover, the growing demand for autonomous systems gets even harder the interface design due to the need of energy-aware cost-effective circuit interfaces integrating, where possible, energy harvesting solutions. The objective of this Special Issue is to explore the potential solutions to overcome actual limitations in sensor interface circuits and systems, especially those for low voltage and low power Microsensor Integrated Systems. The present Special Issue aims to present and highlight the advances and the latest novel and emergent results on this topic, showing best practices, implementations and applications. The Guest Editors invite to submit original research contributions dealing with sensor interfacing related to this specific topic. Additionally, application oriented and review papers are encouraged.

Delta-Sigma Modulator based Compact Sensor Signal Acquisition Front-end System

The proposed delta-sigma modulator ($\Delta\Sigma$M) based signal acquisition architecture uses a differential difference amplifier (DDA) customized for dual purpose roles, namely as instrumentation amplifier and as integrator of $\Delta\Sigma$M. The DDA also provides balanced high input impedance for signal from sensors. Further, programmable input amplification is obtained by adjustment of $\Delta\Sigma$M feedback voltage. Implementation of other functionalities, such as filtering and digitization have also been incorporated. At circuit level, a difference of transconductance of DDA input pairs has been proposed to reduce the effect of input resistor thermal noise of front-end R-C integrator of the $\Delta\Sigma$M. Besides, chopping has been used for minimizing effect of Flicker noise. The resulting architecture is an aggregation of functions of entire signal acquisition system within the single block of $\Delta\Sigma$M, and is useful for a multitude of dc-to-medium frequency sensing and similar applications that require high precision at reduced size and power. An implementation of this in 0.18-$\mu$m CMOS process has been presented, yielding a simulated peak signal-to-noise ratio of 80 dB and dynamic range of 109dBFS in an input signal band of 1 kHz while consuming 100 $\mu$W of power; with the measured signal-to-noise ratio being lower by about 9 dB.Comment: 13 pages, 16 figure