Semi-empirical model of MOST and passive devices focused on narrowband RF blocks

This paper presents a semi-empirical modeling of MOST and passive elements to be used in narrowband radiofrequency blocks for nanometer technologies. This model is based on a small set of look-up tables (LUTs) obtained via electrical simulations. The MOST description is valid for all-inversion regions of MOST and the data is extracted as function of the gm=ID characteristic; for the passive devices the LUTs include a simplified model of the element and its principal parasitic at the working frequency f0. These semi-empirical models are validated by designing a set of 2.4-GHz LNAs and 2.4-GHz and 5-GHz VCOs in three different MOST inversion regions

A wideband noise-canceling CMOS LNA exploiting a transformer

A broadband LNA incorporating single-ended to differential conversion, has been successfully implemented using a noise-canceling technique and a single on-chip transformer. The LNA achieves a high voltage gain of 19dB, a wideband input match (2.5-4.0 GHz), and a noise figure of 4-5.4 dB, while consuming only 8mW. The LNA is implemented in a 90nm CMOS process with 6 metal layers

Analog/RF Circuit Design Techniques for Nanometerscale IC Technologies

CMOS evolution introduces several problems in analog design. Gate-leakage mismatch exceeds conventional matching tolerances requiring active cancellation techniques or alternative architectures. One strategy to deal with the use of lower supply voltages is to operate critical parts at higher supply voltages, by exploiting combinations of thin- and thick-oxide transistors. Alternatively, low voltage circuit techniques are successfully developed. In order to benefit from nanometer scale CMOS technology, more functionality is shifted to the digital domain, including parts of the RF circuits. At the same time, analog control for digital and digital control for analog emerges to deal with current and upcoming imperfections

Novel CCII-based Field Programmable Analog Array and its Application to a Sixth-Order Butterworth LPF

In this paper, a field programmable analog array (FPAA) is proposed. The proposed FPAA consists of seven configurable analog blocks (CABs) arranged in a hexagonal lattice such that the CABs are directly connected to each other. This structure improves the overall frequency response of the chip by decreasing the parasitic capacitances in the signal path. The CABS of the FPAA is based on a novel fully differential digitally programmable current conveyor (DPCCII). The programmability of the DPCCII is achieved using digitally controlled three-bit MOS ladder current division network. No extra biasing circuit is required to generate specific analog control voltage signals. The DPCCII has constant standby power consumption, offset voltage, bandwidth and harmonic distortions over all its programming range. A sixth-order Butterworth tunable LPF suitable for WLAN/WiMAX receivers is realized on the proposed FPAA. The filter power consumption is 5.4mW from 1V supply; it’s cutoff frequency is tuned from 5.2 MHz to 16.9 MHz. All the circuits are realized using 90nm CMOS technology from TSMC. All simulations are carried out using Cadence

UTB SOI SRAM cell stability under the influence of intrinsic parameter fluctuation

Intrinsic parameter fluctuations steadily increases with CMOS technology scaling. Around the 90nm technology node, such fluctuations will eliminate much of the available noise margin in SRAM based on conventional MOSFETs. Ultra thin body (UTB) SOI MOSFETs are expected to replace conventional MOSFETs for integrated memory applications due to superior electrostatic integrity and better resistant to some of the sources of intrinsic parameter fluctuations. To fully realise the performance benefits of UTB SOI based SRAM cells a statistical circuit simulation methodology which can fully capture intrinsic parameter fluctuation information into the compact model is developed. The impact on 6T SRAM static noise margin characteristics of discrete random dopants in the source/drain regions and body-thickness variations has been investigated for well scaled devices with physical channel length in the range of 10nm to 5nm. A comparison with the behaviour of a 6T SRAM based on a conventional 35nm MOSFET is also presented

Impact of parameter variations on circuits and microarchitecture

Parameter variations, which are increasing along with advances in process technologies, affect both timing and power. Variability must be considered at both the circuit and microarchitectural design levels to keep pace with performance scaling and to keep power consumption within reasonable limits. This article presents an overview of the main sources of variability and surveys variation-tolerant circuit and microarchitectural approaches.Peer ReviewedPostprint (published version