The Fifth NASA Symposium on VLSI Design

The fifth annual NASA Symposium on VLSI Design had 13 sessions including Radiation Effects, Architectures, Mixed Signal, Design Techniques, Fault Testing, Synthesis, Signal Processing, and other Featured Presentations. The symposium provides insights into developments in VLSI and digital systems which can be used to increase data systems performance. The presentations share insights into next generation advances that will serve as a basis for future VLSI design

High-speed and Robust Integrated Silicon Nanophotonics for On-Chip Interconnects

Optical interconnects offer advantages over electrical interconnects such as higher bandwidth, low power, reduced interconnects delay, and immunity to electro-magnetic interference and signal crosstalk. However, in order for optical interconnects to be widely adopted, the technology must be made cost effective and must be simple to implement with CMOS electronics. Silicon photonics offers a great promise due to its inexpensive material and its compatibility with the current CMOS fabrication technology. Moreover, Silicon as a platform has the ability to integrate with different types of the optical components such as photodetector, modulator, light source, and waveguide to form a photonics integrated circuit. The goal of this work is to develop and fabricate devices that utilize a hybrid electronic-photonic integration to enable high performance optoelectronic computing and communication systems that overcome the barriers of electronics and dramatically enhance the performance of circuits and systems. We experimentally demonstrate a novel broadband optical time division multiplexer (OTDM) on a silicon chip. The system has a footprint× 700 micrometer and is inherently broadband with a bandwidth of over 100nm making it suitable for high-speed optical networks on chip. Also, we propose and fabricate a novel design to demultiplex the high bit rates of OTDM data using two differentially operated 5Gb/s modulators. Moreover, we propose a high-speed hybrid optical-time-division-multiplexing (OTDM) and wavelength-division-multiplexing (WDM) system that seamlessly generates high bit-rate data (\u3e200Gbit/s) from a low speed (5Gbit/s) quantum-dot mode locked laser pulse source. By utilizing time and wavelength domains, the proposed design is a promising solution for high-speed, compact and low-power consumption optical networks on chip. And finally, we experimentally demonstrate a robust, low insertion loss, compact Silicon ring resonator electro-optic modulator for Binary Phase Shift Key (BPSK) coding/decoding that encodes data in the phase of light. Our design improves significantly over recently demonstrated PSK modulator designs in terms of insertion loss and stability

Approximate and timing-speculative hardware design for high-performance and energy-efficient video processing

Since the end of transistor scaling in 2-D appeared on the horizon, innovative circuit design paradigms have been on the rise to go beyond the well-established and ultraconservative exact computing. Many compute-intensive applications – such as video processing – exhibit an intrinsic error resilience and do not necessarily require perfect accuracy in their numerical operations. Approximate computing (AxC) is emerging as a design alternative to improve the performance and energy-efficiency requirements for many applications by trading its intrinsic error tolerance with algorithm and circuit efficiency. Exact computing also imposes a worst-case timing to the conventional design of hardware accelerators to ensure reliability, leading to an efficiency loss. Conversely, the timing-speculative (TS) hardware design paradigm allows increasing the frequency or decreasing the voltage beyond the limits determined by static timing analysis (STA), thereby narrowing pessimistic safety margins that conventional design methods implement to prevent hardware timing errors. Timing errors should be evaluated by an accurate gate-level simulation, but a significant gap remains: How these timing errors propagate from the underlying hardware all the way up to the entire algorithm behavior, where they just may degrade the performance and quality of service of the application at stake? This thesis tackles this issue by developing and demonstrating a cross-layer framework capable of performing investigations of both AxC (i.e., from approximate arithmetic operators, approximate synthesis, gate-level pruning) and TS hardware design (i.e., from voltage over-scaling, frequency over-clocking, temperature rising, and device aging). The cross-layer framework can simulate both timing errors and logic errors at the gate-level by crossing them dynamically, linking the hardware result with the algorithm-level, and vice versa during the evolution of the application’s runtime. Existing frameworks perform investigations of AxC and TS techniques at circuit-level (i.e., at the output of the accelerator) agnostic to the ultimate impact at the application level (i.e., where the impact is truly manifested), leading to less optimization. Unlike state of the art, the framework proposed offers a holistic approach to assessing the tradeoff of AxC and TS techniques at the application-level. This framework maximizes energy efficiency and performance by identifying the maximum approximation levels at the application level to fulfill the required good enough quality. This thesis evaluates the framework with an 8-way SAD (Sum of Absolute Differences) hardware accelerator operating into an HEVC encoder as a case study. Application-level results showed that the SAD based on the approximate adders achieve savings of up to 45% of energy/operation with an increase of only 1.9% in BD-BR. On the other hand, VOS (Voltage Over-Scaling) applied to the SAD generates savings of up to 16.5% in energy/operation with around 6% of increase in BD-BR. The framework also reveals that the boost of about 6.96% (at 50°) to 17.41% (at 75° with 10- Y aging) in the maximum clock frequency achieved with TS hardware design is totally lost by the processing overhead from 8.06% to 46.96% when choosing an unreliable algorithm to the blocking match algorithm (BMA). We also show that the overhead can be avoided by adopting a reliable BMA. This thesis also shows approximate DTT (Discrete Tchebichef Transform) hardware proposals by exploring a transform matrix approximation, truncation and pruning. The results show that the approximate DTT hardware proposal increases the maximum frequency up to 64%, minimizes the circuit area in up to 43.6%, and saves up to 65.4% in power dissipation. The DTT proposal mapped for FPGA shows an increase of up to 58.9% on the maximum frequency and savings of about 28.7% and 32.2% on slices and dynamic power, respectively compared with stat

On Fault Tolerance Methods for Networks-on-Chip

Technology scaling has proceeded into dimensions in which the reliability of manufactured devices is becoming endangered. The reliability decrease is a consequence of physical limitations, relative increase of variations, and decreasing noise margins, among others. A promising solution for bringing the reliability of circuits back to a desired level is the use of design methods which introduce tolerance against possible faults in an integrated circuit. This thesis studies and presents fault tolerance methods for network-onchip (NoC) which is a design paradigm targeted for very large systems-onchip. In a NoC resources, such as processors and memories, are connected to a communication network; comparable to the Internet. Fault tolerance in such a system can be achieved at many abstraction levels. The thesis studies the origin of faults in modern technologies and explains the classification to transient, intermittent and permanent faults. A survey of fault tolerance methods is presented to demonstrate the diversity of available methods. Networks-on-chip are approached by exploring their main design choices: the selection of a topology, routing protocol, and flow control method. Fault tolerance methods for NoCs are studied at different layers of the OSI reference model. The data link layer provides a reliable communication link over a physical channel. Error control coding is an efficient fault tolerance method especially against transient faults at this abstraction level. Error control coding methods suitable for on-chip communication are studied and their implementations presented. Error control coding loses its effectiveness in the presence of intermittent and permanent faults. Therefore, other solutions against them are presented. The introduction of spare wires and split transmissions are shown to provide good tolerance against intermittent and permanent errors and their combination to error control coding is illustrated. At the network layer positioned above the data link layer, fault tolerance can be achieved with the design of fault tolerant network topologies and routing algorithms. Both of these approaches are presented in the thesis together with realizations in the both categories. The thesis concludes that an optimal fault tolerance solution contains carefully co-designed elements from different abstraction levelsSiirretty Doriast

Phase Noise Analyses and Measurements in the Hybrid Memristor-CMOS Phase-Locked Loop Design and Devices Beyond Bulk CMOS

Phase-locked loop (PLLs) has been widely used in analog or mixed-signal integrated circuits. Since there is an increasing market for low noise and high speed devices, PLLs are being employed in communications. In this dissertation, we investigated phase noise, tuning range, jitter, and power performances in different architectures of PLL designs. More energy efficient devices such as memristor, graphene, transition metal di-chalcogenide (TMDC) materials and their respective transistors are introduced in the design phase-locked loop. Subsequently, we modeled phase noise of a CMOS phase-locked loop from the superposition of noises from its building blocks which comprises of a voltage-controlled oscillator, loop filter, frequency divider, phase-frequency detector, and the auxiliary input reference clock. Similarly, a linear time-invariant model that has additive noise sources in frequency domain is used to analyze the phase noise. The modeled phase noise results are further compared with the corresponding phase-locked loop designs in different n-well CMOS processes. With the scaling of CMOS technology and the increase of the electrical field, the problem of short channel effects (SCE) has become dominant, which causes decay in subthreshold slope (SS) and positive and negative shifts in the threshold voltages of nMOS and pMOS transistors, respectively. Various devices are proposed to continue extending Moore\u27s law and the roadmap in semiconductor industry. We employed tunnel field effect transistor owing to its better performance in terms of SS, leakage current, power consumption etc. Applying an appropriate bias voltage to the gate-source region of TFET causes the valence band to align with the conduction band and injecting the charge carriers. Similarly, under reverse bias, the two bands are misaligned and there is no injection of carriers. We implemented graphene TFET and MoS2 in PLL design and the results show improvements in phase noise, jitter, tuning range, and frequency of operation. In addition, the power consumption is greatly reduced due to the low supply voltage of tunnel field effect transistor

Novel techniques for the design and practical realization of switched-capacitor circuits in deep-submicron CMOS technologies

Dissertação apresentada para obtenção do Grau de Doutor em Engenharia Electrotécnica e de Computadores pela Universidade Nova de Lisboa, Faculdade de Ciências e TecnologiaSwitches presenting high linearity are more and more required in switched-capacitor circuits,namely in 12 to 16 bits resolution analog-to-digital converters. The CMOS technology evolves continuously towards lower supply voltages and, simultaneously, new design techniques are necessary to fulfill the realization of switches exhibiting a high dynamic range and a distortion compatible with referred resolutions. Moreover, with the continuously downing of the sizes, the physic constraints of the technology must be considered to avoid the excessive stress of the devices when relatively high voltages are applied to the gates. New switch-linearization techniques, with high reliability, must be necessarily developed and demonstrated in CMOS integrated circuits. Also, the research of new structures of circuits with switched-capacitor is permanent. Simplified and efficient structures are mandatory, adequate to the new demands emerging from the proliferation of portable equipments, necessarily with low energy consumption while assuring high performance and multiple functions. The work reported in this Thesis comprises these two areas. The behavior of the switches under these new constraints is analyzed, being a new and original solution proposed, in order to maintain the performance. Also, proposals for the application of simpler clock and control schemes are presented, and for the use of open-loop structures and amplifiers with localfeedback. The results, obtained in laboratory or by simulation, assess the feasibility of the presented proposals

The 1992 4th NASA SERC Symposium on VLSI Design

Papers from the fourth annual NASA Symposium on VLSI Design, co-sponsored by the IEEE, are presented. Each year this symposium is organized by the NASA Space Engineering Research Center (SERC) at the University of Idaho and is held in conjunction with a quarterly meeting of the NASA Data System Technology Working Group (DSTWG). One task of the DSTWG is to develop new electronic technologies that will meet next generation electronic data system needs. The symposium provides insights into developments in VLSI and digital systems which can be used to increase data systems performance. The NASA SERC is proud to offer, at its fourth symposium on VLSI design, presentations by an outstanding set of individuals from national laboratories, the electronics industry, and universities. These speakers share insights into next generation advances that will serve as a basis for future VLSI design

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process