Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Design of a fault tolerant airborne digital computer. Volume 1: Architecture

This volume is concerned with the architecture of a fault tolerant digital computer for an advanced commercial aircraft. All of the computations of the aircraft, including those presently carried out by analogue techniques, are to be carried out in this digital computer. Among the important qualities of the computer are the following: (1) The capacity is to be matched to the aircraft environment. (2) The reliability is to be selectively matched to the criticality and deadline requirements of each of the computations. (3) The system is to be readily expandable. contractible, and (4) The design is to appropriate to post 1975 technology. Three candidate architectures are discussed and assessed in terms of the above qualities. Of the three candidates, a newly conceived architecture, Software Implemented Fault Tolerance (SIFT), provides the best match to the above qualities. In addition SIFT is particularly simple and believable. The other candidates, Bus Checker System (BUCS), also newly conceived in this project, and the Hopkins multiprocessor are potentially more efficient than SIFT in the use of redundancy, but otherwise are not as attractive

Robust and Traffic Aware Medium Access Control Mechanisms for Energy-Efficient mm-Wave Wireless Network-on-Chip Architectures

To cater to the performance/watt needs, processors with multiple processing cores on the same chip have become the de-facto design choice. In such multicore systems, Network-on-Chip (NoC) serves as a communication infrastructure for data transfer among the cores on the chip. However, conventional metallic interconnect based NoCs are constrained by their long multi-hop latencies and high power consumption, limiting the performance gain in these systems. Among, different alternatives, due to the CMOS compatibility and energy-efficiency, low-latency wireless interconnect operating in the millimeter wave (mm-wave) band is nearer term solution to this multi-hop communication problem. This has led to the recent exploration of millimeter-wave (mm-wave) wireless technologies in wireless NoC architectures (WiNoC). To realize the mm-wave wireless interconnect in a WiNoC, a wireless interface (WI) equipped with on-chip antenna and transceiver circuit operating at 60GHz frequency range is integrated to the ports of some NoC switches. The WIs are also equipped with a medium access control (MAC) mechanism that ensures a collision free and energy-efficient communication among the WIs located at different parts on the chip. However, due to shrinking feature size and complex integration in CMOS technology, high-density chips like multicore systems are prone to manufacturing defects and dynamic faults during chip operation. Such failures can result in permanently broken wireless links or cause the MAC to malfunction in a WiNoC. Consequently, the energy-efficient communication through the wireless medium will be compromised. Furthermore, the energy efficiency in the wireless channel access is also dependent on the traffic pattern of the applications running on the multicore systems. Due to the bursty and self-similar nature of the NoC traffic patterns, the traffic demand of the WIs can vary both spatially and temporally. Ineffective management of such traffic variation of the WIs, limits the performance and energy benefits of the novel mm-wave interconnect technology. Hence, to utilize the full potential of the novel mm-wave interconnect technology in WiNoCs, design of a simple, fair, robust, and efficient MAC is of paramount importance. The main goal of this dissertation is to propose the design principles for robust and traffic-aware MAC mechanisms to provide high bandwidth, low latency, and energy-efficient data communication in mm-wave WiNoCs. The proposed solution has two parts. In the first part, we propose the cross-layer design methodology of robust WiNoC architecture that can minimize the effect of permanent failure of the wireless links and recover from transient failures caused by single event upsets (SEU). Then, in the second part, we present a traffic-aware MAC mechanism that can adjust the transmission slots of the WIs based on the traffic demand of the WIs. The proposed MAC is also robust against the failure of the wireless access mechanism. Finally, as future research directions, this idea of traffic awareness is extended throughout the whole NoC by enabling adaptiveness in both wired and wireless interconnection fabric

Self-healing concepts involving fine-grained redundancy for electronic systems

The start of the digital revolution came through the metal-oxide-semiconductor field-effect transistor (MOSFET) in 1959 followed by massive integration onto a silicon die by means of constant down scaling of individual components. Digital systems for certain applications require fault-tolerance against faults caused by temporary or permanent influence. The most widely used technique is triple module redundancy (TMR) in conjunction with a majority voter, which is regarded as a passive fault mitigation strategy. Design by functional resilience has been applied to circuit structures for increased fault-tolerance and towards self-diagnostic triggered self-healing. The focus of this thesis is therefore to develop new design strategies for fault detection and mitigation within transistor, gate and cell design levels. The research described in this thesis makes three contributions. The first contribution is based on adding fine-grained transistor level redundancy to logic gates in order to accomplish stuck-at fault-tolerance. The objective is to realise maximum fault-masking for a logic gate with minimal added redundant transistors. In the case of non-maskable stuck-at faults, the gate structure generates an intrinsic indication signal that is suitable for autonomous self-healing functions. As a result, logic circuitry utilising this design is now able to differentiate between gate faults and faults occurring in inter-gate connections. This distinction between fault-types can then be used for triggering selective self-healing responses. The second contribution is a logic matrix element which applies the three core redundancy concepts of spatial- temporal- and data-redundancy. This logic structure is composed of quad-modular redundant structures and is capable of selective fault-masking and localisation depending of fault-type at the cell level, which is referred to as a spatiotemporal quadded logic cell (QLC) structure. This QLC structure has the capability of cellular self-healing. Through the combination of fault-tolerant and masking logic features the QLC is designed with a fault-behaviour that is equal to existing quadded logic designs using only 33.3% of the equivalent transistor resources. The inherent self-diagnosing feature of QLC is capable of identifying individual faulty cells and can trigger self-healing features. The final contribution is focused on the conversion of finite state machines (FSM) into memory to achieve better state transition timing, minimal memory utilisation and fault protection compared to common FSM designs. A novel implementation based on content-addressable type memory (CAM) is used to achieve this. The FSM is further enhanced by creating the design out of logic gates of the first contribution by achieving stuck-at fault resilience. Applying cross-data parity checking, the FSM becomes equipped with single bit fault detection and correction

Low-Power Embedded Design Solutions and Low-Latency On-Chip Interconnect Architecture for System-On-Chip Design

This dissertation presents three design solutions to support several key system-on-chip (SoC) issues to achieve low-power and high performance. These are: 1) joint source and channel decoding (JSCD) schemes for low-power SoCs used in portable multimedia systems, 2) efficient on-chip interconnect architecture for massive multimedia data streaming on multiprocessor SoCs (MPSoCs), and 3) data processing architecture for low-power SoCs in distributed sensor network (DSS) systems and its implementation. The first part includes a low-power embedded low density parity check code (LDPC) - H.264 joint decoding architecture to lower the baseband energy consumption of a channel decoder using joint source decoding and dynamic voltage and frequency scaling (DVFS). A low-power multiple-input multiple-output (MIMO) and H.264 video joint detector/decoder design that minimizes energy for portable, wireless embedded systems is also designed. In the second part, a link-level quality of service (QoS) scheme using unequal error protection (UEP) for low-power network-on-chip (NoC) and low latency on-chip network designs for MPSoCs is proposed. This part contains WaveSync, a low-latency focused network-on-chip architecture for globally-asynchronous locally-synchronous (GALS) designs and a simultaneous dual-path routing (SDPR) scheme utilizing path diversity present in typical mesh topology network-on-chips. SDPR is akin to having a higher link width but without the significant hardware overhead associated with simple bus width scaling. The last part shows data processing unit designs for embedded SoCs. We propose a data processing and control logic design for a new radiation detection sensor system generating data at or above Peta-bits-per-second level. Implementation results show that the intended clock rate is achieved within the power target of less than 200mW. We also present a digital signal processing (DSP) accelerator supporting configurable MAC, FFT, FIR, and 3-D cross product operations for embedded SoCs. It consumes 12.35mW along with 0.167mm2 area at 333MHz

Conceptual design of a 10 to the 8th power bit magnetic bubble domain mass storage unit and fabrication, test and delivery of a feasibility model

The conceptual design of a highly reliable 10 to the 8th power-bit bubble domain memory for the space program is described. The memory has random access to blocks of closed-loop shift registers, and utilizes self-contained bubble domain chips with on-chip decoding. Trade-off studies show that the highest reliability and lowest power dissipation is obtained when the memory is organized on a bit-per-chip basis. The final design has 800 bits/register, 128 registers/chip, 16 chips/plane, and 112 planes, of which only seven are activated at a time. A word has 64 data bits +32 checkbits, used in a 16-adjacent code to provide correction of any combination of errors in one plane. 100 KHz maximum rotational frequency keeps power low (equal to or less than, 25 watts) and also allows asynchronous operation. Data rate is 6.4 megabits/sec, access time is 200 msec to an 800-word block and an additional 4 msec (average) to a word. The fabrication and operation are also described for a 64-bit bubble domain memory chip designed to test the concept of on-chip magnetic decoding. Access to one of the chip's four shift registers for the read, write, and clear functions is by means of bubble domain decoders utilizing the interaction between a conductor line and a bubble

VLSI Design

This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc

Network-on-Chip Synchronization

Technology scaling has enabled the number of cores within a System on Chip (SoC) to increase significantly. Globally Asynchronous Locally Synchronous (GALS) systems using Dynamic Voltage and Frequency Scaling (DVFS) operate each of these cores on distinct and dynamic clock domains. The main communication method between these cores is increasingly more likely to be a Network-on-Chip (NoC). Typically, the interfaces between these clock domains experience multi-cycle synchronization latencies due to their use of “brute-force” synchronizers. This dissertation aims to improve the performance of NoCs and thereby SoCs as a whole by reducing this synchronization latency. First, a survey of NoC improvement techniques is presented. One such improvement technique: a multi-layer NoC, has been successfully simulated. Given how one of the most commonly used techniques is DVFS, a thorough analysis and simulation of brute-force synchronizer circuits in both current and future process technologies is presented. Unfortunately, a multi-cycle latency is unavoidable when using brute-force synchronizers, so predictive synchronizers which require only a single cycle of latency have been proposed. To demonstrate the impact of these predictive synchronizer circuits at a high level, multi-core system simulations incorporating these circuits have been completed. Multiple forms of GALS NoC configurations have been simulated, including multi-synchronous, NoC-synchronous, and single-synchronizer. Speedup on the SPLASH benchmark suite was measured to directly quantify the performance benefit of predictive synchronizers in a full system. Additionally, Mean Time Between Failures (MTBF) has been calculated for each NoC synchronizer configuration to determine the reliability benefit possible when using predictive synchronizers