Design of ALU and Cache Memory for an 8 bit ALU

The design of an ALU and a Cache memory for use in a high performance processor was examined in this thesis. Advanced architectures employing increased parallelism were analyzed to minimize the number of execution cycles needed for 8 bit integer arithmetic operations. In addition to the arithmetic unit, an optimized SRAM memory cell was designed to be used as cache memory and as fast Look Up Table. The ALU consists of stand alone units for bit parallel computation of basic integer arithmetic operations. Addition and subtraction were performed using Kogge Stone parallel prefix hardware operating at 330MHz. A high performance multiplier was built using Radix 4 Modified Booth Encoder (MBE) and a Wallace Tree summation array. The multiplier requires single clock cycle for 8 bit integer multiplication and operates at a maximum frequency of 100MHz. Multiplicative division hardware was built for executing both integer division and square root. The division hardware computes 8-bit division and square root in 4 clock cycles. Multiplier forms the basic building block of all these functional units, making high level of resource sharing feasible with this architecture. The optimal operating frequency for the arithmetic unit is 70MHz. A 6T CMOS SRAM cell measuring 90 µm2 was designed using minimum size transistors. The layout allows for horizontal overlap resulting in effective area of 76 µm2 for an 8x8 array. By substituting equivalent bit line capacitance of P4 L1 Cache, the memory was simulated to have a read time of 3.27ns. An optimized set of test vectors were identified to enable high fault coverage without the need for any additional test circuitry. Sixteen test cases were identified that would toggle all the nodes and provide all possible inputs to the sub units of the multiplier. A correlation based semi automatic method was investigated to facilitate test case identification for large multipliers. This method of testability eliminates performance and area overhead associated with conventional testability hardware. Bottom up design methodology was employed for the design. The performance and area metrics are presented along with estimated power consumption. A set of Monte Carlo analysis was carried out to ensure the dependability of the design under process variations as well as fluctuations in operating conditions. The arithmetic unit was found to require a total die area of 2mm2 (approx.) in 0.35 micron process

THE DESIGN OF AN IC HALF PRECISION FLOATING POINT ARITHMETIC LOGIC UNIT

A 16 bit floating point (FP) Arithmetic Logic Unit (ALU) was designed and implemented in 0.35µm CMOS technology. Typical uses of the 16 bit FP ALU include graphics processors and embedded multimedia applications. The ALU of the modern microprocessors use a fused multiply add (FMA) design technique. An advantage of the FMA is to remove the need for a comparator which is required for a normal FP adder. The FMA consists of a multiplier, shifters, adders and rounding circuit. A fast multiplier based on the Wallace tree configuration was designed. The number of partial products was greatly reduced by the use of the modified booth encoder. The Wallace tree was chosen to reduce the number of reduction layers of partial products. The multiplier also involved the design of a pass transistor based 4:2 compressor. The average delay of the pass transistor based compressor was 55ps and was found to be 7 times faster than the full adder based 4:2 compressor. The shifters consist of separate left and right shifters using multiplexers. The shift amount is calculated using the exponents of the three operands. The addition operation is implemented using a carry skip adder (CSK). The average delay of the CSK was 1.05ns and was slower than the carry look ahead adder by about 400ps. The advantages of the CSK are reduced power, gate count and area when compared to the similar sized carry look ahead adder. The adder computes the addition of the multiplier result and the shifted value of the addend. In most modern computers, division is performed using software thereby eliminating the need for a separate hardware unit. FMA hardware unit was utilized to perform FP division. The FP divider uses the Newton Raphson algorithm to solve division by iteration. The initial approximated value with five bit accuracy was assumed to be pre-stored in cache memory and a separate clock cycle for cache read was assumed before the start of the FP division operation. In order to significantly reduce the area of the design, only one multiplier was used. Rounding to nearest technique was implemented using an 11 bit variable CSK adder. This is the best rounding technique when compared to other rounding techniques. In both the FMA and division, rounding was performed after the computation of the final result during the last clock cycle of operation. Testability analysis is performed for the multiplier which is the most complex and critical part of the FP ALU. The specific aim of testability was to ensure the correct operation of the multiplier and thus guarantee the correctness of the FMA circuit at the layout stage. The multiplier\u27s output was tested by identifying the minimal number of input vectors which toggle the inputs of the 4:2 compressors of the multiplier. The test vectors were identified in a semi automated manner using Perl scripting language. The multiplier was tested with a test set of thirty one vectors. The fault coverage of the multiplier was found to be 90.09%. The layout was implemented using IC station of Mentor Graphics CAD tool and resulted in a chip area of 1.96mm2. The specifications for basic arithmetic operations were met successfully. FP Division operation was completed within six clock cycles. The other arithmetic operations like FMA, FP addition, FP subtraction and FP multiplication were completed within three clock cycles

Low-Power Design of Digital VLSI Circuits around the Point of First Failure

As an increase of intelligent and self-powered devices is forecasted for our future everyday life, the implementation of energy-autonomous devices that can wirelessly communicate data from sensors is crucial. Even though techniques such as voltage scaling proved to effectively reduce the energy consumption of digital circuits, additional energy savings are still required for a longer battery life. One of the main limitations of essentially any low-energy technique is the potential degradation of the quality of service (QoS). Thus, a thorough understanding of how circuits behave when operated around the point of first failure (PoFF) is key for the effective application of conventional energy-efficient methods as well as for the development of future low-energy techniques. In this thesis, a variety of circuits, techniques, and tools is described to reduce the energy consumption in digital systems when operated either in the safe and conservative exact region, close to the PoFF, or even inside the inexact region. A straightforward approach to reduce the power consumed by clock distribution while safely operating in the exact region is dual-edge-triggered (DET) clocking. However, the DET approach is rarely taken, primarily due to the perceived complexity of its integration. In this thesis, a fully automated design flow is introduced for applying DET clocking to a conventional single-edge-triggered (SET) design. In addition, the first static true-single-phase-clock DET flip-flop (DET-FF) that completely avoids clock-overlap hazards of DET registers is proposed. Even though the correct timing of synchronous circuits is ensured in worst-case conditions, the critical path might not always be excited. Thus, dynamic clock adjustment (DCA) has been proposed to trim any available dynamic timing margin by changing the operating clock frequency at runtime. This thesis describes a dynamically-adjustable clock generator (DCG) capable of modifying the period of the produced clock signal on a cycle-by-cycle basis that enables the DCA technique. In addition, a timing-monitoring sequential (TMS) that detects input transitions on either one of the clock phases to enable the selection of the best timing-monitoring strategy at runtime is proposed. Energy-quality scaling techniques aimat trading lower energy consumption for a small degradation on the QoS whenever approximations can be tolerated. In this thesis, a low-power methodology for the perturbation of baseline coefficients in reconfigurable finite impulse response (FIR) filters is proposed. The baseline coefficients are optimized to reduce the switching activity of the multipliers in the FIR filter, enabling the possibility of scaling the power consumption of the filter at runtime. The area as well as the leakage power of many system-on-chips is often dominated by embedded memories. Gain-cell embedded DRAM (GC-eDRAM) is a compact, low-power and CMOS-compatible alternative to the conventional static random-access memory (SRAM) when a higher memory density is desired. However, due to GC-eDRAMs relying on many interdependent variables, the adaptation of existing memories and the design of future GCeDRAMs prove to be highly complex tasks. Thus, the first modeling tool that estimates timing, memory availability, bandwidth, and area of GC-eDRAMs for a fast exploration of their design space is proposed in this thesis

Towards an embedded board-level tester: study of a configurable test processor

The demand for electronic systems with more features, higher performance, and less power consumption increases continuously. This is a real challenge for design and test engineers because they have to deal with electronic systems with ever-increasing complexity maintaining production and test costs low and meeting critical time to market deadlines. For a test engineer working at the board-level, this means that manufacturing defects must be detected as soon as possible and at a low cost. However, the use of classical test techniques for testing modern printed circuit boards is not sufficient, and in the worst case these techniques cannot be used at all. This is mainly due to modern packaging technologies, a high device density, and high operation frequencies of modern printed circuit boards. This leads to very long test times, low fault coverage, and high test costs. This dissertation addresses these issues and proposes an FPGA-based test approach for printed circuit boards. The concept is based on a configurable test processor that is temporarily implemented in the on-board FPGA and provides the corresponding mechanisms to communicate to external test equipment and co-processors implemented in the FPGA. This embedded test approach provides the flexibility to implement test functions either in the external test equipment or in the FPGA. In this manner, tests are executed at-speed increasing the fault coverage, test times are reduced, and the test system can be adapted automatically to the properties of the FPGA and devices located on the board. An essential part of the FPGA-based test approach deals with the development of a test processor. In this dissertation the required properties of the processor are discussed, and it is shown that the adaptation to the specific test scenario plays a very important role for the optimization. For this purpose, the test processor is equipped with configuration parameters at the instruction set architecture and microarchitecture level. Additionally, an automatic generation process for the test system and for the computation of some of the processor’s configuration parameters is proposed. The automatic generation process uses as input a model known as the device under test model (DUT-M). In order to evaluate the entire FPGA-based test approach and the viability of a processor for testing printed circuit boards, the developed test system is used to test interconnections to two different devices: a static random memory (SRAM) and a liquid crystal display (LCD). Experiments were conducted in order to determine the resource utilization of the processor and FPGA-based test system and to measure test time when different test functions are implemented in the external test equipment or the FPGA. It has been shown that the introduced approach is suitable to test printed circuit boards and that the test processor represents a realistic alternative for testing at board-level.Der Bedarf an elektronischen Systemen mit zusätzlichen Merkmalen, höherer Leistung und geringerem Energieverbrauch nimmt ständig zu. Dies stellt eine erhebliche Herausforderung für Entwicklungs- und Testingenieure dar, weil sie sich mit elektronischen Systemen mit einer steigenden Komplexität zu befassen haben. Außerdem müssen die Herstellungs- und Testkosten gering bleiben und die Produkteinführungsfristen so kurz wie möglich gehalten werden. Daraus folgt, dass ein Testingenieur, der auf Leiterplatten-Ebene arbeitet, die Herstellungsfehler so früh wie möglich entdecken und dabei möglichst niedrige Kosten verursachen soll. Allerdings sind die klassischen Testmethoden nicht in der Lage, die Anforderungen von modernen Leiterplatten zu erfüllen und im schlimmsten Fall können diese Testmethoden überhaupt nicht verwendet werden. Dies liegt vor allem an modernen Gehäuse-Technologien, der hohen Bauteildichte und den hohen Arbeitsfrequenzen von modernen Leiterplatten. Das führt zu sehr langen Testzeiten, geringer Testabdeckung und hohen Testkosten. Die Dissertation greift diese Problematik auf und liefert einen FPGA-basierten Testansatz für Leiterplatten. Das Konzept beruht auf einem konfigurierbaren Testprozessor, welcher im On-Board-FPGA temporär implementiert wird und die entsprechenden Mechanismen für die Kommunikation mit der externen Testeinrichtung und Co-Prozessoren im FPGA bereitstellt. Dadurch ist es möglich Testfunktionen flexibel entweder auf der externen Testeinrichtung oder auf dem FPGA zu implementieren. Auf diese Weise werden Tests at-speed ausgeführt, um die Testabdeckung zu erhöhen. Außerdem wird die Testzeit verkürzt und das Testsystem automatisch an die Eigenschaften des FPGAs und anderer Bauteile auf der Leiterplatte angepasst. Ein wesentlicher Teil des FPGA-basierten Testansatzes umfasst die Entwicklung eines Testprozessors. In dieser Dissertation wird über die benötigten Eigenschaften des Prozessors diskutiert und es wird gezeigt, dass die Anpassung des Prozessors an den spezifischen Testfall von großer Bedeutung für die Optimierung ist. Zu diesem Zweck wird der Prozessor mit Konfigurationsparametern auf der Befehlssatzarchitektur-Ebene und Mikroarchitektur-Ebene ausgerüstet. Außerdem wird ein automatischer Generierungsprozess für die Realisierung des Testsystems und für die Berechnung einer Untergruppe von Konfigurationsparametern des Prozessors vorgestellt. Der automatische Generierungsprozess benutzt als Eingangsinformation ein Modell des Prüflings (device under test model, DUT-M). Das entwickelte Testsystem wurde zum Testen von Leiterplatten für Verbindungen zwischen dem FPGA und zwei Bauteilen verwendet, um den FPGA-basierten Testansatz und die Durchführbarkeit des Testprozessors für das Testen auf Leiterplatte-Ebene zu evaluieren. Die zwei Bauteile sind ein Speicher mit direktem Zugriff (static random-access memory, SRAM) und eine Flüssigkristallanzeige (liquid crystal display, LCD). Die Experimente wurden durchgeführt, um den Ressourcenverbrauch des Prozessors und Testsystems festzustellen und um die Testzeit zu messen. Dies geschah durch die Implementierung von unterschiedlichen Testfunktionen auf der externen Testeinrichtung und dem FPGA. Dadurch konnte gezeigt werden, dass der FPGA-basierte Ansatz für das Testen von Leiterplatten geeignet ist und dass der Testprozessor eine realistische Alternative für das Testen auf Leiterplatten-Ebene ist

Adaptive Distributed Architectures for Future Semiconductor Technologies.

Year after year semiconductor manufacturing has been able to integrate more components in a single computer chip. These improvements have been possible through systematic shrinking in the size of its basic computational element, the transistor. This trend has allowed computers to progressively become faster, more efficient and less expensive. As this trend continues, experts foresee that current computer designs will face new challenges, in utilizing the minuscule devices made available by future semiconductor technologies. Today's microprocessor designs are not fit to overcome these challenges, since they are constrained by their inability to handle component failures by their lack of adaptability to a wide range of custom modules optimized for specific applications and by their limited design modularity. The focus of this thesis is to develop original computer architectures, that can not only survive these new challenges, but also leverage the vast number of transistors available to unlock better performance and efficiency. The work explores and evaluates new software and hardware techniques to enable the development of novel adaptive and modular computer designs. The thesis first explores an infrastructure to quantitatively assess the fallacies of current systems and their inadequacy to operate on unreliable silicon. In light of these findings, specific solutions are then proposed to strengthen digital system architectures, both through hardware and software techniques. The thesis culminates with the proposal of a radically new architecture design that can fully adapt dynamically to operate on the hardware resources available on chip, however limited or abundant those may be.PHDComputer Science and EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/102405/1/apellegr_1.pd

Timing-Error Tolerance Techniques for Low-Power DSP: Filters and Transforms

Low-power Digital Signal Processing (DSP) circuits are critical to commercial System-on-Chip design for battery powered devices. Dynamic Voltage Scaling (DVS) of digital circuits can reclaim worst-case supply voltage margins for delay variation, reducing power consumption. However, removing static margins without compromising robustness is tremendously challenging, especially in an era of escalating reliability concerns due to continued process scaling. The Razor DVS scheme addresses these concerns, by ensuring robustness using explicit timing-error detection and correction circuits. Nonetheless, the design of low-complexity and low-power error correction is often challenging. In this thesis, the Razor framework is applied to fixed-precision DSP filters and transforms. The inherent error tolerance of many DSP algorithms is exploited to achieve very low-overhead error correction. Novel error correction schemes for DSP datapaths are proposed, with very low-overhead circuit realisations. Two new approximate error correction approaches are proposed. The first is based on an adapted sum-of-products form that prevents errors in intermediate results reaching the output, while the second approach forces errors to occur only in less significant bits of each result by shaping the critical path distribution. A third approach is described that achieves exact error correction using time borrowing techniques on critical paths. Unlike previously published approaches, all three proposed are suitable for high clock frequency implementations, as demonstrated with fully placed and routed FIR, FFT and DCT implementations in 90nm and 32nm CMOS. Design issues and theoretical modelling are presented for each approach, along with SPICE simulation results demonstrating power savings of 21 – 29%. Finally, the design of a baseband transmitter in 32nm CMOS for the Spectrally Efficient FDM (SEFDM) system is presented. SEFDM systems offer bandwidth savings compared to Orthogonal FDM (OFDM), at the cost of increased complexity and power consumption, which is quantified with the first VLSI architecture

A novel deep submicron bulk planar sizing strategy for low energy subthreshold standard cell libraries

Engineering andPhysical Science ResearchCouncil (EPSRC) and Arm Ltd for providing funding in the form of grants and studentshipsThis work investigates bulk planar deep submicron semiconductor physics in an attempt to improve standard cell libraries aimed at operation in the subthreshold regime and in Ultra Wide Dynamic Voltage Scaling schemes. The current state of research in the field is examined, with particular emphasis on how subthreshold physical effects degrade robustness, variability and performance. How prevalent these physical effects are in a commercial 65nm library is then investigated by extensive modeling of a BSIM4.5 compact model. Three distinct sizing strategies emerge, cells of each strategy are laid out and post-layout parasitically extracted models simulated to determine the advantages/disadvantages of each. Full custom ring oscillators are designed and manufactured. Measured results reveal a close correlation with the simulated results, with frequency improvements of up to 2.75X/2.43X obs erved for RVT/LVT devices respectively. The experiment provides the first silicon evidence of the improvement capability of the Inverse Narrow Width Effect over a wide supply voltage range, as well as a mechanism of additional temperature stability in the subthreshold regime. A novel sizing strategy is proposed and pursued to determine whether it is able to produce a superior complex circuit design using a commercial digital synthesis flow. Two 128 bit AES cores are synthesized from the novel sizing strategy and compared against a third AES core synthesized from a state-of-the-art subthreshold standard cell library used by ARM. Results show improvements in energy-per-cycle of up to 27.3% and frequency improvements of up to 10.25X. The novel subthreshold sizing strategy proves superior over a temperature range of 0 °C to 85 °C with a nominal (20 °C) improvement in energy-per-cycle of 24% and frequency improvement of 8.65X. A comparison to prior art is then performed. Valid cases are presented where the proposed sizing strategy would be a candidate to produce superior subthreshold circuits

Design of Digital SoC for Operation at High Temperatures

There is a growing demand for Systems-on-Chip, integrating microprocessors, on-chip memories, data converters and a variety of sensors, which are capable of reliable operation at high temperatures. For instance, modern aircraft industry demands microcontrollers and electric motors to operate at high temperatures, in order to replace present hydraulic structures. This thesis explains how to design digital SoC which are capable of reliable operation at high temperatures. The essential part of this thesis focuses on the design, implementation, fabrication and high-temperature measurements of on-chip Latch based SRAM, PowerPC e200 based microcontroller, digital temperature sensor and Flash A/D converter. Embedded on-chip SRAM modules are one of the most important components in the modern SoC. We analyze thermally-caused failures in the 6T SRAM cell and elaborate on its reliability. Further, we show that Latch based SRAM modules are preferable to 6T SRAM for reliable operation beyond 150C, by comparing two 1kB SRAM modules implemented in standard 0.18um SOI CMOS process. We demonstrate reliable SRAM operation at 275C (fmax = 10MHz, Ptot = 400mW), that is by far the highest reported operating temperature for digital on-chip SRAM module. Designing SoCs for reliable operation at elevated temperatures is a significant challenge, due to increased static leakage current, reduced carrier mobility, and increased electromigration. We propose to customize a PowerPC e200 based SoC by using a dynamically reconfigurable clock frequency, exhaustive clock gating, and electromigration-resistant power distribution network. We fabricated a 20x9mm2 chip implementing this design in 0.35um Bulk CMOS process. We present worldâs first PowerPC based SoC for reliable operation at 225C (fmax = 30MHz, Ptot = 1.2W). This design outperforms previously reported PowerPC based SoCs, which are not operational at temperatures beyond 125C. The on-chip measurements of the p-n junction temperature allow reliability improvements for the SoC that operates at high temperatures. Low-resolution temperature measurements are efficiently used for adjusting the optimal operation frequency and supply voltage. We used the Time-to-Digital conversion technique to design a fully-digital temperature sensor. We designed and simulated a fully-digital 5bit temperature sensor for 10C resolution temperature measurements in between Tj,min = -45C and Tj,max = 125C. Further, using a single clock cycle Time-to-Digital conversion technique, we present a fully-digital 5bit Pulse based Flash ADC implemented in 0.18um Bulk CMOS process. Measurement results demonstrate the state-of-the-art power efficiency result of 450 fJ/conv (fmax = 83MHz, Ptot = 900uW)

Tuning the Computational Effort: An Adaptive Accuracy-aware Approach Across System Layers

This thesis introduces a novel methodology to realize accuracy-aware systems, which will help designers integrate accuracy awareness into their systems. It proposes an adaptive accuracy-aware approach across system layers that addresses current challenges in that domain, combining and tuning accuracy-aware methods on different system layers. To widen the scope of accuracy-aware computing including approximate computing for other domains, this thesis presents innovative accuracy-aware methods and techniques for different system layers. The required tuning of the accuracy-aware methods is integrated into a configuration layer that tunes the available knobs of the accuracy-aware methods integrated into a system