916 research outputs found

    VLSI Design

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    This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc

    Advanced single permanent magnet axipolar ironless stator ac motor for electric passenger vehicles

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    A program was conducted to design and develop an advanced-concept motor specifically created for propulsion of electric vehicles with increased range, reduced energy consumption, and reduced life-cycle costs in comparison with conventional systems. The motor developed is a brushless, dc, rare-earth cobalt, permanent magnet, axial air gap inductor machine that uses an ironless stator. Air cooling is inherent provided by the centrifugal-fan action of the rotor poles. An extensive design phase was conducted, which included analysis of the system performance versus the SAE J227a(D) driving cycle. A proof-of-principle model was developed and tested, and a functional model was developed and tested. Full generator-level testing was conducted on the functional model, recording electromagnetic, thermal, aerodynamic, and acoustic noise data. The machine demonstrated 20.3 kW output at 1466 rad/s and 160 dc. The novel ironless stator demonstated the capability to continuously operate at peak current. The projected system performance based on the use of a transistor inverter is 23.6 kW output power at 1466 rad/s and 83.3 percent efficiency. Design areas of concern regarding electric vehicle applications include the inherently high windage loss and rotor inertia

    Synchronization trigger control system for flow visualization

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    The use of cinematography or holographic interferometry for dynamic flow visualization in an internal combustion engine requires a control device that globally synchronizes camera and light source timing at a predefined shaft encoder angle. The device is capable of 0.35 deg resolution for rotational speeds of up to 73 240 rpm. This was achieved by implementing the shaft encoder signal addressed look-up table (LUT) and appropriate latches. The developed digital signal processing technique achieves 25 nsec of high speed triggering angle detection by using direct parallel bit comparison of the shaft encoder digital code with a simulated angle reference code, instead of using angle value comparison which involves more complicated computation steps. In order to establish synchronization to an AC reference signal whose magnitude is variant with the rotating speed, a dynamic peak followup synchronization technique has been devised. This method scrutinizes the reference signal and provides the right timing within 40 nsec. Two application examples are described

    Ultra-Wideband CMOS Transceiver Front-End for Bio-Medical Radar Sensing

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    Since the Federal Communication Commission released the unlicensed 3.1-10.6 GHz frequency band for commercial use in early 2002, the ultra wideband (UWB) has developed from an emerging technology into a mainstream research area. The UWB technology, which utilizes wide spectrum, opens a new era of possibility for practical applications in radar sensing, one of which is the human vital sign monitoring. The aim of this thesis is to study and research the possibility of a new generation humanrespiration monitoring sensor using UWB radar technology and to develop a new prototype of UWB radar sensor for system-on-chip solutions in CMOS technology. In this thesis, a lowpower Gaussian impulse UWB mono-static radar transceiver architecture is presented. The UWB Gaussian pulse transmitter and receiver are implemented and fabricated using 90nm CMOS technology. Since the energy of low order Gaussian pulse is mostly condensed at lower frequency, in order to transmit the pulse in a very efficient way, higher order Gaussian derivative pulses are desired as the baseband signal. This motivates the advancement of the design into UWB high-order pulse transmitter. Both the Gaussian impulse UWB transmitter and Gaussian higher-order impulse UWB transmitter take the low-power and high-speed advantage of digital circuit to generate different waveforms. The measurement results are analyzed and discussed. This thesis also presents a low-power UWB mono-static radar transceiver architecture exploiting the full benefit of UWB bandwidth in radar sensing applications. The transceiver includes a full UWB band transmitter, an UWB receiver front-end, and an on-chip diplexer. The non-coherent UWB transmitter generates pulse modulated baseband signals at different carrier frequencies within the designated 3-10 GHz band using a digitally controlled pulse generator. The test shows the proposed radar transceiver can detect the human respiration pattern within 50 cm distance. The applications of this UWB radar sensing solution in commercialized standard CMOS technology include constant breathing pattern monitoring for gated radiation therapy, realtime monitoring of patients, and any other breathing monitoring. The research paves the way to wireless technology integration with health care and bio-sensor network

    Solid State Circuits Technologies

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    The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book

    Reliable Low-Power High Performance Spintronic Memories

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    Moores Gesetz folgend, ist es der Chipindustrie in den letzten fünf Jahrzehnten gelungen, ein explosionsartiges Wachstum zu erreichen. Dies hatte ebenso einen exponentiellen Anstieg der Nachfrage von Speicherkomponenten zur Folge, was wiederum zu speicherlastigen Chips in den heutigen Computersystemen führt. Allerdings stellen traditionelle on-Chip Speichertech- nologien wie Static Random Access Memories (SRAMs), Dynamic Random Access Memories (DRAMs) und Flip-Flops eine Herausforderung in Bezug auf Skalierbarkeit, Verlustleistung und Zuverlässigkeit dar. Eben jene Herausforderungen und die überwältigende Nachfrage nach höherer Performanz und Integrationsdichte des on-Chip Speichers motivieren Forscher, nach neuen nichtflüchtigen Speichertechnologien zu suchen. Aufkommende spintronische Spe- ichertechnologien wie Spin Orbit Torque (SOT) und Spin Transfer Torque (STT) erhielten in den letzten Jahren eine hohe Aufmerksamkeit, da sie eine Reihe an Vorteilen bieten. Dazu gehören Nichtflüchtigkeit, Skalierbarkeit, hohe Beständigkeit, CMOS Kompatibilität und Unan- fälligkeit gegenüber Soft-Errors. In der Spintronik repräsentiert der Spin eines Elektrons dessen Information. Das Datum wird durch die Höhe des Widerstandes gespeichert, welche sich durch das Anlegen eines polarisierten Stroms an das Speichermedium verändern lässt. Das Prob- lem der statischen Leistung gehen die Speichergeräte sowohl durch deren verlustleistungsfreie Eigenschaft, als auch durch ihr Standard- Aus/Sofort-Ein Verhalten an. Nichtsdestotrotz sind noch andere Probleme, wie die hohe Zugriffslatenz und die Energieaufnahme zu lösen, bevor sie eine verbreitete Anwendung finden können. Um diesen Problemen gerecht zu werden, sind neue Computerparadigmen, -architekturen und -entwurfsphilosophien notwendig. Die hohe Zugriffslatenz der Spintroniktechnologie ist auf eine vergleichsweise lange Schalt- dauer zurückzuführen, welche die von konventionellem SRAM übersteigt. Des Weiteren ist auf Grund des stochastischen Schaltvorgangs der Speicherzelle und des Einflusses der Prozessvari- ation ein nicht zu vernachlässigender Zeitraum dafür erforderlich. In diesem Zeitraum wird ein konstanter Schreibstrom durch die Bitzelle geleitet, um den Schaltvorgang zu gewährleisten. Dieser Vorgang verursacht eine hohe Energieaufnahme. Für die Leseoperation wird gleicher- maßen ein beachtliches Zeitfenster benötigt, ebenfalls bedingt durch den Einfluss der Prozess- variation. Dem gegenüber stehen diverse Zuverlässigkeitsprobleme. Dazu gehören unter An- derem die Leseintereferenz und andere Degenerationspobleme, wie das des Time Dependent Di- electric Breakdowns (TDDB). Diese Zuverlässigkeitsprobleme sind wiederum auf die benötigten längeren Schaltzeiten zurückzuführen, welche in der Folge auch einen über längere Zeit an- liegenden Lese- bzw. Schreibstrom implizieren. Es ist daher notwendig, sowohl die Energie, als auch die Latenz zur Steigerung der Zuverlässigkeit zu reduzieren, um daraus einen potenziellen Kandidaten für ein on-Chip Speichersystem zu machen. In dieser Dissertation werden wir Entwurfsstrategien vorstellen, welche das Ziel verfolgen, die Herausforderungen des Cache-, Register- und Flip-Flop-Entwurfs anzugehen. Dies erre- ichen wir unter Zuhilfenahme eines Cross-Layer Ansatzes. Für Caches entwickelten wir ver- schiedene Ansätze auf Schaltkreisebene, welche sowohl auf der Speicherarchitekturebene, als auch auf der Systemebene in Bezug auf Energieaufnahme, Performanzsteigerung und Zuver- lässigkeitverbesserung evaluiert werden. Wir entwickeln eine Selbstabschalttechnik, sowohl für die Lese-, als auch die Schreiboperation von Caches. Diese ist in der Lage, den Abschluss der entsprechenden Operation dynamisch zu ermitteln. Nachdem der Abschluss erkannt wurde, wird die Lese- bzw. Schreiboperation sofort gestoppt, um Energie zu sparen. Zusätzlich limitiert die Selbstabschalttechnik die Dauer des Stromflusses durch die Speicherzelle, was wiederum das Auftreten von TDDB und Leseinterferenz bei Schreib- bzw. Leseoperationen re- duziert. Zur Verbesserung der Schreiblatenz heben wir den Schreibstrom an der Bitzelle an, um den magnetischen Schaltprozess zu beschleunigen. Um registerbankspezifische Anforderungen zu berücksichtigen, haben wir zusätzlich eine Multiport-Speicherarchitektur entworfen, welche eine einzigartige Eigenschaft der SOT-Zelle ausnutzt, um simultan Lese- und Schreiboperatio- nen auszuführen. Es ist daher möglich Lese/Schreib- Konfilkte auf Bitzellen-Ebene zu lösen, was sich wiederum in einer sehr viel einfacheren Multiport- Registerbankarchitektur nieder- schlägt. Zusätzlich zu den Speicheransätzen haben wir ebenfalls zwei Flip-Flop-Architekturen vorgestellt. Die erste ist eine nichtflüchtige non-Shadow Flip-Flop-Architektur, welche die Speicherzelle als aktive Komponente nutzt. Dies ermöglicht das sofortige An- und Ausschalten der Versorgungss- pannung und ist daher besonders gut für aggressives Powergating geeignet. Alles in Allem zeigt der vorgestellte Flip-Flop-Entwurf eine ähnliche Timing-Charakteristik wie die konventioneller CMOS Flip-Flops auf. Jedoch erlaubt er zur selben Zeit eine signifikante Reduktion der statis- chen Leistungsaufnahme im Vergleich zu nichtflüchtigen Shadow- Flip-Flops. Die zweite ist eine fehlertolerante Flip-Flop-Architektur, welche sich unanfällig gegenüber diversen Defekten und Fehlern verhält. Die Leistungsfähigkeit aller vorgestellten Techniken wird durch ausführliche Simulationen auf Schaltkreisebene verdeutlicht, welche weiter durch detaillierte Evaluationen auf Systemebene untermauert werden. Im Allgemeinen konnten wir verschiedene Techniken en- twickeln, die erhebliche Verbesserungen in Bezug auf Performanz, Energie und Zuverlässigkeit von spintronischen on-Chip Speichern, wie Caches, Register und Flip-Flops erreichen

    Two decades of condition monitoring methods for power devices

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    Condition monitoring (CM) of power semiconductor devices enhances converter reliability and customer service. Many studies have investigated the semiconductor devices failure modes, the sensor technologies, and the signal processing techniques to optimize the CM. Furthermore, the improvement of power devices’ CM thanks to the use of the Internet of Things and artificial intelligence technologies is rising in smart grids, transportation electrification, and so on. These technologies will be widespread in the future, where more and more smart techniques and smart sensors will enable a better estimation of the state of the health (SOH) of the devices. Considering the increasing use of power converters, CM is essential as the analysis of the data obtained from multiple sensors enables the prediction of the SOH, which, in turn, enables to properly schedule the maintenance, i.e., accounting for the trade-off between the maintenance cost and the cost and issues due to the device failure. From this perspective, this review paper summarizes past developments and recent advances of the various methods with the aim of describing the current state-of-the-art in CM research

    Local Epitaxial Overgrowth for Stacked Complementary MOS Transistor Pairs

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    A three-dimensional silicon processing technology for CMOS circuits was developed and characterized. The first fully depleted SOI devices with individually biasable gates on both sides of the silicon film were realized. A vertically stacked CMOS Inverter built by lateral overgrowth was reported for the first time. Nucleation-free epitaxial lateral overgrowth of silicon over thin oxides was developed for both a pancake and a barrel-type epitaxy reactor: This process was optimized to limit damage to gate oxides and minimize dopant diffusion within the Substrate. Autodoping from impurities of the MOS transistors built in the substrate was greatly reduced. A planarisation technique was developed to reduce the silicon film thickness from 13ÎĽm to below 0.5ÎĽm for full depletion. Chemo-mechanical polishing was modified to yield an automatic etch stop with the corresponding control and uniformity of the silicon film. The resulting wafer topography is more planar than in a conventional substrate CMOS process. PMOS transistors which match the current drive of bulk NM0S devices of equal geometry were characterized, despite the three-times lower hole mobility. Devices realized in the substrate, at the bottom and on top of the SOI film were essentially indistinguishable from bulk devices. A novel device with two insulated gates controlling the same channel was characterized. Inverters were realized both as joint-gate configuration and with symmetric performance of n- and p-channel. These circuits were realized in the area of a single NMOS transistor

    Modeling and Analysis of Power Processing Systems

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    The feasibility of formulating a methodology for the modeling and analysis of aerospace electrical power processing systems is investigated. It is shown that a digital computer may be used in an interactive mode for the design, modeling, analysis, and comparison of power processing systems

    Development, Demonstration, and Device Physics of FET-Accessed One-Transistor GaAs Dynamic Memory Technologies

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    The introduction of digital GaAs into modem high-speed computing systems has led to an increasing demand for high-density memory in these GaAs technologies. To date, most of the memory development efforts in GaAs have been directed toward four- and six-transistor static RAM\u27s, which consume substantial chip area and dissipate much static power resulting in limited single-chip GaAs storage capacities. As it has successfully done in silicon, a one-transistor dynamic RAM approach could alleviate these problems making higher density GaAs memories possible. This dissertation discusses theoretical and experimental work that presents the possibility for a high-speed, low-power, one-transistor dynamic RAM technology in GaAs. The two elements of the DRAM cell, namely the charge storage capacitor and the access field-effect transistor have been studied in detail. Isolated diode junction charge storage capacitors have demonstrated 30 minutes of storage time at room temperature with charge densities comparable to those obtained in planar silicon DRAM capacitors. GaAs JFET and MESFET technologies have been studied, and with careful device design and choice of proper operating voltages experimental results show that both can function as acceptable access transistors. One-transistor MESFET- and JFET-accessed DRAM cells have been fabricated and operated at room temperature and above with a standby power dissipation that is only a small fraction of the power dissipated by the best commercial GaAs static RAM cells. A 2 x 2 bit demonstration array was built and successfully operated at room temperature to demonstrate the addressable read/write capability of this new technology
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