Exploring High Resolution Test Pattern To Improve The Cache Failure Analysis

Typically, only pass/fail basis test algorithm is being used to test the cache array in silicon devices. But the pass/fail basis test algorithm is insufficient to identify the failing characteristic of the cache array when it comes to the failure analysis (FA) and debug stage to find out the root cause of the failing mechanism. The resolution of test algorithm plays an important role in helping FA process to identify every single failing bits in cache array. In this dissertation, the concept of bringing up the Memory Build in Self-Test (MBIST) high resolution test pattern is discussed. The utilization of MBIST engine by insertion of the Capture Test Vector (CTV) element into the test algorithm is the main concept in increasing the resolution test pattern. At the same time, the importance of high resolution test pattern in FA process is being shown in a real case study. The generated high resolution test pattern is integrated for Automated Test Equipment (ATE) usage so that the test pattern can be applied in real silicon device testing. Then, a silicon device is edited using Focused Ion Beam (FIB) to destroy the memory bits in cache array for proving the test pattern is functioning properly. Finally, the high resolution test pattern is being used in real case application for proving the high resolution test pattern have the capability in improving FA efficiency in identifying the failing bits. The FA technique and application of using high resolution test pattern in debugging the cache failure are shown from the testing stage until the destructive FA stage. The finding in real case FA proved the concept of bring up the MBIST high resolution test pattern is working properly. It is able to increase the effectiveness of failure analysis and failure isolation process which indirectly increase the success rate for finding the root cause

Fault Isolation with ‘X’ Filter for Bogus Signals and Intensive Scan Cell Sequence Validation

There are some concerns in silicon data collection by using the Design-For-Test (DFT). Bogus signal which carries ‘x’ value in simulation, results from the complex logic synthesis and power-up floating state can often mislead the fault isolation process with invalid failing condition. Besides, scan cells within the scan chain architecture is also having mismatch value in between the simulation data and silicon data due to the non-ideal mapping file passed down from the designer team. Hence, it is important to develop an integrated tool that can filter all the bogus signal online and to validate the correlation between silicon data and simulation data with minimum coverage of 90%. Data from actual Intel 6th generation microprocessor with 14 nm process technology, Skylake is imported to ensure that the application of this thesis in the current industry market. Necessary tools such as the “Differentiate and Display” feature to ease the analysis of data, the AND-logic operation to filter the bogus signal and X-OR logic operation to handle the inverted characteristic of signals are developed throughout the thesis. Results show that the developed integrated filter of bogus signals is successful and the minimum coverage of validation tool is 96.5%. Actual failure analysis case from industry is imported and the difference with and without the developed tools are compared. Inconclusive optical test result from the sample is obtained without the implementation of tools. On the other hand, defect of short circuit between the via and the metal line is found after the implementation of the developed tools. It is concluded that this thesis has achieved all the objectives set

Exploring the Mysteries of System-Level Test

System-level test, or SLT, is an increasingly important process step in today's integrated circuit testing flows. Broadly speaking, SLT aims at executing functional workloads in operational modes. In this paper, we consolidate available knowledge about what SLT is precisely and why it is used despite its considerable costs and complexities. We discuss the types or failures covered by SLT, and outline approaches to quality assessment, test generation and root-cause diagnosis in the context of SLT. Observing that the theoretical understanding for all these questions has not yet reached the level of maturity of the more conventional structural and functional test methods, we outline new and promising directions for methodical developments leveraging on recent findings from software engineering.Comment: 7 pages, 2 figure

Securing IEEE P1687 On-chip Instrumentation Access Using PUF

As the complexity of VLSI designs grows, the amount of embedded instrumentation in system-on-a-chip designs increases at an exponential rate. Such structures serve various purposes throughout the life-cycle of VLSI circuits, e.g. in post-silicon validation and debug, production test and diagnosis, as well as during in-field test and maintenance. Reliable access mechanisms for embedded instruments are therefore key to rapid chip development and secure system maintenance. Reconfigurable scan networks defined by IEEE Std. P1687 emerge as a scalable and cost-effective access medium for on-chip instrumentation. The accessibility offered by reconfigurable scan networks contradicts security and safety requirements for embedded instrumentation. Embedded instrumentation is an integral system component that remains functional throughout the lifetime of a chip. To prevent harmful activities, such as tampering with safety-critical systems, and reduce the risk of intellectual property infringement, the access to embedded instrumentation requires protection. This thesis provides a novel, Physical Unclonable Function (PUF) based secure access method for on-chip instruments which enhances the security of IJTAG network at low hardware cost and with less routing congestion

Fault Detection Methodology for Caches in Reliable Modern VLSI Microprocessors based on Instruction Set Architectures

Η παρούσα διδακτορική διατριβή εισάγει μία χαμηλού κόστους μεθοδολογία για την ανίχνευση ελαττωμάτων σε μικρές ενσωματωμένες κρυφές μνήμες που βασίζεται σε σύγχρονες Αρχιτεκτονικές Συνόλου Εντολών και εφαρμόζεται με λογισμικό αυτοδοκιμής. Η προτεινόμενη μεθοδολογία εφαρμόζει αλγορίθμους March μέσω λογισμικού για την ανίχνευση τόσο ελαττωμάτων αποθήκευσης όταν εφαρμόζεται σε κρυφές μνήμες που περιέχουν μόνο στατικές μνήμες τυχαίας προσπέλασης όπως για παράδειγμα κρυφές μνήμες επιπέδου 1, όσο και ελαττωμάτων σύγκρισης όταν εφαρμόζεται σε κρυφές μνήμες που περιέχουν εκτός από SRAM μνήμες και μνήμες διευθυνσιοδοτούμενες μέσω περιεχομένου, όπως για παράδειγμα πλήρως συσχετιστικές κρυφές μνήμες αναζήτησης μετάφρασης. Η προτεινόμενη μεθοδολογία εφαρμόζεται και στις τρεις οργανώσεις συσχετιστικότητας κρυφής μνήμης και είναι ανεξάρτητη της πολιτικής εγγραφής στο επόμενο επίπεδο της ιεραρχίας. Η μεθοδολογία αξιοποιεί υπάρχοντες ισχυρούς μηχανισμούς των μοντέρνων ISAs χρησιμοποιώντας ειδικές εντολές, που ονομάζονται στην παρούσα διατριβή Εντολές Άμεσης Προσπέλασης Κρυφής Μνήμης (Direct Cache Access Instructions - DCAs). Επιπλέον, η προτεινόμενη μεθοδολογία εκμεταλλεύεται τους έμφυτους μηχανισμούς καταγραφής απόδοσης και τους μηχανισμούς χειρισμού παγίδων που είναι διαθέσιμοι στους σύγχρονους επεξεργαστές. Επιπρόσθετα, η προτεινόμενη μεθοδολογία εφαρμόζει την λειτουργία σύγκρισης των αλγορίθμων March όταν αυτή απαιτείται (για μνήμες CAM) και επαληθεύει το αποτέλεσμα του ελέγχου μέσω σύντομης απόκρισης, ώστε να είναι συμβατή με τις απαιτήσεις του ελέγχου εντός λειτουργίας. Τέλος, στη διατριβή προτείνεται μία βελτιστοποίηση της μεθοδολογίας για πολυνηματικές, πολυπύρηνες αρχιτεκτονικές.The present PhD thesis introduces a low cost fault detection methodology for small embedded cache memories that is based on modern Instruction Set Architectures and is applied with Software-Based Self-Test (SBST) routines. The proposed methodology applies March tests through software to detect both storage faults when applied to caches that comprise Static Random Access Memories (SRAM) only, e.g. L1 caches, and comparison faults when applied to caches that apart from SRAM memories comprise Content Addressable Memories (CAM) too, e.g. Translation Lookaside Buffers (TLBs). The proposed methodology can be applied to all three cache associativity organizations: direct mapped, set-associative and full-associative and it does not depend on the cache write policy. The methodology leverages existing powerful mechanisms of modern ISAs by utilizing instructions that we call in this PhD thesis Direct Cache Access (DCA) instructions. Moreover, our methodology exploits the native performance monitoring hardware and the trap handling mechanisms which are available in modern microprocessors. Moreover, the proposed Methodology applies March compare operations when needed (for CAM arrays) and verifies the test result with a compact response to comply with periodic on-line testing needs. Finally, a multithreaded optimization of the proposed methodology that targets multithreaded, multicore architectures is also presented in this thesi

Scan Test Coverage Improvement Via Automatic Test Pattern Generation (Atpg) Tool Configuration

The scan test coverage improvement by using automatic test pattern generation (ATPG) tool configuration was investigated. Improving the test coverage is essential in detecting manufacturing defects in semiconductor industry so that high quality products can be supplied to consumers. The ATPG tool used was Mentor Graphics Tessent TestKompress (version 2014.1). The study was done by setting up a few experiments of utilizing and modifying ATPG commands and switches, observing the test coverage improvement from the statistical reports provided during pattern generation process and providing relatable discussions. By modifying the ATPG commands, it can be expected to have some improvement in the test coverage. The scan test patterns generated were stuck-at test patterns. Based on the experiments done, comparison was made on the different coverage readings and the most optimized method and flow of ATPG were determined. The most optimized flow gave an improvement of 0.91% in test coverage which is acceptable since this method does not involve a change in design. The test patterns generated were converted and tested using automatic test equipment (ATE) to observe its performance on real silicon. The test coverage improvement using ATPG tool instead of the design-based method is important as a faster workaround for back-end engineers to provide high quality test contents in such a short product development duration

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

Architectures for dependable modern microprocessors

Η εξέλιξη των ολοκληρωμένων κυκλωμάτων σε συνδυασμό με τους αυστηρούς χρονικούς περιορισμούς καθιστούν την επαλήθευση της ορθής λειτουργίας των επεξεργαστών μία εξαιρετικά απαιτητική διαδικασία. Με κριτήριο το στάδιο του κύκλου ζωής ενός επεξεργαστή, από την στιγμή κατασκευής των πρωτοτύπων και έπειτα, οι τεχνικές ελέγχου ορθής λειτουργίας διακρίνονται στις ακόλουθες κατηγορίες: (1) Silicon Debug: Τα πρωτότυπα ολοκληρωμένα κυκλώματα ελέγχονται εξονυχιστικά, (2) Manufacturing Testing: ο τελικό ποιοτικός έλεγχος και (3) In-field verification: Περιλαμβάνει τεχνικές, οι οποίες διασφαλίζουν την λειτουργία του επεξεργαστή σύμφωνα με τις προδιαγραφές του. Η διδακτορική διατριβή προτείνει τα ακόλουθα: (1) Silicon Debug: Η εργασία αποσκοπεί στην επιτάχυνση της διαδικασίας ανίχνευσης σφαλμάτων και στον αυτόματο εντοπισμό τυχαίων προγραμμάτων που δεν περιέχουν νέα -χρήσιμη- πληροφορία σχετικά με την αίτια ενός σφάλματος. Η κεντρική ιδέα αυτής της μεθόδου έγκειται στην αξιοποίηση της έμφυτης ποικιλομορφίας των αρχιτεκτονικών συνόλου εντολών και στην δυνατότητα από-διαμόρφωσης τμημάτων του κυκλώματος, (2) Manufacturing Testing: προτείνεται μία μέθοδο για την βελτιστοποίηση του έλεγχου ορθής λειτουργίας των πολυνηματικών και πολυπύρηνων επεξεργαστών μέσω της χρήση λογισμικού αυτοδοκιμής, (3) Ιn-field verification: Αναλύθηκε σε βάθος η επίδραση που έχουν τα μόνιμα σφάλματα σε μηχανισμούς αύξησης της απόδοσης. Επιπρόσθετα, προτάθηκαν τεχνικές για την ανίχνευση και ανοχή μόνιμων σφαλμάτων υλικού σε μηχανισμούς πρόβλεψης διακλάδωσης.Technology scaling, extreme chip integration and the compelling requirement to diminish the time-to-market window, has rendered microprocessors more prone to design bugs and hardware faults. Microprocessor validation is grouped into the following categories, based on where they intervene in a microprocessor’s lifecycle: (a) Silicon debug: the first hardware prototypes are exhaustively validated, (b) Μanufacturing testing: the final quality control during massive production, and (c) In-field verification: runtime error detection techniques to guarantee correct operation. The contributions of this thesis are the following: (1) Silicon debug: We propose the employment of deconfigurable microprocessor architectures along with a technique to generate self-checking random test programs to avoid the simulation step and triage the redundant debug sessions, (2) Manufacturing testing: We propose a self-test optimization strategy for multithreaded, multicore microprocessors to speedup test program execution time and enhance the fault coverage of hard errors; and (3) In-field verification: We measure the effect of permanent faults performance components. Then, we propose a set of low-cost mechanisms for the detection, diagnosis and performance recovery in the front-end speculative structures. This thesis introduces various novel methodologies to address the validation challenges posed throughout the life-cycle of a chip

Functional Testing of Processor Cores in FPGA-Based Applications

Embedded processor cores, which are widely used in SRAM-based FPGA applications, are candidates for SEU (Single Event Upset)-induced faults and need to be tested occasionally during system exploitation. Verifying a processor core is a difficult task, due to its complexity and the lack of user knowledge about the core-implementation details. In user applications, processor cores are normally tested by executing some kind of functional test in which the individual processor's instructions are tested with a set of deterministic test patterns, and the results are then compared with the stored reference values. For practical reasons the number of test patterns and corresponding results is usually small, which inherently leads to low fault coverage. In this paper we develop a concept that combines the whole instruction-set test into a compact test sequence, which can then be repeated with different input test patterns. This improves the fault coverage considerably with no additional memory requirements

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements