Cross-layer design of thermally-aware 2.5D systems

Over the past decade, CMOS technology scaling has slowed down. To sustain the historic performance improvement predicted by Moore's Law, in the mid-2000s the computing industry moved to using manycore systems and exploiting parallelism. The on-chip power densities of manycore systems, however, continued to increase after the breakdown of Dennard's Scaling. This leads to the `dark silicon' problem, whereby not all cores can operate at the highest frequency or can be turned on simultaneously due to thermal constraints. As a result, we have not been able to take full advantage of the parallelism in manycore systems. One of the 'More than Moore' approaches that is being explored to address this problem is integration of diverse functional components onto a substrate using 2.5D integration technology. 2.5D integration provides opportunities to exploit chiplet placement flexibility to address the dark silicon problem and mitigate the thermal stress of today's high-performance systems. These opportunities can be leveraged to improve the overall performance of the manycore heterogeneous computing systems. Broadly, this thesis aims at designing thermally-aware 2.5D systems. More specifically, to address the dark silicon problem of manycore systems, we first propose a single-layer thermally-aware chiplet organization methodology for homogeneous 2.5D systems. The key idea is to strategically insert spacing between the chiplets of a 2.5D manycore system to lower the operating temperature, and thus reclaim dark silicon by allowing more active cores and/or higher operating frequency under a temperature threshold. We investigate manufacturing cost and thermal behavior of 2.5D systems, then formulate and solve an optimization problem that jointly maximizes performance and minimizes manufacturing cost. We then enhance our methodology by incorporating a cross-layer co-optimization approach. We jointly maximize performance and minimize manufacturing cost and operating temperature across logical, physical, and circuit layers. We propose a novel gas-station link design that enables pipelining in passive interposers. We then extend our thermally-aware optimization methodology for network routing and chiplet placement of heterogeneous 2.5D systems, which consist of central processing unit (CPU) chiplets, graphics processing unit (GPU) chiplets, accelerator chiplets, and/or memory stacks. We jointly minimize the total wirelength and the system temperature. Our enhanced methodology increases the thermal design power budget and thereby improves thermal-constraint performance of the system

Integrated Photonic Reservoir Computing with All-Optical Readout

Integrated photonic reservoir computing has been demonstrated to be able to tackle different problems because of its neural network nature. A key advantage of photonic reservoir computing over other neuromorphic paradigms is its straightforward readout system, which facilitates both rapid training and robust, fabrication variation-insensitive photonic integrated hardware implementation for real-time processing. We present our recent development of a fully-optical, coherent photonic reservoir chip integrated with an optical readout system, capitalizing on these benefits. Alongside the integrated system, we also demonstrate a weight update strategy that is suitable for the integrated optical readout hardware. Using this online training scheme, we successfully solved 3-bit header recognition and delayed XOR tasks at 20 Gbps in real-time, all within the optical domain without excess delays

Principles, fundamentals, and applications of programmable integrated photonics

[EN] Programmable integrated photonics is an emerging new paradigm that aims at designing common integrated optical hardware resource configurations, capable of implementing an unconstrained variety of functionalities by suitable programming, following a parallel but not identical path to that of integrated electronics in the past two decades of the last century. Programmable integrated photonics is raising considerable interest, as it is driven by the surge of a considerable number of new applications in the fields of telecommunications, quantum information processing, sensing, and neurophotonics, calling for flexible, reconfigurable, low-cost, compact, and low-power-consuming devices that can cooperate with integrated electronic devices to overcome the limitation expected by the demise of Moore¿s Law. Integrated photonic devices exploiting full programmability are expected to scale from application-specific photonic chips (featuring a relatively low number of functionalities) up to very complex application-agnostic complex subsystems much in the same way as field programmable gate arrays and microprocessors operate in electronics. Two main differences need to be considered. First, as opposed to integrated electronics, programmable integrated photonics will carry analog operations over the signals to be processed. Second, the scale of integration density will be several orders of magnitude smaller due to the physical limitations imposed by the wavelength ratio of electrons and light wave photons. The success of programmable integrated photonics will depend on leveraging the properties of integrated photonic devices and, in particular, on research into suitable interconnection hardware architectures that can offer a very high spatial regularity as well as the possibility of independently setting (with a very low power consumption) the interconnection state of each connecting element. Integrated multiport interferometers and waveguide meshes provide regular and periodic geometries, formed by replicating unit elements and cells, respectively. In the case of waveguide meshes, the cells can take the form of a square, hexagon, or triangle, among other configurations. Each side of the cell is formed by two integrated waveguides connected by means of a Mach¿Zehnder interferometer or a tunable directional coupler that can be operated by means of an output control signal as a crossbar switch or as a variable coupler with independent power division ratio and phase shift. In this paper, we provide the basic foundations and principles behind the construction of these complex programmable circuits. We also review some practical aspects that limit the programming and scalability of programmable integrated photonics and provide an overview of some of the most salient applications demonstrated so far.European Research Council; Conselleria d'Educació, Investigació, Cultura i Esport; Ministerio de Ciencia, Innovación y Universidades; European Cooperation in Science and Technology; Horizon 2020 Framework Programme.Pérez-López, D.; Gasulla Mestre, I.; Dasmahapatra, P.; Capmany Francoy, J. (2020). Principles, fundamentals, and applications of programmable integrated photonics. Advances in Optics and Photonics. 12(3):709-786. https://doi.org/10.1364/AOP.387155709786123Lyke, J. C., Christodoulou, C. G., Vera, G. A., & Edwards, A. H. (2015). An Introduction to Reconfigurable Systems. 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Memory and information processing in neuromorphic systems

A striking difference between brain-inspired neuromorphic processors and current von Neumann processors architectures is the way in which memory and processing is organized. As Information and Communication Technologies continue to address the need for increased computational power through the increase of cores within a digital processor, neuromorphic engineers and scientists can complement this need by building processor architectures where memory is distributed with the processing. In this paper we present a survey of brain-inspired processor architectures that support models of cortical networks and deep neural networks. These architectures range from serial clocked implementations of multi-neuron systems to massively parallel asynchronous ones and from purely digital systems to mixed analog/digital systems which implement more biological-like models of neurons and synapses together with a suite of adaptation and learning mechanisms analogous to the ones found in biological nervous systems. We describe the advantages of the different approaches being pursued and present the challenges that need to be addressed for building artificial neural processing systems that can display the richness of behaviors seen in biological systems.Comment: Submitted to Proceedings of IEEE, review of recently proposed neuromorphic computing platforms and system

Decompose and Conquer: Addressing Evasive Errors in Systems on Chip

Modern computer chips comprise many components, including microprocessor cores, memory modules, on-chip networks, and accelerators. Such system-on-chip (SoC) designs are deployed in a variety of computing devices: from internet-of-things, to smartphones, to personal computers, to data centers. In this dissertation, we discuss evasive errors in SoC designs and how these errors can be addressed efficiently. In particular, we focus on two types of errors: design bugs and permanent faults. Design bugs originate from the limited amount of time allowed for design verification and validation. Thus, they are often found in functional features that are rarely activated. Complete functional verification, which can eliminate design bugs, is extremely time-consuming, thus impractical in modern complex SoC designs. Permanent faults are caused by failures of fragile transistors in nano-scale semiconductor manufacturing processes. Indeed, weak transistors may wear out unexpectedly within the lifespan of the design. Hardware structures that reduce the occurrence of permanent faults incur significant silicon area or performance overheads, thus they are infeasible for most cost-sensitive SoC designs. To tackle and overcome these evasive errors efficiently, we propose to leverage the principle of decomposition to lower the complexity of the software analysis or the hardware structures involved. To this end, we present several decomposition techniques, specific to major SoC components. We first focus on microprocessor cores, by presenting a lightweight bug-masking analysis that decomposes a program into individual instructions to identify if a design bug would be masked by the program's execution. We then move to memory subsystems: there, we offer an efficient memory consistency testing framework to detect buggy memory-ordering behaviors, which decomposes the memory-ordering graph into small components based on incremental differences. We also propose a microarchitectural patching solution for memory subsystem bugs, which augments each core node with a small distributed programmable logic, instead of including a global patching module. In the context of on-chip networks, we propose two routing reconfiguration algorithms that bypass faulty network resources. The first computes short-term routes in a distributed fashion, localized to the fault region. The second decomposes application-aware routing computation into simple routing rules so to quickly find deadlock-free, application-optimized routes in a fault-ridden network. Finally, we consider general accelerator modules in SoC designs. When a system includes many accelerators, there are a variety of interactions among them that must be verified to catch buggy interactions. To this end, we decompose such inter-module communication into basic interaction elements, which can be reassembled into new, interesting tests. Overall, we show that the decomposition of complex software algorithms and hardware structures can significantly reduce overheads: up to three orders of magnitude in the bug-masking analysis and the application-aware routing, approximately 50 times in the routing reconfiguration latency, and 5 times on average in the memory-ordering graph checking. These overhead reductions come with losses in error coverage: 23% undetected bug-masking incidents, 39% non-patchable memory bugs, and occasionally we overlook rare patterns of multiple faults. In this dissertation, we discuss the ideas and their trade-offs, and present future research directions.PHDComputer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/147637/1/doowon_1.pd

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Design of Optical Interconnect Transceiver Circuits and Network-on-chip Architectures for Inter- and Intra-chip Communication

The rapid expansion in data communication due to the increased multimedia applications and cloud computing services necessitates improvements in optical transceiver circuitry power efficiency as these systems scale well past 10 Gb/s. In order to meet these requirements, a 26 GHz transimpedance amplifier (TIA) is presented in a 0.25-µm SiGe BiCMOS technology. It employs a transformer-based regulated cascode (RGC) input stage which provides passive negative-feedback gain that enhances the effective transconductance of the TIA’s input common-base transistor; reducing the input resistance and pro- viding considerable bandwidth extension without significant noise degradation or power consumption. The TIA achieves a 53 dBΩ single-ended transimpedance gain with a 26√ GHz bandwidth and 21.3 pA/H z average input-referred noise current spectral density. Total chip power including output buffering is 28.2 mW from a 2.5 V supply, with the core TIA consuming 8.2 mW, and the chip area including pads is 960 µm × 780 µm. With the advance of photonic devices, optical interconnects becomes a promising technology to replace the conventional electrical channels for the high-bandwidth and power efficient inter/intra-chip interconnect. Second, a silicon photonic transceiver is presented for a silicon ring resonator-based optical interconnect architecture in a 1V standard 65nm CMOS technology. The transmitter circuits incorporate high-swing drivers with non-linear pre-emphasis and automatic bias-based tuning for resonance wavelength stabilization. An optical forwarded-clock adaptive inverter-based transimpedance amplifier (TIA) receiver trades-off power for varying link budgets by employing an on-die eye monitor and scaling the TIA supply for the required sensitivity. At 5 GB/s operation, the ring modulator un- der 4Vpp driver achieves 12.7dB extinction ratio with 4.04mW power consumption, while a 0.28nm tuning range is obtained at 6.8µW/GHz efficiency with the bias-based tuning scheme implemented with the 2Vpp transmitter. When tested with a wire-bonded 150f- F p-i-n photodetector, the receiver achieves -12.7dBm sensitivity at a BER=10−15 and consumes 2.2mW at 8 GB/s. Third, a novel Nano-Photonic Network-on-Chip (NoC) architecture, called LumiNoC, is proposed for high performance and power-efficient interconnects for the chip-multi- processors (CMPs). A 64-node LumiNoC under synthetic traffic enjoys 50% less latency at low loads versus other reported photonic NoCs, and ∼25% less latency versus the electrical 2D mesh NoCs on realistic workloads. Under the same ideal throughput, LumiNoC achieves laser power reduction of 78%, and overall power reduction of 44% versus competing designs

Photonic Interconnects Beyond High Bandwidth

The extraordinary growth of parallelism in high-performance computing requires efficient data communication for scaling compute performance. High-performance computing systems have been using photonic links for communication of large bandwidth-distance product during the last decade. Photonic interconnection networks, however, should not be a wire-for-wire replacement based on conventional electrical counterparts. Features of photonics beyond high bandwidth, such as transparent bandwidth steering, can implement important functionalities needed by applications. In another aspect, application characteristics can be exploited to design better photonic interconnects. Therefore, this thesis explores codesign opportunities at the intersection between photonic interconnect architectures and high-performance computing applications. The key accomplishments of this thesis, ranging from system level to node level, are as follows. Chapter 2 presents a system-level architecture that leverages photonic switching to enable a reconfigurable interconnect. The architecture, called Flexfly, reconfigures the inter-group level of the widely-used Dragonfly topology using information about the application’s communication pattern. It can steal additional direct bandwidth for communication-intensive group pairs. Simulations with applications such as GTC, Nekbone and LULESH show up to 1.8x speedup over Dragonfly paired with UGAL routing, along with halved hop count and latency for cross-group messages. To demonstrate the effectiveness of our approach, we built a 32-node Flexfly prototype using a silicon photonic switch connecting four groups and demonstrated 820 ns interconnect reconfiguration time. This is the first demonstration of silicon photonic switching and bandwidth steering in a high-performance computing cluster. Chapter 3 extends photonic switching to the node level and presents a reconfigurable silicon photonic memory interconnect for many-core architectures. The interconnect targets at important memory access issues, such as network-on-chip hot-spots and non-uniform memory access. Integrated with the processor through 2.5D/3D stacking, a fast-tunable silicon photonic memory tunnel can transparently direct traffic from any off-chip memory to any on-chip interface – thus alleviating the hot-spot and non-uniform access effects. We demonstrated the operation of our proposed architecture using a tunable laser, a 4-port silicon photonic switch (four wavelength-routed memory channels) and a 4x4 mesh network-on-chip synthesized by FPGA. The emulated system achieves a 15-ns channel switching time. Simulations based on a 12-core 4-memory model show that for such switching speeds the interconnect system can realize a 2x speedup for the STREAM benchmark in the hot-spot scenario and a reduction of execution time for data-intensive applications such as 3D stencil and K-means clustering by 23% and 17%, respectively. Chapters 4 explores application-level characteristics that can be exploited to hide photonic path setup delays. In view of the frequent reuse of optical circuits by many applications, we proposed a circuit-cached scheme that amortizes the setup overhead by maximizing circuit reuses. In order to improve circuit “hit” rates, we developed a reuse-distance based replacement policy called “Farthest Next Use”. We further investigated the tradeoffs between the realized hit rate and energy consumption. Finally, we experimentally demonstrated the feasibility of the proposed concept using silicon photonic devices in an FPGA-controlled network testbed. Chapter 5 proceeds to develop an application-guided circuit-prefetch scheme. By learning temporal locality and communication patterns from upper-layer applications, the scheme not only caches a set of circuits for reuses, but also proactively prefetches circuits based on predictions. We applied this technique to communication patterns from a spectrum of science and engineering applications. The results show that setup delays via circuit misses are significantly reduced, showing how the proposed technique can improve circuit switching in photonic interconnects