Low Voltage Low Power Analogue Circuits Design

Disertační práce je zaměřena na výzkum nejběžnějších metod, které se využívají při návrhu analogových obvodů s využití nízkonapěťových (LV) a nízkopříkonových (LP) struktur. Tyto LV LP obvody mohou být vytvořeny díky vyspělým technologiím nebo také využitím pokročilých technik návrhu. Disertační práce se zabývá právě pokročilými technikami návrhu, především pak nekonvenčními. Mezi tyto techniky patří využití prvků s řízeným substrátem (bulk-driven - BD), s plovoucím hradlem (floating-gate - FG), s kvazi plovoucím hradlem (quasi-floating-gate - QFG), s řízeným substrátem s plovoucím hradlem (bulk-driven floating-gate - BD-FG) a s řízeným substrátem s kvazi plovoucím hradlem (quasi-floating-gate - BD-QFG). Práce je také orientována na možné způsoby implementace známých a moderních aktivních prvků pracujících v napěťovém, proudovém nebo mix-módu. Mezi tyto prvky lze začlenit zesilovače typu OTA (operational transconductance amplifier), CCII (second generation current conveyor), FB-CCII (fully-differential second generation current conveyor), FB-DDA (fully-balanced differential difference amplifier), VDTA (voltage differencing transconductance amplifier), CC-CDBA (current-controlled current differencing buffered amplifier) a CFOA (current feedback operational amplifier). Za účelem potvrzení funkčnosti a chování výše zmíněných struktur a prvků byly vytvořeny příklady aplikací, které simulují usměrňovací a induktanční vlastnosti diody, dále pak filtry dolní propusti, pásmové propusti a také univerzální filtry. Všechny aktivní prvky a příklady aplikací byly ověřeny pomocí PSpice simulací s využitím parametrů technologie 0,18 m TSMC CMOS. Pro ilustraci přesného a účinného chování struktur je v disertační práci zahrnuto velké množství simulačních výsledků.The dissertation thesis is aiming at examining the most common methods adopted by analog circuits' designers in order to achieve low voltage (LV) low power (LP) configurations. The capability of LV LP operation could be achieved either by developed technologies or by design techniques. The thesis is concentrating upon design techniques, especially the non–conventional ones which are bulk–driven (BD), floating–gate (FG), quasi–floating–gate (QFG), bulk–driven floating–gate (BD–FG) and bulk–driven quasi–floating–gate (BD–QFG) techniques. The thesis also looks at ways of implementing structures of well–known and modern active elements operating in voltage–, current–, and mixed–mode such as operational transconductance amplifier (OTA), second generation current conveyor (CCII), fully–differential second generation current conveyor (FB–CCII), fully–balanced differential difference amplifier (FB–DDA), voltage differencing transconductance amplifier (VDTA), current–controlled current differencing buffered amplifier (CC–CDBA) and current feedback operational amplifier (CFOA). In order to confirm the functionality and behavior of these configurations and elements, they have been utilized in application examples such as diode–less rectifier and inductance simulations, as well as low–pass, band–pass and universal filters. All active elements and application examples have been verified by PSpice simulator using the 0.18 m TSMC CMOS parameters. Sufficient numbers of simulated plots are included in this thesis to illustrate the precise and strong behavior of structures.

Circuits and Systems Advances in Near Threshold Computing

Modern society is witnessing a sea change in ubiquitous computing, in which people have embraced computing systems as an indispensable part of day-to-day existence. Computation, storage, and communication abilities of smartphones, for example, have undergone monumental changes over the past decade. However, global emphasis on creating and sustaining green environments is leading to a rapid and ongoing proliferation of edge computing systems and applications. As a broad spectrum of healthcare, home, and transport applications shift to the edge of the network, near-threshold computing (NTC) is emerging as one of the promising low-power computing platforms. An NTC device sets its supply voltage close to its threshold voltage, dramatically reducing the energy consumption. Despite showing substantial promise in terms of energy efficiency, NTC is yet to see widescale commercial adoption. This is because circuits and systems operating with NTC suffer from several problems, including increased sensitivity to process variation, reliability problems, performance degradation, and security vulnerabilities, to name a few. To realize its potential, we need designs, techniques, and solutions to overcome these challenges associated with NTC circuits and systems. The readers of this book will be able to familiarize themselves with recent advances in electronics systems, focusing on near-threshold computing

Microarchitectural Low-Power Design Techniques for Embedded Microprocessors

With the omnipresence of embedded processing in all forms of electronics today, there is a strong trend towards wireless, battery-powered, portable embedded systems which have to operate under stringent energy constraints. Consequently, low power consumption and high energy efficiency have emerged as the two key criteria for embedded microprocessor design. In this thesis we present a range of microarchitectural low-power design techniques which enable the increase of performance for embedded microprocessors and/or the reduction of energy consumption, e.g., through voltage scaling. In the context of cryptographic applications, we explore the effectiveness of instruction set extensions (ISEs) for a range of different cryptographic hash functions (SHA-3 candidates) on a 16-bit microcontroller architecture (PIC24). Specifically, we demonstrate the effectiveness of light-weight ISEs based on lookup table integration and microcoded instructions using finite state machines for operand and address generation. On-node processing in autonomous wireless sensor node devices requires deeply embedded cores with extremely low power consumption. To address this need, we present TamaRISC, a custom-designed ISA with a corresponding ultra-low-power microarchitecture implementation. The TamaRISC architecture is employed in conjunction with an ISE and standard cell memories to design a sub-threshold capable processor system targeted at compressed sensing applications. We furthermore employ TamaRISC in a hybrid SIMD/MIMD multi-core architecture targeted at moderate to high processing requirements (> 1 MOPS). A range of different microarchitectural techniques for efficient memory organization are presented. Specifically, we introduce a configurable data memory mapping technique for private and shared access, as well as instruction broadcast together with synchronized code execution based on checkpointing. We then study an inherent suboptimality due to the worst-case design principle in synchronous circuits, and introduce the concept of dynamic timing margins. We show that dynamic timing margins exist in microprocessor circuits, and that these margins are to a large extent state-dependent and that they are correlated to the sequences of instruction types which are executed within the processor pipeline. To perform this analysis we propose a circuit/processor characterization flow and tool called dynamic timing analysis. Moreover, this flow is employed in order to devise a high-level instruction set simulation environment for impact-evaluation of timing errors on application performance. The presented approach improves the state of the art significantly in terms of simulation accuracy through the use of statistical fault injection. The dynamic timing margins in microprocessors are then systematically exploited for throughput improvements or energy reductions via our proposed instruction-based dynamic clock adjustment (DCA) technique. To this end, we introduce a 6-stage 32-bit microprocessor with cycle-by-cycle DCA. Besides a comprehensive design flow and simulation environment for evaluation of the DCA approach, we additionally present a silicon prototype of a DCA-enabled OpenRISC microarchitecture fabricated in 28 nm FD-SOI CMOS. The test chip includes a suitable clock generation unit which allows for cycle-by-cycle DCA over a wide range with fine granularity at frequencies exceeding 1 GHz. Measurement results of speedups and power reductions are provided

Efficient and Linear CMOS Power Amplifier and Front-end Design for Broadband Fully-Integrated 28-GHz 5G Phased Arrays

Demand for data traffic on mobile networks is growing exponentially with time and on a global scale. The emerging fifth-generation (5G) wireless standard is being developed with millimeter-wave (mm-Wave) links as a key technological enabler to address this growth by a 2020 time frame. The wireless industry is currently racing to deploy mm-Wave mobile services, especially in the 28-GHz band. Previous widely-held perceptions of fundamental propagation limitations were overcome using phased arrays. Equally important for success of 5G is the development of low-power, broadband user equipment (UE) radios in commercial-grade technologies. This dissertation demonstrates design methodologies and circuit techniques to tackle the critical challenge of key phased array front-end circuits in low-cost complementary metal oxide semiconductor (CMOS) technology. Two power amplifier (PA) proof-of-concept prototypes are implemented in deeply scaled 28- nm and 40-nm CMOS processes, demonstrating state-of-the-art linearity and efficiency for extremely broadband communication signals. Subsequently, the 40 nm PA design is successfully embedded into a low-power fully-integrated transmit-receive front-end module. The 28 nm PA prototype in this dissertation is the first reported linear, bulk CMOS PA targeting low-power 5G mobile UE integrated phased array transceivers. An optimization methodology is presented to maximizing power added efficiency (PAE) in the PA output stage at a desired error vector magnitude (EVM) and range to address challenging 5G uplink requirements. Then, a source degeneration inductor in the optimized output stage is shown to further enable its embedding into a two-stage transformer-coupled PA. The inductor helps by broadening inter-stage impedance matching bandwidth, and helping to reduce distortion. Designed and fabricated in 1P7M 28 nm bulk CMOS and using a 1 V supply, the PA achieves +4.2 dBm/9% measured Pout/PAE at −25 dBc EVM for a 250 MHz-wide, 64-QAM orthogonal frequency division multiplexing (OFDM) signal with 9.6 dB peak-to-average power ratio (PAPR). The PA also achieves 35.5%/10% PAE for continuous wave signals at saturation/9.6dB back-off from saturation. To the best of the author’s knowledge, these are the highest measured PAE values among published K- and K a-band CMOS PAs to date. To drastically extend the communication bandwidth in 28 GHz-band UE devices, and to explore the potential of CMOS technology for more demanding access point (AP) devices, the second PA is demonstrated in a 40 nm process. This design supports a signal radio frequency bandwidth (RFBW) >3× the state-of-the-art without degrading output power (i.e. range), PAE (i.e. battery life), or EVM (i.e. amplifier fidelity). The three-stage PA uses higher-order, dual-resonance transformer matching networks with bandwidths optimized for wideband linearity. Digital gain control of 9 dB range is integrated for phased array operation. The gain control is a needed functionality, but it is largely absent from reported high-performance mm-Wave PAs in the literature. The PA is fabricated in a 1P6M 40 nm CMOS LP technology with 1.1 V supply, and achieves Pout/PAE of +6.7 dBm/11% for an 8×100 MHz carrier aggregation 64-QAM OFDM signal with 9.7 dB PAPR. This PA therefore is the first to demonstrate the viability of CMOS technology to address even the very challenging 5G AP/downlink signal bandwidth requirement. Finally, leveraging the developed PA design methodologies and circuits, a low power transmit-receive phased array front-end module is fully integrated in 40 nm technology. In transmit-mode, the front-end maintains the excellent performance of the 40 nm PA: achieving +5.5 dBm/9% for the same 8×100 MHz carrier aggregation signal above. In receive-mode, a 5.5 dB noise figure (NF) and a minimum third-order input intercept point (IIP₃) of −13 dBm are achieved. The performance of the implemented CMOS frontend is comparable to state-of-the-art publications and commercial products that were very recently developed in silicon germanium (SiGe) technologies for 5G communication

Integrated Circuits for Medical Ultrasound Applications: Imaging and Beyond

Medical ultrasound has become a crucial part of modern society and continues to play a vital role in the diagnosis and treatment of illnesses. Over the past decades, the develop- ment of medical ultrasound has seen extraordinary progress as a result of the tremendous research advances in microelectronics, transducer technology and signal processing algorithms. How- ever, medical ultrasound still faces many challenges including power-efficient driving of transducers, low-noise recording of ultrasound echoes, effective beamforming in a non-linear, high- attenuation medium (human tissues) and reduced overall form factor. This paper provides a comprehensive review of the design of integrated circuits for medical ultrasound applications. The most important and ubiquitous modules in a medical ultrasound system are addressed, i) transducer driving circuit, ii) low- noise amplifier, iii) beamforming circuit and iv) analog-digital converter. Within each ultrasound module, some representative research highlights are described followed by a comparison of the state-of-the-art. This paper concludes with a discussion and recommendations for future research directions

Analog Front-End Circuits for Massive Parallel 3-D Neural Microsystems.

Understanding dynamics of the brain has tremendously improved due to the progress in neural recording techniques over the past five decades. The number of simultaneously recorded channels has actually doubled every 7 years, which implies that a recording system with a few thousand channels should be available in the next two decades. Nonetheless, a leap in the number of simultaneous channels has remained an unmet need due to many limitations, especially in the front-end recording integrated circuits (IC). This research has focused on increasing the number of simultaneously recorded channels and providing modular design approaches to improve the integration and expansion of 3-D recording microsystems. Three analog front-ends (AFE) have been developed using extremely low-power and small-area circuit techniques on both the circuit and system levels. The three prototypes have investigated some critical circuit challenges in power, area, interface, and modularity. The first AFE (16-channels) has optimized energy efficiency using techniques such as moderate inversion, minimized asynchronous interface for data acquisition, power-scalable sampling operation, and a wide configuration range of gain and bandwidth. Circuits in this part were designed in a 0.25μm CMOS process using a 0.9-V single supply and feature a power consumption of 4μW/channel and an energy-area efficiency of 7.51x10^15 in units of J^-1Vrms^-1mm^-2. The second AFE (128-channels) provides the next level of scaling using dc-coupled analog compression techniques to reject the electrode offset and reduce the implementation area further. Signal processing techniques were also explored to transfer some computational power outside the brain. Circuits in this part were designed in a 180nm CMOS process using a 0.5-V single supply and feature a power consumption of 2.5μW/channel, and energy-area efficiency of 30.2x10^15 J^-1Vrms^-1mm^-2. The last AFE (128-channels) shows another leap in neural recording using monolithic integration of recording circuits on the shanks of neural probes. Monolithic integration may be the most effective approach to allow simultaneous recording of more than 1,024 channels. The probe and circuits in this part were designed in a 150 nm SOI CMOS process using a 0.5-V single supply and feature a power consumption of only 1.4μW/channel and energy-area efficiency of 36.4x10^15 J^-1Vrms^-1mm^-2.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/98070/1/ashmouny_1.pd

FDSOI Design using Automated Standard-Cell-Grained Body Biasing

With the introduction of FDSOI processes at competitive technology nodes, body biasing on an unprecedented scale was made possible. Body biasing influences one of the central transistor characteristics, the threshold voltage. By being able to heighten or lower threshold voltage by more than 100mV, the very physics of transistor switching can be manipulated at run time. Furthermore, as body biasing does not lead to different signal levels, it can be applied much more fine-grained than, e.g., DVFS. With the state of the art mainly focused on combinations of body biasing with DVFS, it has thus ignored granularities unfeasible for DVFS. This thesis fills this gap by proposing body bias domain partitioning techniques and for body bias domain partitionings thereby generated, algorithms that search for body bias assignments. Several different granularities ranging from entire cores to small groups of standard cells were examined using two principal approaches: Designer aided pre-partitioning based determination of body bias domains and a first-time, fully automatized, netlist based approach called domain candidate exploration. Both approaches operate along the lines of activation and timing of standard cell groups. These approaches were evaluated using the example of a Dynamically Reconfigurable Processor (DRP), a highly efficient category of reconfigurable architectures which consists of an array of processing elements and thus offers many opportunities for generalization towards many-core architectures. Finally, the proposed methods were validated by manufacturing a test-chip. Extensive simulation runs as well as the test-chip evaluation showed the validity of the proposed methods and indicated substantial improvements in energy efficiency compared to the state of the art. These improvements were accomplished by the fine-grained partitioning of the DRP design. This method allowed reducing dynamic power through supply voltage levels yielding higher clock frequencies using forward body biasing, while simultaneously reducing static power consumption in unused parts.Die Einführung von FDSOI Prozessen in gegenwärtigen Prozessgrößen ermöglichte die Nutzung von Substratvorspannung in nie zuvor dagewesenem Umfang. Substratvorspannung beeinflusst unter anderem eine zentrale Eigenschaft von Transistoren, die Schwellspannung. Mittels Substratvorspannung kann diese um mehr als 100mV erhöht oder gesenkt werden, was es ermöglicht, die schiere Physik des Schaltvorgangs zu manipulieren. Da weiterhin hiervon der Signalpegel der digitalen Signale unberührt bleibt, kann diese Technik auch in feineren Granularitäten angewendet werden, als z.B. Dynamische Spannungs- und Frequenz Anpassung (Engl. Dynamic Voltage and Frequency Scaling, Abk. DVFS). Da jedoch der Stand der Technik Substratvorspannung hauptsächlich in Kombinationen mit DVFS anwendet, werden feinere Granularitäten, welche für DVFS nicht mehr wirtschaftlich realisierbar sind, nicht berücksichtigt. Die vorliegende Arbeit schließt diese Lücke, indem sie Partitionierungsalgorithmen zur Unterteilung eines Entwurfs in Substratvorspannungsdomänen vorschlägt und für diese hierdurch unterteilten Domänen entsprechende Substratvorspannungen berechnet. Hierzu wurden verschiedene Granularitäten berücksichtigt, von ganzen Prozessorkernen bis hin zu kleinen Gruppen von Standardzellen. Diese Entwürfe wurden dann mit zwei verschiedenen Herangehensweisen unterteilt: Chipdesigner unterstützte, vorpartitionierungsbasierte Bestimmung von Substratvorspannungsdomänen, sowie ein erstmals vollautomatisierter, Netzlisten basierter Ansatz, in dieser Arbeit Domänen Kandidaten Exploration genannt. Beide Ansätze funktionieren nach dem Prinzip der Aktivierung, d.h. zu welchem Zeitpunkt welcher Teil des Entwurfs aktiv ist, sowie der Signallaufzeit durch die entsprechenden Entwurfsteile. Diese Ansätze wurden anhand des Beispiels Dynamisch Rekonfigurierbarer Prozessoren (DRP) evaluiert. DRPs stellen eine Klasse hocheffizienter rekonfigurierbarer Architekturen dar, welche hauptsächlich aus einem Feld von Rechenelementen besteht und dadurch auch zahlreiche Möglichkeiten zur Verallgemeinerung hinsichtlich Many-Core Architekturen zulässt. Schließlich wurden die vorgeschlagenen Methoden in einem Testchip validiert. Alle ermittelten Ergebnisse zeigen im Vergleich zum Stand der Technik drastische Verbesserungen der Energieeffizienz, welche durch die feingranulare Unterteilung in Substratvorspannungsdomänen erzielt wurde. Hierdurch konnten durch die Anwendung von Substratvorspannung höhere Taktfrequenzen bei gleicher Versorgungsspannung erzielt werden, während zeitgleich in zeitlich unkritischen oder ungenutzten Entwurfsteilen die statische Leistungsaufnahme minimiert wurde