Advances in Solid State Circuit Technologies

This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields

An Ultra-Low-Power Track-and-Hold Amplifier

The future of electronics is the Internet of Things (IoT) paradigm, where always-on devices and sensors monitor and transform everyday life. A plethora of applications (such as navigating drivers past road hazards or monitoring bridge and building stresses) employ this technology. These unattended ground-sensor applications require decade(s)-long operational life-times without battery changes. Such electronics demand stringent performance specifications with only nano-Watt power levels.This thesis presents an ultra-low-power track-and-hold amplifier for such systems. It serves as the front-end of a SAR-ADC or the building block for equalizers or filters. This amplifier\u27s design attains exceptional hold times by mitigating switch subthreshold leakage and bulk leakage. Its novel transmission-gate topology achieves wide-swing performance. Though only consuming 100 pico-Watts, it achieves a precision of 7.6 effective number of bits (ENOB). The track-and-hold amplifier was designed in 130-nm CMOS

Power Management Circuits for Front-End ASICs Employed in High Energy Physics Applications

The instrumentation of radiation detectors for high energy physics calls for the development of very low-noise application-specific integrated-circuits and demanding system-level design strategies, with a particular focus on the minimisation of inter-ference noise from power anagement circuitry. On the other hand, the aggressive pixelisation of sensors and associated front-end electronics, and the high radiation exposure at the innermost tracking and vertex detectors, requires radiation-aware design and radiation-tolerant deep sub-micron CMOS technologies. This thesis explores circuit design techniques towards radiation tolerant power management integrated circuits, targeting applications on particle detectors and monitoring of accelerator-based experiments, aerospace and nuclear applications. It addresses advantages and caveats of commonly used radiation-hard layout techniques, which often employ Enclosed Layout or H-shaped transistors, in respect to the use of linear transistors. Radiation tolerant designs for bandgap circuits are discussed, and two different topologies were explored. A low quiescent current bandgap for sub-1 V CMOS circuits is proposed, where the use of diode-connected MOSFETs in weak-inversion is explored in order to increase its radiation tolerance. An any-load stable LDO architecture is proposed, and three versions of the design using different layout techniques were implemented and characterised. In addition, a switched DC-DC Buck converter is also studied. For reasons concerning testability and silicon area, the controller of the Buck converter is on-chip, while the inductance and the power transistors are left on-board. A prototype test chip with power management IP blocks was fabricated, using a TSMC 65 nm CMOS technology. The chip features Linear, ELT and H-shape LDO designs, bandgap circuits and a Buck DC-DC converter. We discuss the design, layout and test results of the prototype. The specifications in terms of voltage range and output current capability are based on the requirements set for the integrated on-detector electronics of the new CGEM-IT tracker for the BESIII detector. The thesis discusses the fundamental aspects of the proposed on-detector electronics and provides an in-depth depiction of the front-end design for the readout ASIC

LOW POWER AND HIGH SIGNAL TO NOISE RATIO BIO-MEDICAL AFE DESIGN TECHNIQUES

The research work described in this thesis was focused on finding novel techniques to implement a low-power and noise Bio-Medical Analog Front End (BMEF) circuit technique to enable high-quality Electrocardiography (ECG) sensing. Usually, an ECG signal and several bio-medical signals are sensed from the human body through a pair of electrodes. The electrical characteristics of the very small amplitude (1u-10mV) signals are corrupted by random noise and have a significant dc offset. 50/60Hz power supply coupling noise is one of the biggest cross-talk signals compared to the thermally generated random noise. These signals are even AFE composed of an Instrumentation Amplifier (IA), which will have a better Common Mode rejection ratio (CMRR). The main function of the AFE is to convert the weak electrical Signal into large signals whose amplitude is large enough for an Analog Digital Converter (ADC) to detect without having any errors. A Variable Gain Amplifier (VGA) is sometimes required to adjust signal amplitude to maintain the dynamic range of the ADC. Also, the Bio-medical transceiver needs an accurate and temperature-independent reference voltage and current for the ADC, commonly known as Bandgap Reference Circuit (BGR). These circuits need to consume as low power as possible to enable these circuits to be powered from the battery. The work started with analysing the existing circuit techniques for the circuits mentioned above and finding the key important improvements required to reach the target specifications. Previously proposed IA is generated based on voltage mode signal processing. To improve the CMRR (119dB), we proposed a current mode-based IA with an embedded DC cancellation technique. State-of-the-art VGA circuits were built based on the degeneration principle of the differential pair, which will enable the variable gain purpose, but none of these techniques discussed linearity improvement, which is very important in modern CMOS technologies. This work enhances the total Harmonic distortion (THD) by 21dB in the worst case by exploiting the feedback techniques around the differential pair. Also, this work proposes a low power curvature compensated bandgap with 2ppm/0C temperature sensitivity while consuming 12.5uW power from a 1.2V dc power supply. All circuits were built in 45nm TSMC-CMOS technology and simulated with all the performance metrics with Cadence (spectre) simulator. The circuit layout was carried out to study post-layout parasitic effect sensitivity

HIGH PERFORMANCE CMOS WIDE-BAND RF FRONT-END WITH SUBTHRESHOLD OUT OF BAND SENSING

In future, the radar/satellite wireless communication devices must support multiple standards and should be designed in the form of system-on-chip (SoC) so that a significant reduction happen on cost, area, pins, and power etc. However, in such device, the design of a fully on-chip CMOS wideband receiver front-end that can process several radar/satellite signal simultaneously becomes a multifold complex problem. Further, the inherent high-power out-of-band (OB) blockers in radio spectrum will make the receiver more non-linear, even sometimes saturate the receiver. Therefore, the proper blocker rejection techniques need to be incorporated. The primary focus of this research work is the development of a CMOS high-performance low noise wideband receiver architecture with a subthreshold out of band sensing receiver. Further, the various reconfigurable mixer architectures are proposed for performance adaptability of a wideband receiver for incoming standards. Firstly, a high-performance low- noise bandwidthenhanced fully differential receiver is proposed. The receiver composed of a composite transistor pair noise canceled low noise amplifier (LNA), multi-gate-transistor (MGTR) trans-conductor amplifier, and passive switching quad followed by Tow Thomas bi-quad second order filter based tarns-impedance amplifier. An inductive degenerative technique with low-VT CMOS architecture in LNA helps to improve the bandwidth and noise figure of the receiver. The full receiver system is designed in UMC 65nm CMOS technology and measured. The packaged LNA provides a power gain 12dB (including buffer) with a 3dB bandwidth of 0.3G – 3G, noise figure of 1.8 dB having a power consumption of 18.75mW with an active area of 1.2mm*1mm. The measured receiver shows 37dB gain at 5MHz IF frequency with 1.85dB noise figure and IIP3 of +6dBm, occupies 2mm*1.2mm area with 44.5mW of power consumption. Secondly, a 3GHz-5GHz auxiliary subthreshold receiver is proposed to estimate the out of blocker power. As a redundant block in the system, the cost and power minimization of the auxiliary receiver are achieved via subthreshold circuit design techniques and implementing the design in higher technology node (180nm CMOS). The packaged auxiliary receiver gives a voltage gain of 20dB gain, the noise figure of 8.9dB noise figure, IIP3 of -10dBm and 2G-5GHz bandwidth with 3.02mW power consumption. As per the knowledge, the measured results of proposed main-high-performancereceiver and auxiliary-subthreshold-receiver are best in state of art design. Finally, the various viii reconfigurable mixers architectures are proposed to reconfigure the main-receiver performance according to the requirement of the selected communication standard. The down conversion mixers configurability are in the form of active/passive and Input (RF) and output (IF) bandwidth reconfigurability. All designs are simulated in 65nm CMOS technology. To validate the concept, the active/ passive reconfigurable mixer configuration is fabricated and measured. Measured result shows a conversion gain of 29.2 dB and 25.5 dB, noise figure of 7.7 dB and 10.2 dB, IIP3 of -11.9 dBm and 6.5 dBm in active and passive mode respectively. It consumes a power 9.24mW and 9.36mW in passive and active case with a bandwidth of 1 to 5.5 GHz and 0.5 to 5.1 GHz for active/passive case respectively

Analog integrated circuit design in ultra-thin oxide CMOS technologies with significant direct tunneling-induced gate current

The ability to do mixed-signal IC design in a CMOS technology has been a driving force for manufacturing personal mobile electronic products such as cellular phones, digital audio players, and personal digital assistants. As CMOS has moved to ultra-thin oxide technologies, where oxide thicknesses are less than 3 nm, this type of design has been threatened by the direct tunneling of carriers though the gate oxide. This type of tunneling, which increases exponentially with decreasing oxide thickness, is a source of MOSFET gate current. Its existence invalidates the simplifying design assumption of infinite gate resistance. Its problems are typically avoided by switching to a high-&kappa/metal gate technology or by including a second thick(er) oxide transistor. Both of these solutions come with undesirable increases in cost due to extra mask and processing steps. Furthermore, digital circuit solutions to the problems created by direct tunneling are available, while analog circuit solutions are not. Therefore, it is desirable that analog circuit solutions exist that allow the design of mixed-signal circuits with ultra-thin oxide MOSFETs. This work presents a methodology that develops these solutions as a less costly alternative to high-&kappa/metal gate technologies or thick(er) oxide transistors. The solutions focus on transistor sizing, DC biasing, and the design of current mirrors and differential amplifiers. They attempt to minimize, balance, and cancel the negative effects of direct tunneling on analog design in traditional (non-high-&kappa/metal gate) ultra-thin oxide CMOS technologies. They require only ultra-thin oxide devices and are investigated in a 65 nm CMOS technology with a nominal VDD of 1 V and a physical oxide thickness of 1.25 nm. A sub-1 V bandgap voltage reference that requires only ultra-thin oxide MOSFETs is presented (TC = 251.0 ppm/°C). It utilizes the developed methodology and illustrates that it is capable of suppressing the negative effects of direct tunneling. Its performance is compared to a thick-oxide voltage reference as a means of demonstrating that ultra-thin oxide MOSFETs can be used to build the analog component of a mixed-signal system

Electrochemical noise limits of femtoampere-sensing, CMOS-integrated transimpedance amplifiers

Low-noise operational amplifiers are an important tool in the life sciences. Biosensor measurements typically rely on low-noise transimpedance amplifiers to record biological signals. Two different techniques were used to leverage the advantages of low-noise circuitry for bioelectronics. A CMOS-integrated system for measuring redox-active substrates using electrochemical read-out at very low noise levels is presented. The system incorporates 112 amplifier channels capable of current sensing with noise levels below 1 fArms in a 3.5-Hz bandwidth. The amplifier is externally connected to a gold microelectrode with a radius of 15 µm. The amplifier enables measurement of redox-couples such as potassium ferrocyanide/ferricyanide with concentrations down to 10 nM at current levels of only 300 fA. The electrochemical noise that sets the limits of detection is also measured and analyzed based on redox mass transfer equation and electrochemical impedance spectroscopy. Secondly, CMOS-integrated low noise junction field-effect transistors (JFETs) were developed in a standard 0.18-µm CMOS process. These JFETs reduce input referred flicker noise power by more than a factor of 10 when compared with equally sized n-channel MOS devices by eliminating oxide interfaces in contact with the channel. We show that this improvement in device performance translates into a factor-of-10 reduction in the input-referred noise of integrated CMOS operational amplifiers when JFET devices are used at the input

Fast offset compensation for a 10Gbps limit amplifier

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2004.Includes bibliographical references (p. 117-118).A novel offset voltage compensation method is presented that significantly modifies the existing tradeoff between control loop bandwidth, and therefore total compensation time, and total output jitter. The proposed system achieves comparable output jitter performance to traditional approaches while significantly reducing the total compensation time by nearly three orders of magnitude. Traditional offset compensation methods are based on simple offset measurement techniques that generally rely on passive compensation blocks and exhibit a direct inverse relationship between total compensation time and resulting output jitter. Therefore, current high-speed data-link systems suffer from extremely long offset compensation loop settling times in order to satisfy the strict protocol jitter specifications. In the proposed system, the new CMOS peak detector design is the enabling component that allows us break this relationship and achieve extremely fast settling behavior while preventing data dependence of the control signal. Simulated results show that the implemented system can achieve output jitter performance similar to existing methods while dramatically improving the compensation time. Specifically, the proposed system can achieve less than 2pS of peak-to-peak jitter, or less than 700fS of RMS jitter, while reducing the total compensation time from roughly 500[mu]S to less than 1[mu]S. The system was implemented in National Semiconductor's CMOS9 0.18[mu]m CMOS process. Packaged parts will be tested to verify agreement with simulated performance.by Ethan A. Crain.M.Eng