Enhancing Power Efficient Design Techniques in Deep Submicron Era

Excessive power dissipation has been one of the major bottlenecks for design and manufacture in the past couple of decades. Power efficient design has become more and more challenging when technology scales down to the deep submicron era that features the dominance of leakage, the manufacture variation, the on-chip temperature variation and higher reliability requirements, among others. Most of the computer aided design (CAD) tools and algorithms currently used in industry were developed in the pre deep submicron era and did not consider the new features explicitly and adequately. Recent research advances in deep submicron design, such as the mechanisms of leakage, the source and characterization of manufacture variation, the cause and models of on-chip temperature variation, provide us the opportunity to incorporate these important issues in power efficient design. We explore this opportunity in this dissertation by demonstrating that significant power reduction can be achieved with only minor modification to the existing CAD tools and algorithms. First, we consider peak current, which has become critical for circuit's reliability in deep submicron design. Traditional low power design techniques focus on the reduction of average power. We propose to reduce peak current while keeping the overhead on average power as small as possible. Second, dual Vt technique and gate sizing have been used simultaneously for leakage savings. However, this approach becomes less effective in deep submicron design. We propose to use the newly developed process-induced mechanical stress to enhance its performance. Finally, in deep submicron design, the impact of on-chip temperature variation on leakage and performance becomes more and more significant. We propose a temperature-aware dual Vt approach to alleviate hot spots and achieve further leakage reduction. We also consider this leakage-temperature dependency in the dynamic voltage scaling approach and discover that a commonly accepted result is incorrect for the current technology. We conduct extensive experiments with popular design benchmarks, using the latest industry CAD tools and design libraries. The results show that our proposed enhancements are promising in power saving and are practical to solve the low power design challenges in deep submicron era

로직 및 피지컬 합성에서의 타이밍 분석과 최적화

학위논문 (박사) -- 서울대학교 대학원 : 공과대학 전기·정보공학부, 2020. 8. 김태환.Timing analysis is one of the necessary steps in the development of a semiconductor circuit. In addition, it is increasingly important in the advanced process technologies due to various factors, including the increase of process–voltage–temperature variation. This dissertation addresses three problems related to timing analysis and optimization in logic and physical synthesis. Firstly, most static timing analysis today are based on conventional fixed flip-flop timing models, in which every flip-flop is assumed to have a fixed clock-to-Q delay. However, setup and hold skews affect the clock-to-Q delay in reality. In this dissertation, I propose a mathematical formulation to solve the problem and apply it to the clock skew scheduling problems as well as to the analysis of a given circuit, with a scalable speedup technique. Secondly, near-threshold computing is one of the promising concepts for energy-efficient operation of VLSI systems, but wide performance variation and nonlinearity to process variations block the proliferation. To cope with this, I propose a holistic hardware performance monitoring methodology for accurate timing prediction in a near-threshold voltage regime and advanced process technology. Lastly, an asynchronous circuit is one of the alternatives to the conventional synchronous style, and asynchronous pipeline circuit especially attractive because of its small design effort. This dissertation addresses the synthesis problem of lightening two-phase bundled-data asynchronous pipeline controllers, in which delay buffers are essential for guaranteeing the correct handshaking operation but incurs considerable area increase.타이밍 분석은 반도체 회로 개발 필수 과정 중 하나로, 최신 공정일수록 공정-전압-온도 변이 증가를 포함한 다양한 요인으로 하여금 그 중요성이 커지고 있다. 본 논문에서는 로직 및 피지컬 합성과 관련하여 세 가지 타이밍 분석 및 최적화 문제에 대해 다룬다. 첫째로, 오늘날 대부분의 정적 타이밍 분석은 모든 플립-플롭의 클럭-출력 딜레이가 고정된 값이라는 가정을 바탕으로 이루어졌다. 하지만 실제 클럭-출력 딜레이는 해당 플립-플롭의 셋업 및 홀드 스큐에 영향을 받는다. 본 논문에서는 이러한 특성을 수학적으로 정리하였으며, 이를 확장 가능한 속도 향상 기법과 더불어 주어진 회로의 타이밍 분석 및 클럭 스큐 스케쥴링 문제에 적용하였다. 둘째로, 유사 문턱 연산은 초고집적 회로 동작의 에너지 효율을 끌어 올릴 수 있다는 점에서 각광받지만, 큰 폭의 성능 변이 및 비선형성 때문에 널리 활용되고 있지 않다. 이를 해결하기 위해 유사 문턱 전압 영역 및 최신 공정 노드에서 보다 정확한 타이밍 예측을 위한 하드웨어 성능 모니터링 방법론 전반을 제안하였다. 마지막으로, 비동기 회로는 기존 동기 회로의 대안 중 하나로, 그 중에서도 비동기 파이프라인 회로는 비교적 적은 설계 노력만으로도 구현 가능하다는 장점이 있다. 본 논문에서는 2위상 묶음 데이터 프로토콜 기반 비동기 파이프라인 컨트롤러 상에서, 정확한 핸드셰이킹 통신을 위해 삽입된 딜레이 버퍼에 의한 면적 증가를 완화할 수 있는 합성 기법을 제시하였다.1 INTRODUCTION 1 1.1 Flexible Flip-Flop Timing Model 1 1.2 Hardware Performance Monitoring Methodology 4 1.3 Asynchronous Pipeline Controller 10 1.4 Contributions of this Dissertation 15 2 ANALYSIS AND OPTIMIZATION CONSIDERING FLEXIBLE FLIP-FLOP TIMING MODEL 17 2.1 Preliminaries 17 2.1.1 Terminologies 17 2.1.2 Timing Analysis 20 2.1.3 Clock-to-Q Delay Surface Modeling 21 2.2 Clock-to-Q Delay Interval Analysis 22 2.2.1 Derivation 23 2.2.2 Additional Constraints 26 2.2.3 Analysis: Finding Minimum Clock Period 28 2.2.4 Optimization: Clock Skew Scheduling 30 2.2.5 Scalable Speedup Technique 33 2.3 Experimental Results 37 2.3.1 Application to Minimum Clock Period Finding 37 2.3.2 Application to Clock Skew Scheduling 39 2.3.3 Efficacy of Scalable Speedup Technique 43 2.4 Summary 44 3 HARDWARE PERFORMANCE MONITORING METHODOLOGY AT NTC AND ADVANCED TECHNOLOGY NODE 45 3.1 Overall Flow of Proposed HPM Methodology 45 3.2 Prerequisites to HPM Methodology 47 3.2.1 BEOL Process Variation Modeling 47 3.2.2 Surrogate Model Preparation 49 3.3 HPM Methodology: Design Phase 52 3.3.1 HPM2PV Model Construction 52 3.3.2 Optimization of Monitoring Circuits Configuration 54 3.3.3 PV2CPT Model Construction 58 3.4 HPM Methodology: Post-Silicon Phase 60 3.4.1 Transfer Learning in Silicon Characterization Step 60 3.4.2 Procedures in Volume Production Phase 61 3.5 Experimental Results 62 3.5.1 Experimental Setup 62 3.5.2 Exploration of Monitoring Circuits Configuration 64 3.5.3 Effectiveness of Monitoring Circuits Optimization 66 3.5.4 Considering BEOL PVs and Uncertainty Learning 68 3.5.5 Comparison among Different Prediction Flows 69 3.5.6 Effectiveness of Prediction Model Calibration 71 3.6 Summary 73 4 LIGHTENING ASYNCHRONOUS PIPELINE CONTROLLER 75 4.1 Preliminaries and State-of-the-Art Work 75 4.1.1 Bundled-data vs. Dual-rail Asynchronous Circuits 75 4.1.2 Two-phase vs. Four-phase Bundled-data Protocol 76 4.1.3 Conventional State-of-the-Art Pipeline Controller Template 77 4.2 Delay Path Sharing for Lightening Pipeline Controller Template 78 4.2.1 Synthesizing Sharable Delay Paths 78 4.2.2 Validating Logical Correctness for Sharable Delay Paths 80 4.2.3 Reformulating Timing Constraints of Controller Template 81 4.2.4 Minimally Allocating Delay Buffers 87 4.3 In-depth Pipeline Controller Template Synthesis with Delay Path Reusing 88 4.3.1 Synthesizing Delay Path Units 88 4.3.2 Validating Logical Correctness of Delay Path Units 89 4.3.3 Updating Timing Constraints for Delay Path Units 91 4.3.4 In-depth Synthesis Flow Utilizing Delay Path Units 95 4.4 Experimental Results 99 4.4.1 Environment Setup 99 4.4.2 Piecewise Linear Modeling of Delay Path Unit Area 99 4.4.3 Comparison of Power, Performance, and Area 102 4.5 Summary 107 5 CONCLUSION 109 5.1 Chapter 2 109 5.2 Chapter 3 110 5.3 Chapter 4 110 Abstract (In Korean) 127Docto

Energy-Efficient Digital Circuit Design using Threshold Logic Gates

abstract: Improving energy efficiency has always been the prime objective of the custom and automated digital circuit design techniques. As a result, a multitude of methods to reduce power without sacrificing performance have been proposed. However, as the field of design automation has matured over the last few decades, there have been no new automated design techniques, that can provide considerable improvements in circuit power, leakage and area. Although emerging nano-devices are expected to replace the existing MOSFET devices, they are far from being as mature as semiconductor devices and their full potential and promises are many years away from being practical. The research described in this dissertation consists of four main parts. First is a new circuit architecture of a differential threshold logic flipflop called PNAND. The PNAND gate is an edge-triggered multi-input sequential cell whose next state function is a threshold function of its inputs. Second a new approach, called hybridization, that replaces flipflops and parts of their logic cones with PNAND cells is described. The resulting \hybrid circuit, which consists of conventional logic cells and PNANDs, is shown to have significantly less power consumption, smaller area, less standby power and less power variation. Third, a new architecture of a field programmable array, called field programmable threshold logic array (FPTLA), in which the standard lookup table (LUT) is replaced by a PNAND is described. The FPTLA is shown to have as much as 50% lower energy-delay product compared to conventional FPGA using well known FPGA modeling tool called VPR. Fourth, a novel clock skewing technique that makes use of the completion detection feature of the differential mode flipflops is described. This clock skewing method improves the area and power of the ASIC circuits by increasing slack on timing paths. An additional advantage of this method is the elimination of hold time violation on given short paths. Several circuit design methodologies such as retiming and asynchronous circuit design can use the proposed threshold logic gate effectively. Therefore, the use of threshold logic flipflops in conventional design methodologies opens new avenues of research towards more energy-efficient circuits.Dissertation/ThesisDoctoral Dissertation Computer Science 201

Minimizing and exploiting leakage in VLSI

Power consumption of VLSI (Very Large Scale Integrated) circuits has been growing at an alarmingly rapid rate. This increase in power consumption, coupled with the increasing demand for portable/hand-held electronics, has made power consumption a dominant concern in the design of VLSI circuits today. Traditionally dynamic (switching) power has dominated the total power consumption of VLSI circuits. However, due to process scaling trends, leakage power has now become a major component of the total power consumption in VLSI circuits. This dissertation explores techniques to reduce leakage, as well as techniques to exploit leakage currents through the use of sub-threshold circuits. This dissertation consists of two studies. In the first study, techniques to reduce leakage are presented. These include a low leakage ASIC design methodology that uses high VT sleep transistors selectively, a methodology that combines input vector control and circuit modification, and a scheme to find the optimum reverse body bias voltage to minimize leakage. As the minimum feature size of VLSI fabrication processes continues to shrink with each successive process generation (along with the value of supply voltage and therefore the threshold voltage of the devices), leakage currents increase exponentially. Leakage currents are hence seen as a necessary evil in traditional VLSI design methodologies. We present an approach to turn this problem into an opportunity. In the second study in this dissertation, we attempt to exploit leakage currents to perform computation. We use sub-threshold digital circuits and come up with ways to get around some of the pitfalls associated with sub-threshold circuit design. These include a technique that uses body biasing adaptively to compensate for Process, Voltage and Temperature (PVT) variations, a design approach that uses asynchronous micro-pipelined Network of Programmable Logic Arrays (NPLAs) to help improve the throughput of sub-threshold designs, and a method to find the optimum supply voltage that minimizes energy consumption in a circuit

Reliable Software for Unreliable Hardware - A Cross-Layer Approach

A novel cross-layer reliability analysis, modeling, and optimization approach is proposed in this thesis that leverages multiple layers in the system design abstraction (i.e. hardware, compiler, system software, and application program) to exploit the available reliability enhancing potential at each system layer and to exchange this information across multiple system layers

MANAGING AND LEVERAGING VARIATIONS AND NOISE IN NANOMETER CMOS

Advanced CMOS technologies have enabled high density designs at the cost of complex fabrication process. Variation in oxide thickness and Random Dopant Fluctuation (RDF) lead to variation in transistor threshold voltage Vth. Current photo-lithography process used for printing decreasing critical dimensions result in variation in transistor channel length and width. A related challenge in nanometer CMOS is that of on-chip random noise. With decreasing threshold voltage and operating voltage; and increasing operating temperature, CMOS devices are more sensitive to random on-chip noise in advanced technologies. In this thesis, we explore novel circuit techniques to manage the impact of process variation in nanometer CMOS technologies. We also analyze the impact of on-chip noise on CMOS circuits and propose techniques to leverage or manage impact of noise based on the application. True Random Number Generator (TRNG) is an interesting cryptographic primitive that leverages on-chip noise to generate random bits; however, it is highly sensitive to process variation. We explore novel metastability circuits to alleviate the impact of variations and at the same time leverage on-chip noise sources like Random Thermal Noise and Random Telegraph Noise (RTN) to generate high quality random bits. We develop stochastic models for metastability based TRNG circuits to analyze the impact of variation and noise. The stochastic models are used to analyze and compare low power, energy efficient and lightweight post-processing techniques targeted to low power applications like System on Chip (SoC) and RFID. We also propose variation aware circuit calibration techniques to increase reliability. We extended this technique to a more generic application of designing Post-Si Tunable (PST) clock buffers to increase parametric yield in the presence of process variation. Apart from one time variation due to fabrication process, transistors undergo constant change in threshold voltage due to aging/wear-out effects and RTN. Process variation affects conventional sensors and introduces inaccuracies during measurement. We present a lightweight wear-out sensor that is tolerant to process variation and provides a fine grained wear-out sensing. A similar circuit is designed to sense fluctuation in transistor threshold voltage due to RTN. Although thermal noise and RTN are leveraged in applications like TRNG, they affect the stability of sensitive circuits like Static Random Access Memory (SRAM). We analyze the impact of on-chip noise on Bit Error Rate (BER) and post-Si test coverage of SRAM cells

Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout

Interconnect Planning for Physical Design of 3D Integrated Circuits

Vertical stacking—based on modern manufacturing and integration technologies—of multiple 2D chips enables three-dimensional integrated circuits (3D ICs). This exploitation of the third dimension is generally accepted for aiming at higher packing densities, heterogeneous integration, shorter interconnects, reduced power consumption, increased data bandwidth, and realizing highly-parallel systems in one device. However, the commercial acceptance of 3D ICs is currently behind its expectations, mainly due to challenges regarding manufacturing and integration technologies as well as design automation. This work addresses three selected, practically relevant design challenges: (i) increasing the constrained reusability of proven, reliable 2D intellectual property blocks, (ii) planning different types of (comparatively large) through-silicon vias with focus on their impact on design quality, as well as (iii) structural planning of massively-parallel, 3D-IC-specific interconnect structures during 3D floorplanning. A key concept of this work is to account for interconnect structures and their properties during early design phases in order to support effective and high-quality 3D-IC-design flows. To tackle the above listed challenges, modular design-flow extensions and methodologies have been developed. Experimental investigations reveal the effectiveness and efficiency of the proposed techniques, and provide findings on 3D integration with particular focus on interconnect structures. We suggest consideration of these findings when formulating guidelines for successful 3D-IC design automation.:1 Introduction 1.1 The 3D Integration Approach for Electronic Circuits 1.2 Technologies for 3D Integrated Circuits 1.3 Design Approaches for 3D Integrated Circuits 2 State of the Art in Design Automation for 3D Integrated Circuits 2.1 Thermal Management 2.2 Partitioning and Floorplanning 2.3 Placement and Routing 2.4 Power and Clock Delivery 2.5 Design Challenges 3 Research Objectives 4 Planning Through-Silicon Via Islands for Block-Level Design Reuse 4.1 Problems for Design Reuse in 3D Integrated Circuits 4.2 Connecting Blocks Using Through-Silicon Via Islands 4.2.1 Problem Formulation and Methodology Overview 4.2.2 Net Clustering 4.2.3 Insertion of Through-Silicon Via Islands 4.2.4 Deadspace Insertion and Redistribution 4.3 Experimental Investigation 4.3.1 Wirelength Estimation 4.3.2 Configuration 4.3.3 Results and Discussion 4.4 Summary and Conclusions 5 Planning Through-Silicon Vias for Design Optimization 5.1 Deadspace Requirements for Optimized Planning of Through-Silicon Vias 5.2 Multiobjective Design Optimization of 3D Integrated Circuits 5.2.1 Methodology Overview and Configuration 5.2.2 Techniques for Deadspace Optimization 5.2.3 Design-Quality Analysis 5.2.4 Planning Different Types of Through-Silicon Vias 5.3 Experimental Investigation 5.3.1 Configuration 5.3.2 Results and Discussion 5.4 Summary and Conclusions 6 3D Floorplanning for Structural Planning of Massive Interconnects 6.1 Block Alignment for Interconnects Planning in 3D Integrated Circuits 6.2 Corner Block List Extended for Block Alignment 6.2.1 Alignment Encoding 6.2.2 Layout Generation: Block Placement and Alignment 6.3 3D Floorplanning Methodology 6.3.1 Optimization Criteria and Phases and Related Cost Models 6.3.2 Fast Thermal Analysis 6.3.3 Layout Operations 6.3.4 Adaptive Optimization Schedule 6.4 Experimental Investigation 6.4.1 Configuration 6.4.2 Results and Discussion 6.5 Summary and Conclusions 7 Research Summary, Conclusions, and Outlook Dissertation Theses Notation Glossary BibliographyDreidimensional integrierte Schaltkreise (3D-ICs) beruhen auf neuartigen Herstellungs- und Integrationstechnologien, wobei vor allem “klassische” 2D-ICs vertikal zu einem neuartigen 3D-System gestapelt werden. Dieser Ansatz zur Erschließung der dritten Dimension im Schaltkreisentwurf ist nach Expertenmeinung dazu geeignet, höhere Integrationsdichten zu erreichen, heterogene Integration zu realisieren, kürzere Verdrahtungswege zu ermöglichen, Leistungsaufnahmen zu reduzieren, Datenübertragungsraten zu erhöhen, sowie hoch-parallele Systeme in einer Baugruppe umzusetzen. Aufgrund von technologischen und entwurfsmethodischen Schwierigkeiten bleibt jedoch bisher die kommerzielle Anwendung von 3D-ICs deutlich hinter den Erwartungen zurück. In dieser Arbeit werden drei ausgewählte, praktisch relevante Problemstellungen der Entwurfsautomatisierung von 3D-ICs bearbeitet: (i) die Verbesserung der (eingeschränkten) Wiederverwendbarkeit von zuverlässigen 2D-Intellectual-Property-Blöcken, (ii) die komplexe Planung von verschiedenartigen, verhältnismäßig großen Through-Silicion Vias unter Beachtung ihres Einflusses auf die Entwurfsqualität, und (iii) die strukturelle Einbindung von massiv-parallelen, 3D-IC-spezifischen Verbindungsstrukturen während der Floorplanning-Phase. Das Ziel dieser Arbeit besteht darin, Verbindungsstrukturen mit deren wesentlichen Eigenschaften bereits in den frühen Phasen des Entwurfsprozesses zu berücksichtigen. Dies begünstigt einen qualitativ hochwertigen Entwurf von 3D-ICs. Die in dieser Arbeit vorgestellten modularen Entwurfsprozess-Erweiterungen bzw. -Methodiken dienen zur effizienten Lösung der oben genannten Problemstellungen. Experimentelle Untersuchungen bestätigen die Wirksamkeit sowie die Effektivität der erarbeiten Methoden. Darüber hinaus liefern sie praktische Erkenntnisse bezüglich der Anwendung von 3D-ICs und der Planung deren Verbindungsstrukturen. Diese Erkenntnisse sind zur Ableitung von Richtlinien für den erfolgreichen Entwurf von 3D-ICs dienlich.:1 Introduction 1.1 The 3D Integration Approach for Electronic Circuits 1.2 Technologies for 3D Integrated Circuits 1.3 Design Approaches for 3D Integrated Circuits 2 State of the Art in Design Automation for 3D Integrated Circuits 2.1 Thermal Management 2.2 Partitioning and Floorplanning 2.3 Placement and Routing 2.4 Power and Clock Delivery 2.5 Design Challenges 3 Research Objectives 4 Planning Through-Silicon Via Islands for Block-Level Design Reuse 4.1 Problems for Design Reuse in 3D Integrated Circuits 4.2 Connecting Blocks Using Through-Silicon Via Islands 4.2.1 Problem Formulation and Methodology Overview 4.2.2 Net Clustering 4.2.3 Insertion of Through-Silicon Via Islands 4.2.4 Deadspace Insertion and Redistribution 4.3 Experimental Investigation 4.3.1 Wirelength Estimation 4.3.2 Configuration 4.3.3 Results and Discussion 4.4 Summary and Conclusions 5 Planning Through-Silicon Vias for Design Optimization 5.1 Deadspace Requirements for Optimized Planning of Through-Silicon Vias 5.2 Multiobjective Design Optimization of 3D Integrated Circuits 5.2.1 Methodology Overview and Configuration 5.2.2 Techniques for Deadspace Optimization 5.2.3 Design-Quality Analysis 5.2.4 Planning Different Types of Through-Silicon Vias 5.3 Experimental Investigation 5.3.1 Configuration 5.3.2 Results and Discussion 5.4 Summary and Conclusions 6 3D Floorplanning for Structural Planning of Massive Interconnects 6.1 Block Alignment for Interconnects Planning in 3D Integrated Circuits 6.2 Corner Block List Extended for Block Alignment 6.2.1 Alignment Encoding 6.2.2 Layout Generation: Block Placement and Alignment 6.3 3D Floorplanning Methodology 6.3.1 Optimization Criteria and Phases and Related Cost Models 6.3.2 Fast Thermal Analysis 6.3.3 Layout Operations 6.3.4 Adaptive Optimization Schedule 6.4 Experimental Investigation 6.4.1 Configuration 6.4.2 Results and Discussion 6.5 Summary and Conclusions 7 Research Summary, Conclusions, and Outlook Dissertation Theses Notation Glossary Bibliograph