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Interconnect optimizations for nanometer VLSI design
textAs the semiconductor technology scales into deeper sub-micron domain, billions of transistors can be used on a single system-on-chip (SOC) makes interconnection optimization more important roughly for two reasons. First, congestion, power, timing in routing and buffering requirements make inter- connection optimization more and more challenging. Second, gate delay get- ting shorter while the RC delay gets longer due to scaling. Study of interconnection construction and optimization algorithms in real industry flows and designs ends up with interesting findings. One used to be overlooked but very important and practical problem is how to utilize over- the-block routing resources intelligently. Routing over large IP blocks needs special attention as there is almost no way to insert buffers inside hard IP blocks, which can lead to unsolvable slew/timing violations. In current design flows we have seen, the routing resources over the IP blocks were either dealt as routing blockages leading to a significant waste, or simply treated in the same way as outside-the-block routing resources, which would violate the slew constraints and thus fail buffering. To handle that, this work proposes a novel buffering-aware over-the- block rectilinear Steiner minimum tree (BOB-RSMT) algorithm which helps reclaim the “wasted” over-the-block routing resources while meeting user-specified slew constraints. Proposed algorithm incrementally and efficiently migrates initial tree structures with buffering-awareness to meet slew constraints while minimizing wire-length. Moreover, due to the fact that timing optimization is important for the VLSI design, in this work, timing-driven over-the-block rectilinear Steiner tree (TOB-RST) is also studied to optimize critical paths. This proposed TOB-RST algorithm can be used in routing or post-routing stage to provide high-quality topologies to help close timing. Then a follow-up problem emerges: how to accomplish the whole routing with over-the-block routing resources used properly. Utilizing over-the- block routing resources could dramatically improve the routing solution, yet require special attention, since the slew, affected by different RC on different metal layers, must be constrained by buffering and is easily violated. Moreover, even of all nets are slew-legalized, the routing solution could still suffer from heavy congestion problem. A new global router, BOB-Router, is to solve the over-the-block global routing problem through minimizing overflows, wire-length and via count simultaneously without violating slew constraints. Based on my completed works, BOB-RSMT and BOB-Router tremendously improve the overall routing and buffering quality. Experimental results show that proposed over-the-block rectilinear Steiner tree construction and routing completely satisfies the slew constraints and significantly outperforms the obstacle-avoiding rectilinear Steiner tree construction and routing in terms of wire-length, via count and overflows.Electrical and Computer Engineerin
Throughput-driven floorplanning with wire pipelining
The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires
DESIGN AUTOMATION FOR CARBON NANOTUBE CIRCUITS CONSIDERING PERFORMANCE AND SECURITY OPTIMIZATION
As prevailing copper interconnect technology advances to its fundamental physical limit, interconnect delay due to ever-increasing wire resistivity has greatly limited the circuit miniaturization. Carbon nanotube (CNT) interconnects have emerged as promising replacement materials for copper interconnects due to their superior conductivity. Buffer insertion for CNT interconnects is capable of improving circuit timing of signal nets with limited buffer deployment. However, due to the imperfection of fabricating long straight CNT, there exist significant unidimensional-spatially correlated variations on the critical CNT geometric parameters such as the diameter and density, which will affect the circuit performance.
This dissertation develops a novel timing driven buffer insertion technique considering unidimensional correlations of variations of CNT. Although the fabrication variations of CNTs are not desired for the circuit designs targeting performance optimization and reliability, these inherent imperfections make them natural candidates for building highly secure physical unclonable function (PUF), which is an advanced hardware security technology. A novel CNT PUF design through leveraging Lorenz chaotic system is developed and we show that it is resistant to many machine learning modeling attacks. In summary, the studies in this dissertation demonstrate that CNT technology is highly promising for performance and security optimizations in advanced VLSI circuit design
On-Chip Transparent Wire Pipelining (invited paper)
Wire pipelining has been proposed as a viable mean to break the discrepancy between decreasing gate delays and increasing wire delays in deep-submicron technologies. Far from being a straightforwardly applicable technique, this methodology requires a number of design modifications in order to insert it seamlessly in the current design flow. In this paper we briefly survey the methods presented by other researchers in the field and then we thoroughly analyze the solutions we recently proposed, ranging from system-level wire pipelining to physical design aspects
Timing-Constrained Global Routing with Buffered Steiner Trees
This dissertation deals with the combination of two key problems that arise in the physical design of computer chips: global routing and buffering. The task of buffering is the insertion of buffers and inverters into the chip's netlist to speed-up signal delays and to improve electrical properties of the chip. Insertion of buffers and inverters goes alongside with construction of Steiner trees that connect logical sources with possibly many logical sinks and have buffers and inverters as parts of these connections. Classical global routing focuses on packing Steiner trees within the limited routing space. Buffering and global routing have been solved separately in the past. In this thesis we overcome the limitations of the classical approaches by considering the buffering problem as a global, multi-objective problem. We study its theoretical aspects and propose algorithms which we implement in the tool BonnRouteBuffer for timing-constrained global routing with buffered Steiner trees. At its core, we propose a new theoretically founded framework to model timing constraints inherently within global routing. As most important sub-task we have to compute a buffered Steiner tree for a single net minimizing the sum of prices for delays, routing congestion, placement congestion, power consumption, and net length. For this sub-task we present a fully polynomial time approximation scheme to compute an almost-cheapest Steiner tree with a given routing topology and prove that an exact algorithm cannot exist unless P=NP. For topology computation we present a bicriteria approximation algorithm that bounds both the geometric length and the worst slack of the topology. To improve the practical results we present many heuristic modifications, speed-up- and post-optimization techniques for buffered Steiner trees. We conduct experiments on challenging real-world test cases provided by our cooperation partner IBM to demonstrate the quality of our tool. Our new algorithm could produce better solutions with respect to both timing and routability. After post-processing with gate sizing and Vt-assignment, we can even reduce the power consumption on most instances. Overall, our results show that our tool BonnRouteBuffer for timing-constrained global routing is superior to industrial state-of-the-art tools
Doctor of Philosophy
dissertationPortable electronic devices will be limited to available energy of existing battery chemistries for the foreseeable future. However, system-on-chips (SoCs) used in these devices are under a demand to offer more functionality and increased battery life. A difficult problem in SoC design is providing energy-efficient communication between its components while maintaining the required performance. This dissertation introduces a novel energy-efficient network-on-chip (NoC) communication architecture. A NoC is used within complex SoCs due it its superior performance, energy usage, modularity, and scalability over traditional bus and point-to-point methods of connecting SoC components. This is the first academic research that combines asynchronous NoC circuits, a focus on energy-efficient design, and a software framework to customize a NoC for a particular SoC. Its key contribution is demonstrating that a simple, asynchronous NoC concept is a good match for low-power devices, and is a fruitful area for additional investigation. The proposed NoC is energy-efficient in several ways: simple switch and arbitration logic, low port radix, latch-based router buffering, a topology with the minimum number of 3-port routers, and the asynchronous advantages of zero dynamic power consumption while idle and the lack of a clock tree. The tool framework developed for this work uses novel methods to optimize the topology and router oorplan based on simulated annealing and force-directed movement. It studies link pipelining techniques that yield improved throughput in an energy-efficient manner. A simulator is automatically generated for each customized NoC, and its traffic generators use a self-similar message distribution, as opposed to Poisson, to better match application behavior. Compared to a conventional synchronous NoC, this design is superior by achieving comparable message latency with half the energy
CAD methodologies for low power and reliable 3D ICs
The main objective of this dissertation is to explore and develop computer-aided-design (CAD) methodologies and optimization techniques for reliability, timing performance, and power consumption of through-silicon-via(TSV)-based and monolithic 3D IC designs. The 3D IC technology is a promising answer to the device scaling and interconnect problems that industry faces today. Yet, since multiple dies are stacked vertically in 3D ICs, new problems arise such as thermal, power delivery, and so on. New physical design methodologies and optimization techniques should be developed to address the problems and exploit the design freedom in 3D ICs. Towards the objective, this dissertation includes four research projects.
The first project is on the co-optimization of traditional design metrics and reliability metrics for 3D ICs. It is well known that heat removal and power delivery are two major reliability concerns in 3D ICs. To alleviate thermal problem, two possible solutions have been proposed: thermal-through-silicon-vias (T-TSVs) and micro-fluidic-channel (MFC) based cooling. For power delivery, a complex power distribution network is required to deliver currents reliably to all parts of the 3D IC while suppressing the power supply noise to an acceptable level. However, these thermal and power networks pose major challenges in signal routability and congestion. In this project, a co-optimization methodology for signal, power, and thermal interconnects in 3D ICs is presented. The goal of the proposed approach is to improve signal, thermal, and power noise metrics and to provide fast and accurate design space explorations for early design stages.
The second project is a study on 3D IC partition. For a 3D IC, the target circuit needs to be partitioned into multiple parts then mapped onto the dies. The partition style impacts design quality such as footprint, wirelength, timing, and so on. In this project, the design methodologies of 3D ICs with different partition styles are demonstrated. For the LEON3 multi-core microprocessor, three partitioning styles are compared: core-level, block-level, and gate-level. The design methodologies for such partitioning styles and their implications on the physical layout are discussed. Then, to perform timing optimizations for 3D ICs, two timing constraint generation methods are demonstrated that lead to different design quality.
The third project is on the buffer insertion for timing optimization of 3D ICs. For high performance 3D ICs, it is crucial to perform thorough timing optimizations. Among timing optimization techniques, buffer insertion is known to be the most effective way. The TSVs have a large parasitic capacitance that increases the signal slew and the delay on the downstream. In this project, a slew-aware buffer insertion algorithm is developed that handles full 3D nets and considers TSV parasitics and slew effects on delay. Compared with the well-known van Ginneken algorithm and a commercial tool, the proposed algorithm finds buffering solutions with lower delay values and acceptable runtime overhead.
The last project is on the ultra-high-density logic designs for monolithic 3D ICs. The nano-scale 3D interconnects available in monolithic 3D IC technology enable ultra-high-density device integration at the individual transistor-level. The benefits and challenges of monolithic 3D integration technology for logic designs are investigated. First, a 3D standard cell library for transistor-level monolithic 3D ICs is built and their timing and power behavior are characterized. Then, various interconnect options for monolithic 3D ICs that improve design quality are explored. Next, timing-closed, full-chip GDSII layouts are built and iso-performance power comparisons with 2D IC designs are performed. Important design metrics such as area, wirelength, timing, and power consumption are compared among transistor-level monolithic 3D, gate-level monolithic 3D, TSV-based 3D, and traditional 2D designs.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Lee, Hsien-Hsin; Committee Member: Mukhopadhyay, Saiba
Physical Design and Clock Tree Synthesis Methods For A 8-Bit Processor
Now days a number of processors are available with a lot kind of feature from different industries. A processor with similar kind of architecture of the current processors only missing the memory stuffs like the RAM and ROM has been designed here with the help of Verilog style of coding. This processor contains architecturally the program counter, instruction register, ALU, ALU latch, General Purpose Registers, control state module, flag registers and the core module containing all the modules. And a test module is designed for testing the processor. After the design of the processor with successful functionality, the processor is synthesized with 180nm technology. The synthesis is performed with the data path optimization like the selection of proper adders and multipliers for timing optimization in the data path while the ALU operations are performed. During synthesis how to take care of the worst negative slack (WNS), how to include the clock gating cells, how to define the cost and path groups etc. have been covered. After the proper synthesis we get the proper net list and the synthesized constraint file for carrying out the physical design. In physical design the steps like floor-planning, partitioning, placement, legalization of the placement, clock tree synthesis, and routing etc. have been performed. At all the stages the static timing analysis is performed for the timing meet of the design for better performance in terms of timing or frequency. Each steps of physical design are discussed with special effort towards the concepts behind the step. Out of all the steps of physical design the clock tree synthesis is performed with some improvement in the performance of the clock tree by creating a symmetrical clock tree and maintaining more common clock paths. A special algorithm has been framed for creating a symmetrical clock tree and thereby making the power consumption of the clock tree low
Algorithmic techniques for nanometer VLSI design and manufacturing closure
As Very Large Scale Integration (VLSI) technology moves to the nanoscale
regime, design and manufacturing closure becomes very difficult to achieve due to
increasing chip and power density. Imperfections due to process, voltage and temperature variations aggravate the problem. Uncertainty in electrical characteristic of
individual device and wire may cause significant performance deviations or even functional failures. These impose tremendous challenges to the continuation of Moore's
law as well as the growth of semiconductor industry.
Efforts are needed in both deterministic design stage and variation-aware design
stage. This research proposes various innovative algorithms to address both stages for
obtaining a design with high frequency, low power and high robustness. For deterministic optimizations, new buffer insertion and gate sizing techniques are proposed. For
variation-aware optimizations, new lithography-driven and post-silicon tuning-driven
design techniques are proposed.
For buffer insertion, a new slew buffering formulation is presented and is proved
to be NP-hard. Despite this, a highly efficient algorithm which runs > 90x faster
than the best alternatives is proposed. The algorithm is also extended to handle
continuous buffer locations and blockages.
For gate sizing, a new algorithm is proposed to handle discrete gate library in
contrast to unrealistic continuous gate library assumed by most existing algorithms. Our approach is a continuous solution guided dynamic programming approach, which
integrates the high solution quality of dynamic programming with the short runtime
of rounding continuous solution.
For lithography-driven optimization, the problem of cell placement considering
manufacturability is studied. Three algorithms are proposed to handle cell flipping
and relocation. They are based on dynamic programming and graph theoretic approaches, and can provide different tradeoff between variation reduction and wire-
length increase.
For post-silicon tuning-driven optimization, the problem of unified adaptivity
optimization on logical and clock signal tuning is studied, which enables us to significantly save resources. The new algorithm is based on a novel linear programming
formulation which is solved by an advanced robust linear programming technique.
The continuous solution is then discretized using binary search accelerated dynamic
programming, batch based optimization, and Latin Hypercube sampling based fast
simulation
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