Design for Additive Manufacturing: A Method to Explore Unexplored Regions of the Design Space

Additive Manufacturing (AM) technologies enable the fabrication of parts and devices that are geometrically complex, have graded material compositions, and can be customized. To take advantage of these capabilities, it is important to assist designers in exploring unexplored regions of design spaces. We present a Design for Additive Manufacturing (DFAM) method that encompasses conceptual design, process selection, later design stages, and design for manufacturing. The method is based on the process-structure-property-behavior model that is common in the materials design literature. A prototype CAD system is presented that embodies the method. Manufacturable ELements (MELs) are proposed as an intermediate representation for supporting the manufacturing related aspects of the method. Examples of cellular materials are used to illustrate the DFAM method.Mechanical Engineerin

Directed Placement for mVLSI Devices

Continuous-flow microfluidic devices based on integrated channel networks are becoming increasingly prevalent in research in the biological sciences. At present, these devices are physically laid out by hand by domain experts who understand both the underlying technology and the biological functions that will execute on fabricated devices. The lack of a design science that is specific to microfluidic technology creates a substantial barrier to entry. To address this concern, this article introduces Directed Placement, a physical design algorithm that leverages the natural "directedness" in most modern microfluidic designs: fluid enters at designated inputs, flows through a linear or tree-based network of channels and fluidic components, and exits the device at dedicated outputs. Directed placement creates physical layouts that share many principle similarities to those created by domain experts. Directed placement allows components to be placed closer to their neighbors compared to existing layout algorithms based on planar graph embedding or simulated annealing, leading to an average reduction in laid-out fluid channel length of 91% while improving area utilization by 8% on average. Directed placement is compatible with both passive and active microfluidic devices and is compatible with a variety of mainstream manufacturing technologies

Programmable photonics : an opportunity for an accessible large-volume PIC ecosystem

We look at the opportunities presented by the new concepts of generic programmable photonic integrated circuits (PIC) to deploy photonics on a larger scale. Programmable PICs consist of waveguide meshes of tunable couplers and phase shifters that can be reconfigured in software to define diverse functions and arbitrary connectivity between the input and output ports. Off-the-shelf programmable PICs can dramatically shorten the development time and deployment costs of new photonic products, as they bypass the design-fabrication cycle of a custom PIC. These chips, which actually consist of an entire technology stack of photonics, electronics packaging and software, can potentially be manufactured cheaper and in larger volumes than application-specific PICs. We look into the technology requirements of these generic programmable PICs and discuss the economy of scale. Finally, we make a qualitative analysis of the possible application spaces where generic programmable PICs can play an enabling role, especially to companies who do not have an in-depth background in PIC technology

Gradient-Based Multi-Component Topology Optimization for Manufacturability

Topology optimization is a method where the distribution of materials within a design domain is optimized for a structural performance. Since the geometry is represented non-parametrically, it facilitates innovative designs through the exploration of arbitrary shapes. Due to its unconstrained exploration, however, topology optimization often generates impractical designs with features that prevent economical manufacturing, e.g., complex perimeters and many holes. Above all, existing topology optimization methods assume that the optimized structure will be made as a single piece. However, structures are usually not monolithic (i.e., single-piece), but assemblies of multiple components, e.g., cars, airplanes, or even chairs. It is mainly because producing multiple components with simple geometries is often less expensive (i.e., better manufacturability) than producing a large single-piece part with complex geometries, even with the additional cost of assembly. This dissertation discussed a topology optimization method for designing structures assembled from components, each built by a certain manufacturing process, termed the MTO. The prior art of MTO used discrete formulations solved by genetic algorithms. To overcome the high computational cost associated with non-gradient heuristic optimization, this dissertation proposed a continuously relaxed gradient-based formulation for MTO. The proposed formulation was demonstrated with three manufacturing processes. For the sheet metal stamping process, by modeling stamping die cost manufacturing constraints and assuming resistant spot welding joints, the simultaneous optimization of base topology and component decomposition was, for the first time, attained using an efficient gradient-based optimization algorithm based on design sensitivities. For the composite manufacturing process, a cube-to-simplex projection and penalization method was proposed to handle the membership unity requirement. With the multi-component concept, a unique structural design solution for economical composite manufacturing was achieved. The component-wise anisotropic material orientation design for topology optimization was presented without prescribing a set of alternative discrete angles as required by most existing material orientation methods. For the additive manufacturing process, the MTO method enabled the design of additively manufactured structures larger than the printer's build volume. By modeling manufacturing constraints on the build volume limit and elimination of enclosed holes, the optimized structure was an assembly of multiple components, each produced by a powder bed additive manufacturing machine. The first reported 3D example of MTO was presented.PHDMechanical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/145989/1/yuqingz_1.pd

Constraint-Aware, Scalable, and Efficient Algorithms for Multi-Chip Power Module Layout Optimization

Moving towards an electrified world requires ultra high-density power converters. Electric vehicles, electrified aerospace, data centers, etc. are just a few fields among wide application areas of power electronic systems, where high-density power converters are essential. As a critical part of these power converters, power semiconductor modules and their layout optimization has been identified as a crucial step in achieving the maximum performance and density for wide bandgap technologies (i.e., GaN and SiC). New packaging technologies are also introduced to produce reliable and efficient multichip power module (MCPM) designs to push the current limits. The complexity of the emerging MCPM layouts is surpassing the capability of a manual, iterative design process to produce an optimum design with agile development requirements. An electronic design automation tool called PowerSynth has been introduced with ongoing research toward enhanced capabilities to speed up the optimized MCPM layout design process. This dissertation presents the PowerSynth progression timeline with the methodology updates and corresponding critical results compared to v1.1. The first released version (v1.1) of PowerSynth demonstrated the benefits of layout abstraction, and reduced-order modeling techniques to perform rapid optimization of the MCPM module compared to the traditional, manual, and iterative design approach. However, that version is limited by several key factors: layout representation technique, layout generation algorithms, iterative design-rule-checking (DRC), optimization algorithm candidates, etc. To address these limitations, and enhance PowerSynth’s capabilities, constraint-aware, scalable, and efficient algorithms have been developed and implemented. PowerSynth layout engine has evolved from v1.3 to v2.0 throughout the last five years to incorporate the algorithm updates and generate all 2D/2.5D/3D Manhattan layout solutions. These fundamental changes in the layout generation methodology have also called for updates in the performance modeling techniques and enabled exploring different optimization algorithms. The latest PowerSynth 2 architecture has been implemented to enable electro-thermo-mechanical and reliability optimization on 2D/2.5D/3D MCPM layouts, and set up a path toward cabinet-level optimization. PowerSynth v2.0 computer-aided design (CAD) flow has been hardware-validated through manufacturing and testing of an optimized novel 3D MCPM layout. The flow has shown significant speedup compared to the manual design flow with a comparable optimization result

Doctor of Philosophy

dissertationRecent breakthroughs in silicon photonics technology are enabling the integration of optical devices into silicon-based semiconductor processes. Photonics technology enables high-speed, high-bandwidth, and high-fidelity communications on the chip-scale-an important development in an increasingly communications-oriented semiconductor world. Significant developments in silicon photonic manufacturing and integration are also enabling investigations into applications beyond that of traditional telecom: sensing, filtering, signal processing, quantum technology-and even optical computing. In effect, we are now seeing a convergence of communications and computation, where the traditional roles of optics and microelectronics are becoming blurred. As the applications for opto-electronic integrated circuits (OEICs) are developed, and manufacturing capabilities expand, design support is necessary to fully exploit the potential of this optics technology. Such design support for moving beyond custom-design to automated synthesis and optimization is not well developed. Scalability requires abstractions, which in turn enables and requires the use of optimization algorithms and design methodology flows. Design automation represents an opportunity to take OEIC design to a larger scale, facilitating design-space exploration, and laying the foundation for current and future optical applications-thus fully realizing the potential of this technology. This dissertation proposes design automation for integrated optic system design. Using a buildingblock model for optical devices, we provide an EDA-inspired design flow and methodologies for optical design automation. Underlying these flows and methodologies are new supporting techniques in behavioral and physical synthesis, as well as device-resynthesis techniques for thermal-aware system integration. We also provide modeling for optical devices and determine optimization and constraint parameters that guide the automation techniques. Our techniques and methodologies are then applied to the design and optimization of optical circuits and devices. Experimental results are analyzed to evaluate their efficacy. We conclude with discussions on the contributions and limitations of the approaches in the context of optical design automation, and describe the tremendous opportunities for future research in design automation for integrated optics

In-Mold Assembly of Multi-Functional Structures

Combining the recent advances in injection moldable polymer composites with the multi-material molding techniques enable fabrication of multi-functional structures to serve multiple functions (e.g., carry load, support motion, dissipate heat, store energy). Current in-mold assembly methods, however, cannot be simply scaled to create structures with miniature features, as the process conditions and the assembly failure modes change with the feature size. This dissertation identifies and addresses the issues associated with the in-mold assembly of multi-functional structures with miniature components. First, the functional capability of embedding actuators is developed. As a part of this effort, computational modeling methods are developed to assess the functionality of the structure with respect to the material properties, process parameters and the heat source. Using these models, the effective material thermal conductivity required to dissipate the heat generated by the embedded small scale actuator is identified. Also, the influence of the fiber orientation on the heat dissipation performance is characterized. Finally, models for integrated product and process design are presented to ensure the miniature actuator survivability during embedding process. The second functional capability developed as a part of this dissertation is the in-mold assembly of multi-material structures capable of motion and load transfer, such as mechanisms with compliant hinges. The necessary hinge and link design features are identified. The shapes and orientations of these features are analyzed with respect to their functionality, mutual dependencies, and the process cost. The parametric model of the interface design is developed. This model is used to minimize both the final assembly weight and the mold complexity as the process cost measure. Also, to minimize the manufacturing waste and the risk of assembly failure due to unbalanced mold filling, the design optimization of runner systems used in multi-cavity molds for in-mold assembly is developed. The complete optimization model is characterized and formulated. The best method to solve the runner optimization problem is identified. To demonstrate the applicability of the tools developed in this dissertation towards the miniaturization of robotic devices, a case study of a novel miniature air vehicle drive mechanism is presented

Integrated Tolerance and Fixture Layout Design for Compliant Sheet Metal Assemblies

Part tolerances and fixture layouts are two pivotal factors in the geometrical quality of\ua0a compliant assembly. The independent design and optimization of these factors for compliant\ua0assemblies have been thoroughly studied. However, this paper presents the dependency of these\ua0factors and, consequently, the demand for an integrated design of them. A method is developed\ua0in order to address this issue by utilizing compliant variation simulation tools and evolutionary\ua0optimization algorithms. Thereby, integrated and non-integrated optimization of the tolerances and\ua0fixture layouts are conducted for an industrial sample case. The objective of this optimization is\ua0defined as minimizing the production cost while fulfilling the geometrical requirements. The results\ua0evidence the superiority of the integrated approach to the non-integrated in terms of the production\ua0cost and geometrical quality of the assemblies

The potential of additive manufacturing in the smart factory industrial 4.0: A review

Additive manufacturing (AM) or three-dimensional (3D) printing has introduced a novel production method in design, manufacturing, and distribution to end-users. This technology has provided great freedom in design for creating complex components, highly customizable products, and efficient waste minimization. The last industrial revolution, namely industry 4.0, employs the integration of smart manufacturing systems and developed information technologies. Accordingly, AM plays a principal role in industry 4.0 thanks to numerous benefits, such as time and material saving, rapid prototyping, high efficiency, and decentralized production methods. This review paper is to organize a comprehensive study on AM technology and present the latest achievements and industrial applications. Besides that, this paper investigates the sustainability dimensions of the AM process and the added values in economic, social, and environment sections. Finally, the paper concludes by pointing out the future trend of AM in technology, applications, and materials aspects that have the potential to come up with new ideas for the future of AM explorations