76 research outputs found
Performance and power optimization in VLSI physical design
As VLSI technology enters the nanoscale regime, a great amount of efforts have
been made to reduce interconnect delay. Among them, buffer insertion stands out
as an effective technique for timing optimization. A dramatic rise in on-chip buffer
density has been witnessed. For example, in two recent IBM ASIC designs, 25% gates
are buffers.
In this thesis, three buffer insertion algorithms are presented for the procedure
of performance and power optimization. The second chapter focuses on improving circuit performance under inductance effect. The new algorithm works under
the dynamic programming framework and runs in provably linear time for multiple
buffer types due to two novel techniques: restrictive cost bucketing and efficient delay
update. The experimental results demonstrate that our linear time algorithm consistently outperforms all known RLC buffering algorithms in terms of both solution
quality and runtime. That is, the new algorithm uses fewer buffers, runs in shorter
time and the buffered tree has better timing.
The third chapter presents a method to guarantee a high fidelity signal transmission in global bus. It proposes a new redundant via insertion technique to reduce
via variation and signal distortion in twisted differential line. In addition, a new
buffer insertion technique is proposed to synchronize the transmitted signals, thus
further improving the effectiveness of the twisted differential line. Experimental results demonstrate a 6GHz signal can be transmitted with high fidelity using the new
approaches. In contrast, only a 100MHz signal can be reliably transmitted using a
single-end bus with power/ground shielding. Compared to conventional twisted differential line structure, our new techniques can reduce the magnitude of noise by 45%
as witnessed in our simulation.
The fourth chapter proposes a buffer insertion and gate sizing algorithm for
million plus gates. The algorithm takes a combinational circuit as input instead of
individual nets and greatly reduces the buffer and gate cost of the entire circuit.
The algorithm has two main features: 1) A circuit partition technique based on the
criticality of the primary inputs, which provides the scalability for the algorithm, and
2) A linear programming formulation of non-linear delay versus cost tradeoff, which
formulates the simultaneous buffer insertion and gate sizing into linear programming
problem. Experimental results on ISCAS85 circuits show that even without the circuit
partition technique, the new algorithm achieves 17X speedup compared with path
based algorithm. In the meantime, the new algorithm saves 16.0% buffer cost, 4.9%
gate cost, 5.8% total cost and results in less circuit delay
Performance and power optimization in VLSI physical design
As VLSI technology enters the nanoscale regime, a great amount of efforts have
been made to reduce interconnect delay. Among them, buffer insertion stands out
as an effective technique for timing optimization. A dramatic rise in on-chip buffer
density has been witnessed. For example, in two recent IBM ASIC designs, 25% gates
are buffers.
In this thesis, three buffer insertion algorithms are presented for the procedure
of performance and power optimization. The second chapter focuses on improving circuit performance under inductance effect. The new algorithm works under
the dynamic programming framework and runs in provably linear time for multiple
buffer types due to two novel techniques: restrictive cost bucketing and efficient delay
update. The experimental results demonstrate that our linear time algorithm consistently outperforms all known RLC buffering algorithms in terms of both solution
quality and runtime. That is, the new algorithm uses fewer buffers, runs in shorter
time and the buffered tree has better timing.
The third chapter presents a method to guarantee a high fidelity signal transmission in global bus. It proposes a new redundant via insertion technique to reduce
via variation and signal distortion in twisted differential line. In addition, a new
buffer insertion technique is proposed to synchronize the transmitted signals, thus
further improving the effectiveness of the twisted differential line. Experimental results demonstrate a 6GHz signal can be transmitted with high fidelity using the new
approaches. In contrast, only a 100MHz signal can be reliably transmitted using a
single-end bus with power/ground shielding. Compared to conventional twisted differential line structure, our new techniques can reduce the magnitude of noise by 45%
as witnessed in our simulation.
The fourth chapter proposes a buffer insertion and gate sizing algorithm for
million plus gates. The algorithm takes a combinational circuit as input instead of
individual nets and greatly reduces the buffer and gate cost of the entire circuit.
The algorithm has two main features: 1) A circuit partition technique based on the
criticality of the primary inputs, which provides the scalability for the algorithm, and
2) A linear programming formulation of non-linear delay versus cost tradeoff, which
formulates the simultaneous buffer insertion and gate sizing into linear programming
problem. Experimental results on ISCAS85 circuits show that even without the circuit
partition technique, the new algorithm achieves 17X speedup compared with path
based algorithm. In the meantime, the new algorithm saves 16.0% buffer cost, 4.9%
gate cost, 5.8% total cost and results in less circuit delay
Layout optimization in ultra deep submicron VLSI design
As fabrication technology keeps advancing, many deep submicron (DSM) effects have become
increasingly evident and can no longer be ignored in Very Large Scale Integration
(VLSI) design. In this dissertation, we study several deep submicron problems (eg. coupling
capacitance, antenna effect and delay variation) and propose optimization techniques
to mitigate these DSM effects in the place-and-route stage of VLSI physical design.
The place-and-route stage of physical design can be further divided into several steps:
(1) Placement, (2) Global routing, (3) Layer assignment, (4) Track assignment, and (5) Detailed
routing. Among them, layer/track assignment assigns major trunks of wire segments
to specific layers/tracks in order to guide the underlying detailed router. In this dissertation,
we have proposed techniques to handle coupling capacitance at the layer/track assignment
stage, antenna effect at the layer assignment, and delay variation at the ECO (Engineering
Change Order) placement stage, respectively. More specifically, at layer assignment, we
have proposed an improved probabilistic model to quickly estimate the amount of coupling
capacitance for timing optimization. Antenna effects are also handled at layer assignment
through a linear-time tree partitioning algorithm. At the track assignment stage, timing is
further optimized using a graph based technique. In addition, we have proposed a novel
gate splitting methodology to reduce delay variation in the ECO placement considering
spatial correlations. Experimental results on benchmark circuits showed the effectiveness
of our approaches
Custom Integrated Circuits
Contains table of contents for Part III, table of contents for Section 1 and reports on eleven research projects.IBM CorporationMIT School of EngineeringNational Science Foundation Grant MIP 94-23221Defense Advanced Research Projects Agency/U.S. Army Intelligence Center Contract DABT63-94-C-0053Mitsubishi CorporationNational Science Foundation Young Investigator Award Fellowship MIP 92-58376Joint Industry Program on Offshore Structure AnalysisAnalog DevicesDefense Advanced Research Projects AgencyCadence Design SystemsMAFET ConsortiumConsortium for Superconducting ElectronicsNational Defense Science and Engineering Graduate FellowshipDigital Equipment CorporationMIT Lincoln LaboratorySemiconductor Research CorporationMultiuniversity Research IntiativeNational Science Foundatio
Physical parameter-aware Networks-on-Chip design
PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable
and power-efficient communication fabric for chip multiprocessors
(CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine
both the performance and the reliability of such systems, with a
significant power demand that is expected to increase due to developments
in both technology and architecture. In terms of architecture, an
important trend in many-core systems architecture is to increase the
number of cores on a chip while reducing their individual complexity.
This trend increases communication power relative to computation
power. Moreover, technology-wise, power-hungry wires are dominating
logic as power consumers as technology scales down. For these
reasons, the design of future very large scale integration (VLSI) systems
is moving from being computation-centric to communication-centric.
On the other hand, chip’s physical parameters integrity, especially
power and thermal integrity, is crucial for reliable VLSI systems. However,
guaranteeing this integrity is becoming increasingly difficult with
the higher scale of integration due to increased power density and operating
frequencies that result in continuously increasing temperature
and voltage drops in the chip. This is a challenge that may prevent
further shrinking of devices. Thus, tackling the challenge of power
and thermal integrity of future many-core systems at only one level
of abstraction, the chip and package design for example, is no longer
sufficient to ensure the integrity of physical parameters. New designtime
and run-time strategies may need to work together at different
levels of abstraction, such as package, application, network, to provide
the required physical parameter integrity for these large systems. This
necessitates strategies that work at the level of the on-chip network
with its rising power budget.
This thesis proposes models, techniques and architectures to improve
power and thermal integrity of Network-on-Chip (NoC)-based
many-core systems. The thesis is composed of two major parts: i)
minimization and modelling of power supply variations to improve
power integrity; and ii) dynamic thermal adaptation to improve thermal
integrity. This thesis makes four major contributions. The first is
a computational model of on-chip power supply variations in NoCs.
The proposed model embeds a power delivery model, an NoC activity
simulator and a power model. The model is verified with SPICE simulation
and employed to analyse power supply variations in synthetic
and real NoC workloads. Novel observations regarding power supply
noise correlation with different traffic patterns and routing algorithms
are found. The second is a new application mapping strategy aiming
vii
to minimize power supply noise in NoCs. This is achieved by defining
a new metric, switching activity density, and employing a force-based
objective function that results in minimizing switching density. Significant
reductions in power supply noise (PSN) are achieved with a low
energy penalty. This reduction in PSN also results in a better link timing
accuracy. The third contribution is a new dynamic thermal-adaptive
routing strategy to effectively diffuse heat from the NoC-based threedimensional
(3D) CMPs, using a dynamic programming (DP)-based distributed
control architecture. Moreover, a new approach for efficient extension
of two-dimensional (2D) partially-adaptive routing algorithms
to 3D is presented. This approach improves three-dimensional networkon-
chip (3D NoC) routing adaptivity while ensuring deadlock-freeness.
Finally, the proposed thermal-adaptive routing is implemented in
field-programmable gate array (FPGA), and implementation challenges,
for both thermal sensing and the dynamic control architecture are addressed.
The proposed routing implementation is evaluated in terms
of both functionality and performance.
The methodologies and architectures proposed in this thesis open a
new direction for improving the power and thermal integrity of future
NoC-based 2D and 3D many-core architectures
DESIGN AUTOMATION FOR CARBON NANOTUBE CIRCUITS CONSIDERING PERFORMANCE AND SECURITY OPTIMIZATION
As prevailing copper interconnect technology advances to its fundamental physical limit, interconnect delay due to ever-increasing wire resistivity has greatly limited the circuit miniaturization. Carbon nanotube (CNT) interconnects have emerged as promising replacement materials for copper interconnects due to their superior conductivity. Buffer insertion for CNT interconnects is capable of improving circuit timing of signal nets with limited buffer deployment. However, due to the imperfection of fabricating long straight CNT, there exist significant unidimensional-spatially correlated variations on the critical CNT geometric parameters such as the diameter and density, which will affect the circuit performance.
This dissertation develops a novel timing driven buffer insertion technique considering unidimensional correlations of variations of CNT. Although the fabrication variations of CNTs are not desired for the circuit designs targeting performance optimization and reliability, these inherent imperfections make them natural candidates for building highly secure physical unclonable function (PUF), which is an advanced hardware security technology. A novel CNT PUF design through leveraging Lorenz chaotic system is developed and we show that it is resistant to many machine learning modeling attacks. In summary, the studies in this dissertation demonstrate that CNT technology is highly promising for performance and security optimizations in advanced VLSI circuit design
Studies on physical interconnect technologies in advanced SoC designs
制度:新 ; 文部省報告番号:甲1992号 ; 学位の種類:博士(工学) ; 授与年月日:2005/3/15 ; 早大学位記番号:新392
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