Large Area Electronic Skin

Technological advances have enabled various approaches for developing artificial organs such as bionic eyes, artificial ears, and lungs etc. Recently electronics (e-skin) or tactile skin has attracted increasing attention for its potential to detect subtle pressure changes, which may open up applications including real-time health monitoring, minimally invasive surgery, and prosthetics. The development of e-skin is challenging as, unlike other artificial organs, tactile skin has large number of different types of sensors, which are distributed over large areas and generate large amount of data. On top of this, the attributes such as softness, stretchability, and bendability etc., are difficult to be achieved as today's electronics technology is meant for electronics on planar and stiff substrates such as silicon wafers. This said, many advances, pursued through “More than Moore” technology, have recently raised hope as some of these relate to flexible electronics and have been targeted towards developing e-skin. Depending on the technology and application, the scale of e-skin could vary from small patch (e.g. for health monitoring) to large area skin (e.g. for robotics). This invited paper presents some of the advances in large area e-skin and flexible electronics, particularly related to robotics

Characterization of lithographically printed resistive strain gauges

This paper reports progress in sensor fabrication by the conductive lithographic film (CLF) printing process. Work describing strain-sensitive structures manufactured using a modified printing process and conductive inks is addressed. The performance of a "single-ink" strain-sensitive structure when printed on six alternative substrates (GlossArt, PolyArt, Teslin, Mylar C, Melinex, and Kapton) is analyzed. Though not intending to compete with conventional gauges in high-tolerance measurement, the structures exhibit properties that indicate suitability for novel applications

Examination of silver-graphite lithographically printed resistive strain sensors

This paper reports the design and manufacture of three differing types of resistive strain sensitive structures fabricated using the Conductive Lithographic Film (CLF) printing process. The structures, utilising two inks prepared with silver and graphite particulates as the conductive phase, have been analysed to determine electrical and mechanical properties with respect to strain, temperature and humidity when deposited on four alternative substrate materials (GlossArt, PolyArt, Teslin and Melinex)

Exploitation of Transparent Conductive Oxides in the Implementation of a Window-Integrated Wireless Sensor Node

Exploitation of transparent conductive oxides (TCO) to implement an energy-autonomous sensor node for a wireless sensor network (WSN) is studied and a practical solution presented. In the practical implementations, flexible and rigid substrates that is polyimide and glass, are coated with TCO, namely aluminum doped zinc oxide (AZO). AZO-coated flexible substrates are used to form thermoelectric generators (TEG) that produce electricity for the sensor electronics of the node from thermal gradients on a window. As the second solution to utilize AZO, its conductive properties are exploited to implement transparent antennas for the sensor node. Antennas for a UHF RFID transponder and the Bluetooth radio of the node are implemented. A prototype of a flexible transparent TEG, with the area of 67 cm2 when folded, was measured to produce power of 1.6 uW with a temperature difference of 43 K. A radiation efficiency of -9.1 dB was measured for the transparent RFID antenna prototype with the center frequency of 900 MHz. Radiation efficiencies between -3.8 dB and -0.4 dB, depending on the substrate, were obtained for the 2.45 GHz Bluetooth antenna.Comment: 10 pages, 14 figures, last author version accepted for publication in IEEE Sensors Journa

Conductive lithographic film fabricated resistive strain gauges

This paper reports progress in sensor fabrication by the conductive lithographic film (CLF) printing process. Work describing strain sensitive structures manufactured using a modified printing process and conductive inks are addressed. The performance of a 'single ink' strain sensitive structure when printed on six alternative polymer substrates (GlossArt, PolyArt, Teslin, Mylar C, Mylar and Kapton) is analysed. Though not intending to compete with conventional gauges in high tolerance measurement, the structures exhibit properties that indicate suitability for novel applications

Scalable Microfabrication Procedures for Adhesive-Integrated Flexible and Stretchable Electronic Sensors.

New classes of ultrathin flexible and stretchable devices have changed the way modern electronics are designed to interact with their target systems. Though more and more novel technologies surface and steer the way we think about future electronics, there exists an unmet need in regards to optimizing the fabrication procedures for these devices so that large-scale industrial translation is realistic. This article presents an unconventional approach for facile microfabrication and processing of adhesive-peeled (AP) flexible sensors. By assembling AP sensors on a weakly-adhering substrate in an inverted fashion, we demonstrate a procedure with 50% reduced end-to-end processing time that achieves greater levels of fabrication yield. The methodology is used to demonstrate the fabrication of electrical and mechanical flexible and stretchable AP sensors that are peeled-off their carrier substrates by consumer adhesives. In using this approach, we outline the manner by which adhesion is maintained and buckling is reduced for gold film processing on polydimethylsiloxane substrates. In addition, we demonstrate the compatibility of our methodology with large-scale post-processing using a roll-to-roll approach

Pervasive liquid metal direct writing electronics with roller-ball pen

A roller-ball pen enabled direct writing electronics via room temperature liquid metal ink was proposed. With the rolling to print mechanism, the metallic inks were smoothly written on flexible polymer substrate to form conductive tracks and electronic devices. The contact angle analyzer and scanning electron microscope were implemented to probe the inner property of the obtained electronics. An ever high writing resolution with line width and thickness as 200{\mu}m and 80{\mu}m, respectively was realized. Further, with the administration of external writing pressure, GaIn24.5 droplets embody increasing wettability on polymer which demonstrates the pervasive adaptability of the roller-ball pen electronics