Logic-based Technologies for Intelligent Systems: State of the Art and Perspectives

Together with the disruptive development of modern sub-symbolic approaches to artificial intelligence (AI), symbolic approaches to classical AI are re-gaining momentum, as more and more researchers exploit their potential to make AI more comprehensible, explainable, and therefore trustworthy. Since logic-based approaches lay at the core of symbolic AI, summarizing their state of the art is of paramount importance now more than ever, in order to identify trends, benefits, key features, gaps, and limitations of the techniques proposed so far, as well as to identify promising research perspectives. Along this line, this paper provides an overview of logic-based approaches and technologies by sketching their evolution and pointing out their main application areas. Future perspectives for exploitation of logic-based technologies are discussed as well, in order to identify those research fields that deserve more attention, considering the areas that already exploit logic-based approaches as well as those that are more likely to adopt logic-based approaches in the future

Engineering Automation for Reliable Software Interim Progress Report (10/01/2000 - 09/30/2001)

Prepared for: U.S. Army Research Office P.O. Box 12211 Research Triangle Park, NC 27709-2211The objective of our effort is to develop a scientific basis for producing reliable software that is also flexible and cost effective for the DoD distributed software domain. This objective addresses the long term goals of increasing the quality of service provided by complex systems while reducing development risks, costs, and time. Our work focuses on "wrap and glue" technology based on a domain specific distributed prototype model. The key to making the proposed approach reliable, flexible, and cost-effective is the automatic generation of glue and wrappers based on a designer's specification. The "wrap and glue" approach allows system designers to concentrate on the difficult interoperability problems and defines solutions in terms of deeper and more difficult interoperability issues, while freeing designers from implementation details. Specific research areas for the proposed effort include technology enabling rapid prototyping, inference for design checking, automatic program generation, distributed real-time scheduling, wrapper and glue technology, and reliability assessment and improvement. The proposed technology will be integrated with past research results to enable a quantum leap forward in the state of the art for rapid prototyping.U. S. Army Research Office P.O. Box 12211 Research Triangle Park, NC 27709-22110473-MA-SPApproved for public release; distribution is unlimited

Proceedings of the 1st Doctoral Consortium at the European Conference on Artificial Intelligence (DC-ECAI 2020)

1st Doctoral Consortium at the European Conference on Artificial Intelligence (DC-ECAI 2020), 29-30 August, 2020 Santiago de Compostela, SpainThe DC-ECAI 2020 provides a unique opportunity for PhD students, who are close to finishing their doctorate research, to interact with experienced researchers in the field. Senior members of the community are assigned as mentors for each group of students based on the student’s research or similarity of research interests. The DC-ECAI 2020, which is held virtually this year, allows students from all over the world to present their research and discuss their ongoing research and career plans with their mentor, to do networking with other participants, and to receive training and mentoring about career planning and career option