383 research outputs found

    Cooling Performance of a Novel Circulatory Flow Concentric Multi-Channel Heat Sink with Nanofluids

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    Heat rejection from electronic devices such as processors necessitates a high heat removal rate. The present study focuses on liquid-cooled novel heat sink geometry made from four channels (width 4 mm and depth 3.5 mm) configured in a concentric shape with alternate flow passages (slot of 3 mm gap). In this study, the cooling performance of the heat sink was tested under simulated controlled conditions.The lower bottom surface of the heat sink was heated at a constant heat flux condition based on dissipated power of 50 W and 70 W. The computations were carried out for different volume fractions of nanoparticles, namely 0.5% to 5%, and water as base fluid at a flow rate of 30 to 180 mL/min. The results showed a higher rate of heat rejection from the nanofluid cooled heat sink compared with water. The enhancement in performance was analyzed with the help of a temperature difference of nanofluid outlet temperature and water outlet temperature under similar operating conditions. The enhancement was ~2% for 0.5% volume fraction nanofluids and ~17% for a 5% volume fraction

    Investigation of thermal characteristics of CNF-based nanofluids for electronic cooling applications

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    A major problem being faced by existing coolants is the limited amount of heat that can be absorbed by the fluids. An innovative way to overcome this limitation is by utilizing a nano-coolant as a heat transfer medium in a cooling application. This paper was aimed at formulating an efficient nanofluid from Pyrograf III HHT24 carbon nanofibers (CNF) in a base fluid consisting of deionized water (DI) and ethylene glycol (EG) with polyvinylpyrrolidone (PVP) as the dispersant. The experiment was conducted by setting the variable weight percentage of CNF from 0.1 wt% to 1.0 wt%, with the base fluid ratio of 90:10 (DI:EG) weight percent. Then, the thermal properties of the formulated nanofluids were investigated. The test on the thermal conductivity of the nanofluids showed that the highest thermal conductivity of 0.642 W/m.K in this experiment was produced when the concentration of nanofluid is 0.5 wt% at a temperature of 40°C. Experimental investigations into the forced convective heat transfer performance of the CNF-based nanofluid in a laminar flow through a mini heat transfer test rig showed that the presence of nanoparticles enhanced the heat transfer coefficient as opposed to the original base fluid. The highest heat transfer coefficient was reported using nanofluid with a concentration of 0.6 wt% at 40°C. The enhancement of the heat transfer coefficient was due to the higher thermal conductivity value. The Nusselt number was also calculated and presented in this paper. This study showed that the CNF-based nanofluids have a huge potential to replace existing coolants in electronic cooling applications. Thus, in order to commercialize nanofluids in practice, more fundamental studies are needed to understand the crucial parameters that affect their thermal characteristics. Keywords: carbon nanofibers; nanofluid; thermal conductivity; heat transfe

    Effect of Nanofluids on Heat Pipe Thermal Performance: A Review of the Recent Literature

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    Normally conventional fluids are used in heat pipes to remove the heat based on a temperature range for its particular operating conditions [1] (see Fig.2). The addition of the nano particles to the base fluid is one of the significant issues to enhance the heat transfer of heat pipes. The purpose of this review is to summarize the research done on heat pipes using nanofluids as working fluids in recent years (2012 to 2013). This review article provides additional information for the design of heat pipes with optimum conditions regarding the heat transfer characteristics of nanofluids in heat pipes. Moreover, this paper identifies several important issues that should be considered further in future works

    Numerical Assessment of Heat Transfer and Entropy Generation of a Porous Metal Heat Sink for Electronic Cooling Applications

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    In the present study, the thermal performance of an electronic equipment cooling system is investigated. The heat sink used in the current cooling system consists of a porous channel with a rectangular cross-section that is assumed to be connected directly to the hot surface of an electronic device. In this modeling, a fully developed flow assumption is used. The Darcy–Brinkman model was used to determine the fluid flow field. Since using the local thermal equilibrium (LTE) model may provide results affected by the error in metal foams, in the present research, an attempt has first been made to examine the validity range of this model. The local thermal non-equilibrium (LTNE) model taking into account the viscous dissipation effect was then used to determine the temperature field. To validate the numerical solution, the computed results were compared with other studies, and an acceptable agreement was observed. Analysis of the temperature field shows that if the fluid–solid-phase thermal conductivity ratio is 1 or the Biot number has a large value, the difference between the temperature of the solid phase and the fluid phase decreases. Moreover, the effect of important hydrodynamic parameters and the porous medium characteristics on the field of hydrodynamic, heat, and entropy generation was studied. Velocity field analysis shows that increasing the pore density and reducing the porosity cause an increase in the shear stress on the walls. By analyzing the entropy generation, it can be found that the irreversibility of heat transfer has a significant contribution to the total irreversibility, leading to a Bejan number close to 1. As a guideline for the design of a porous metal heat sink for electronic equipment, the use of porous media with low porosity reduces the total thermal resistance and improves heat transfer, reducing the total irreversibility and the Bejan number. Moreover, the increasing of pore density increases the specific porous surface; consequently, it reduces the total irreversibility and Bejan number and improves the heat transfer

    Numerical investigation of the nanoparticles nature effect on the MHD behavior in a square cavity with a metallic obstacle

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    In this paper, a study is conducted to determine numerically the effect of the nanoparticles nature (Al2O3, CuO, and Fe3O4) on the thermo-magnetohydrodynamic behavior of a nanofluid in a square cavity with a circular obstacle. The left wall of this cavity is movable and provided with a cold temperature (Tc) and the right wall is exposed to a hot temperature (Th). However, the upper and lower walls are considered adiabatic. The purpose of this paper is to highlight the effect of aluminum dioxide, copper oxide, and iron trioxide nanoparticles on the thermal and hydrodynamic behavior under the influence of different volume fractions(0 ≤ φ ≤ 0.1), different Hartmann numbers (0 ≤ Ha ≤ 75) and Richardson number (0 ≤ Ri ≤5). The system of governing équations was solved by the finite element method adopting the Galerkine discretization. The obtained results showed that the CuO nanoparticles improve the heat transfer at the fluid and obstacle, in addition, the increase of Hartmann number reduces the heat capacity, especially with the use of Fe3O4 nanoparticles. This study falls within the context of improving the cooling rate of industrial equipment.

    Performance enhancement of photovoltaic-thermal modules using a new environmentally friendly paraffin wax and red wine-rGO/H2O nanofluid

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    Photovoltaic/thermal systems are one of the most efficient types of solar collectors because they absorb solar radiation and generate electricity and heat simultaneously. For the first time, this paper presents an investigation into the impact of red wine-rGO/H2O nanofluid and paraffin wax on the thermohydraulic properties of a photovoltaic/thermal system. The study focuses on three innovative nonlinear arrangements of the serpentine tubes. The effects of these materials and configurations are analyzed through numerical simulations. To improve the performance, environmentally friendly materials, including red wine-rGO/H2O nanofluid and paraffin wax, have been used. Various performative parameters such as electrical and thermal efficiency of the photovoltaic/thermal system, exergy, and nanofluid concentration were investigated. The results demonstrated a significant enhancement in the system’s performance when using innovative serpentine tubes instead of simple tubes for the fluid flow path. The use of paraffin C18 increases electrical efficiency, while the use of paraffin C22 improves thermal efficiency. Moreover, the incorporation of phase change materials along with the utilization of innovative geometries in the serpentine tube led to a notable improvement in the outlet temperature of the fluid, increasing it by 2.43 K. Simultaneously, it substantially reduced the temperature of the photovoltaic cells, lowering it by 21.55 K. In addition, the new model demonstrated significant improvements in both thermal and electrical efficiency compared to the simple model. Specifically, the maximum thermal efficiency improvement reached 69.2%, while the maximum electrical efficiency improvement reached 11.7%

    Numerical study optimation design of CPU cooling system analysis using CFD method

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    Computers often experience damage to the CPU, especially the mainboard and processor, due to several factors, including human error or excessive use and environmental conditions. Component placement is frequently utilized to improve the CPU room conditions to keep it cool. This research numerically investigates desktop PC processors and heatsink configurations for mechanical engineering vocational learning. The kind of metal material, number of fans, and fan arrangement were all tested at three levels. The computer components in this research are the CPU, heatsink, fan, and processor—a 65-watt Thermal Design Power (TDP) CPU with a constant air intake speed of 5 m/s. The criteria investigated include metal type (steel, aluminum, and copper), cooling design (horizontal, vertical, and mixed), and fan count (2-4-8). The methods used in this research are the Computational Fluid Dynamics (CFD) method and the Taguchi method to examine fluid flow characteristics and temperature. Numerical results show the maximum temperature is 123 °C in the vertical, eight-fan, and steel configurations. Minimum temperature 39.22 °C in mixed configuration, eight fans, and copper. These findings reveal that the kind of metal material, number of fans, and fan arrangement all impact the CPU cooler and heatsink configuration. However, the Taguchi method can provide a more detailed understanding of configuration

    Numerical Analysis of the Effect of Nanoparticles Size and Shape on the Efficiency of a Micro Heatsink

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    In this paper, two novel micro heat sinks (MHSs) were designed and subjected to thermal analysis using a numerical method. The fluid used was Boehmite alumina–water nanofluid (NFs) with high volume fractions (VOFs). Studies were conducted to determine the influence of a variety of nanoparticle (NP) shapes, such as platelet brick, blade, cylinder, and Os. The heatsink (HS) was made of copper, and the NFs entered it through the middle and exited via four outlets at the side of the HS. The finite element method was used to simulate the NFs flow and heat transfer in the HSs. For this purpose, Multi Physics COMSOL software was used. The maximum and middle values of HS temperature (T-MAX and T-Mid), thermal resistance (TH-R), heat transfer coefficient (h), FOM, etc., were studied for different NP shapes, and with Reynolds numbers (Re) of 300, 1000, and 1700, and VOFs of 0, 3, and 6%. One of the important outcomes of this work was the better thermal efficiency of the HS with rectangular fins. Moreover, it was discovered that a rise in Re increased the heat transfer. In general, adding NPs with high VOFs to MHSs is not appropriate in terms of heat. The Os shape was the best NP shape, and the platelet shape was the worst NP shape for high NPVOF. When NPs were added to an MHS, the temperature of the MHS dropped by an average of 2.8 or 2.19 K, depending on the form of the pin-fins contained inside the MHS (circular or square). The addition of NPs in the MHS with circular and square pin-fins enhanced the pressure drop by 13.5% and 13.3%, respectively, when the Re = 1700.National Research Priorities funding programPeer Reviewe

    Performance Evaluation of Thermoelectric Cooling with Two Difference Fluids Medium

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    Thermoelectric has been used in various applications related to cooling systems (TEC). Most researchers focused on expanding the application of TEC and improving heat transfer. The improvement of the heat transfer relied on the configuration, heat exchanger, and fluid medium. However, no previous work has reported the influence of air and water as the fluid’s medium on the TEC performance. Therefore, in this study, the performance of TEC with water and air as working fluids is evaluated experimentally. Besides, several input parameters are controlled to evaluate the TEC performance under different conditions. The results reveal that the variation of working fluid and input parameters influenced the overall TEC output. The increment of TEC cooling capacity is proportional to the input power, mass flow rate, and inlet temperature of the working fluid. While the input power and inlet temperature also vary the heat exchanger thermal resistance. The overall thermal resistance of the water block is averagely ten times lower than that of the heat sink, therefore, the water block is significantly better compared to the heat sink. While the highest COP obtained from the water and air system is 1.72 and 1.41, respectively
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