Complementary Symmetry Nanowire Logic Circuits: Experimental Demonstrations and in Silico Optimizations

Complementary symmetry (CS) Boolean logic utilizes both p- and n-type field-effect transistors (FETs) so that an input logic voltage signal will turn one or more p- or n-type FETs on, while turning an equal number of n- or p-type FETs off. The voltage powering the circuit is prevented from having a direct pathway to ground, making the circuit energy efficient. CS circuits are thus attractive for nanowire logic, although they are challenging to implement. CS logic requires a relatively large number of FETs per logic gate, the output logic levels must be fully restored to the input logic voltage level, and the logic gates must exhibit high gain and robust noise margins. We report on CS logic circuits constructed from arrays of 16 nm wide silicon nanowires. Gates up to a complexity of an XOR gate (6 p-FETs and 6 n-FETs) containing multiple nanowires per transistor exhibit signal restoration and can drive other logic gates, implying that large scale logic can be implemented using nanowires. In silico modeling of CS inverters, using experimentally derived look-up tables of individual FET properties, is utilized to provide feedback for optimizing the device fabrication process. Based upon this feedback, CS inverters with a gain approaching 50 and robust noise margins are demonstrated. Single nanowire-based logic gates are also demonstrated, but are found to exhibit significant device-to-device fluctuations

Modeling of CMOS devices and circuits on flexible ultrathin chips

The field of flexible electronics is rapidly evolving. The ultrathin chips are being used to address the high-performance requirements of many applications. However, simulation and prediction of changes in response of device/circuit due to bending induced stress remains a challenge as of lack of suitable compact models. This makes circuit designing for bendable electronics a difficult task. This paper presents advances in this direction, through compressive and tensile stress studies on transistors and simple circuits such as inverters with different channel lengths and orientations of transistors on ultrathin chips. Different designs of devices and circuits in a standard CMOS 0.18-μm technology were fabricated in two separated chips. The two fabricated chips were thinned down to 20 μm using standard dicing-before-grinding technique steps followed by post-CMOS processing to obtain sufficient bendability (20-mm bending radius, or 0.05% nominal strain). Electrical characterization was performed by packaging the thinned chip on a flexible substrate. Experimental results show change of carrier mobilities in respective transistors, and switching threshold voltage of the inverters during different bending conditions (maximum percentage change of 2% for compressive and 4% for tensile stress). To simulate these changes, a compact model, which is a combination of mathematical equations and extracted parameters from BSIM4, has been developed in Verilog-A and compiled into Cadence Virtuoso environment. The proposed model predicts the mobility variations and threshold voltage in compressive and tensile bending stress conditions and orientations, and shows an agreement with the experimental measurements (1% for compressive and 0.6% for tensile stress mismatch)

Product assurance technology for custom LSI/VLSI electronics

The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification

A practical floating-gate Muller-C element using vMOS threshold gates

This paper presents the rationale for vMOS-based realizations of digital circuits when logic design techniques based on threshold logic gates are used. Some practical problems in the vMOS implementation of threshold gates have been identified and solved. The feasibility and versatility of the proposed technique as well as its potential as a low-cost design technique for CMOS technologies have been shown by experimental results from a multiple-input Muller C-element. The proposed new realization exhibits better performance related to delay and area and power consumption than the traditional logic implementation

Memcapacitive Devices in Logic and Crossbar Applications

Over the last decade, memristive devices have been widely adopted in computing for various conventional and unconventional applications. While the integration density, memory property, and nonlinear characteristics have many benefits, reducing the energy consumption is limited by the resistive nature of the devices. Memcapacitors would address that limitation while still having all the benefits of memristors. Recent work has shown that with adjusted parameters during the fabrication process, a metal-oxide device can indeed exhibit a memcapacitive behavior. We introduce novel memcapacitive logic gates and memcapacitive crossbar classifiers as a proof of concept that such applications can outperform memristor-based architectures. The results illustrate that, compared to memristive logic gates, our memcapacitive gates consume about 7x less power. The memcapacitive crossbar classifier achieves similar classification performance but reduces the power consumption by a factor of about 1,500x for the MNIST dataset and a factor of about 1,000x for the CIFAR-10 dataset compared to a memristive crossbar. Our simulation results demonstrate that memcapacitive devices have great potential for both Boolean logic and analog low-power applications