The Effect Of Temperature On The Electrical Conductivity And Microstructure Behaviour Of Silver Particles

Silver conductive ink has been used in the electronics industry due to their potential advantages such as high electrical conductivity and thermal conductivity. However, silver needs to undergo a curing process to reduce the porosity between particles as well as to have a smooth conductive track to ensure maximum conductivity. Therefore, the effect of temperature on the electrical conductivity and microstructure were explored. The printing of silver conductive paste was executed on a polymer substrate through screen printing before analysis. Next, an electrical analysis was done to measure the conductivity by using a 4-point probes instrument, followed with microstructure and mechanical analysis which were carried out to observe the structure behaviour and hardness of silver respectively with respect to temperature. The study found that the electrical conductivity of silver increases when temperature elevated. Besides that, the microstructure of silver has a larger size with the increase in temperature, correspondingly cause the silver to have less hardness. In conclusion, temperature plays significant roles in increasing the electrical conductivity of silver

Um amplificador de transimpedância de ganho variável para aplicação em osciladores baseados em MEMS

Orientador: José Alexandre DinizDissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Elétrica e de ComputaçãoResumo: Um amplificador de transimpedância (TIA) de ganho variável é apresentado. Implementado em tecnologia 0,18 'mi'm, o projeto relatado possui a finalidade de prover um amplificador de sustentação para osciladores baseados em ressonadores do tipo MEMS (Micro-Electro-Mechanical System). Entre outros, as peculiaridades de projeto envolvem um desafiante compromisso entre Ganho, Largura de Banda, Ruído e Consumo de potência. Sendo assim, o amplificador foi implementado através do cascateamento de quatro estágios de ganho similares, lançando-se mão de realimentação do tipo shunt-shunt para diminuir as impedâncias de entrada e saída. Através do emprego de um estágio de ganho variável, uma alta faixa dinâmica de ganho é alcançada (53 dB), com um ganho máximo de transimpedância de 118 dB'ômega'...Observação: O resumo, na íntegra, poderá ser visualizado no texto completo da tese digitalAbstract: A variable gain Transimpedance Amplifier (TIA) is presented. Realized in 0.18 'mi'm technology, this amplifier was conceived with the purpose of providing oscillation sustaining for Micro-Electro-Mechanical System (MEMS) based oscillators. Facing a quite challenging trade-off between Gain, Bandwidth, Noise and Power consumption, the TIA was implemented through the cascade of four similar gain stages, with the application of shunt-shunt feedback to lower both input and output resistances. With the employment of a variable-gain stage, this TIA presents a large gain tunability of 53 dB, with a also large maximum transimpedance gain of 118 dB'omega'...Note: The complete abstract is available with the full electronic documentMestradoEletrônica, Microeletrônica e OptoeletrônicaMestre em Engenharia Elétric

An interleaved full nyquist high-speed DAC technique

A 9 bit 11 GS/s DAC is presented that achieves an SFDR of more than 50 dB across Nyquist and IM3 below 50 dBc across Nyquist. The DAC uses a two-times interleaved architecture to suppress spurs that typically limit DAC performance. Despite requiring two current-steering DACs for the interleaved architecture, the relative low demands on performance of these sub-DACs imply that they can be implemented in an area and power efficient way. Together with a quad-switching architecture to decrease demands on the power supply and bias generation and employing the multiplexer switches in triode, the total core area is only 0.04 mm2 while consuming 110 mW from a single 1.0 V supply

Smart and high-performance digital-to-analog converters with dynamic-mismatch mapping

The trends of advanced communication systems, such as the high data rate in multi-channel base-stations and digital IF conversion in software-defined radios, have caused a continuously increasing demand for high performance interface circuits between the analog and the digital domain. A Digital-to-Analog converter (DAC) is such an interface circuit in the transmitter path. High bandwidth, high linearity and low noise are the main design challenges in high performance DACs. Current-steering is the most suitable architecture to meet these performance requirements. The aim of this thesis is to develop design techniques for high-speed high-performance Nyquist current-steering DACs, especially for the design of DACs with high dynamic performance, e.g. high linearity and low noise. The thesis starts with an introduction to DACs in chapter 2. The function in time/frequency domain, performance specifications, architectures and physical implementations of DACs are brie y discussed. Benchmarks of state-of-the-art published Nyquist DACs are also given. Chapter 3 analyzes performance limitations by various error sources in Nyquist current-steering DACs. The outcome shows that in the frequency range of DC to hundreds of MHz, mismatch errors, i.e. amplitude and timing errors, dominate the DAC linearity. Moreover, as frequencies increase, the effect of timing errors becomes more and more dominant over that of amplitude errors. Two new parameters, i.e. dynamic-INL and dynamic-DNL, are proposed to evaluate the matching of current cells. Compared to the traditional static-INL/DNL, the dynamic-INL/DNL can describe the matching between current cells more accurately and completely. By reducing the dynamic-INL/DNL, the non-linearities caused by all mismatch errors can be reduced. Therefore, both the DAC static and dynamic performance can be improved. The dynamic-INL/DNL are frequency-dependent parameters based on the measurement modulation frequency fm. This fm determines the weight between amplitude and timing errors in the dynamic-INL/DNL. Actually, this gives a freedom to optimize the DAC performance for different applications, e.g. low fm for low frequency applications and high fm for high frequency applications. Chapter 4 summarizes the existing design techniques for intrinsic and smart DACs. Due to technology limitations, it is diffcult to reduce the mismatch errors just by intrinsic DAC design with reasonable chip area and power consumption. Therefore, calibration techniques are required. An intrinsic DAC with calibration is called a smart DAC. Existing analog calibration techniques mainly focus on current source calibration, so that the amplitude error can be reduced. Dynamic element matching is a kind of digital calibration technique. It can reduce the non-linearities caused by all mismatch errors, but at the cost of an increased noise oor. Mapping is another kind of digital calibration technique and will not increase the noise. Mapping, as a highly digitized calibration technique, has many advantages. Since it corrects the error effects in the digital domain, the DAC analog core can be made clean and compact, which reduces the parasitics and the interference generated in the analog part. Traditional mapping is static-mismatch mapping, i.e. mapping only for amplitude errors, which many publications have already addressed on. Several concepts have also been proposed on mapping for timing errors. However, just mapping for amplitude or timing error is not enough to guarantee a good performance. This work focuses on developing mapping techniques which can correct both amplitude and timing errors at the same time. Chapter 5 introduces a novel mapping technique, called dynamic-mismatch mapping (DMM). By modulating current cells as square-wave outputs and measuring the dynamic-mismatch errors as vectors, DMM optimizes the switching sequence of current cells based on dynamic-mismatch error cancelation such that the dynamic-INL can be reduced. After reducing the dynamic-INL, the non-linearities caused by both amplitude and timing errors can be significantly reduced in the whole Nyquist band, which is confirmed by Matlab behavioral-level Monte-Carlo simulations. Compared to traditional static-mismatch mapping (SMM), DMM can reduce the non-linearities caused by both amplitude and timing errors. Compared to dynamic element matching (DEM), DMM does not increase the noise floor. The dynamic-mismatch error has to be accurately measured in order to gain the maximal benefit from DMM. An on-chip dynamic-mismatch error sensor based on a zero-IF receiver is proposed in chapter 6. This sensor is especially designed for low 1/f noise since the signal is directly down-converted to DC. Its signal transfer function and noise analysis are also given and con??rmed by transistor-level simulations. Chapter 7 gives a design example of a 14-bit current-steering DAC in 0.14mum CMOS technology. The DAC can be configured in an intrinsic-DAC mode or a smart-DAC mode. In the intrinsic-DAC mode, the 14-bit 650MS/s intrinsic DAC core achieves a performance of SFDR>65dBc across the whole 325MHz Nyquist band. In the smart-DAC mode, compared to the intrinsic DAC performance, DMM improves the DAC performance in the whole Nyquist band, providing at least 5dB linearity improvement at 200MS/s and without increasing the noise oor. This 14-bit 200MS/s smart DAC with DMM achieves a performance of SFDR>78dBc, IM

Passive und aktive Radio Frequency Identification Tags im 60-GHz-Band

Die Einführung des millimeter-Wellen-Bandes eröffnet neue Perspektiven für die Radio Frequency Identification (RFID) Kommunikationssysteme. Der Enwurf des Systems im 60-GHz-Band ermöglicht die Implementierung der On-Chip Antenne und darüber hinaus die Implementierung eines RFID-Tags auf einem einzigen Chip. Dennoch ist es aufgrund der gesetzlichen Beschränkung der effektiven isotropen Strahlungsleistung (EIRP) des Lesegeräts und der erhöhten Freiraum-Dielektrikumsverluste eine Herausforderung, eine zuverlässige Kommunikationsreichweite von mehreren Millimetern zu erreichen. Neue Lösungen sind für jeden Block sowohl im Lesegerät als auch im Single-Chip-Tag erforderlich. Obwohl das Lesegerät batteriebetrieben ist, ist es immer noch eine Herausforderung, die maximal zulässigen 20 dBm IERP des Lesersenders energieeffizient zu erzeugen. Darüber hinaus sollte der Empfänger einen ausreichenden Dynamikbereich haben, um das vom Tag kommende Signal zu erkennen. Auf der Tag-Seite sind die Hauptherausforderungen das Co-Design der effizienten On-Chip-Antennen-Implementierung, die hochempfindliche Gleichrichter-Implementierung und das Rückkommunikationskonzept. Diese Arbeit konzentriert sich auf die Machbarkeitsstudie des Single-Chip-RFID-Tags und die Implementierung im Millimeterwellenbereich. Es werden zwei Rückkommunikationskonzepte untersucht - Backscattering-Rückkommunikation und eine Kommunikation unter Verwendung von Ultra-Low-Power (ULP) Radios. Beide werden in einem 22 nm FDSOI Prozess auf einem Substrat mit geringem Widerstand implementiert. Beide Tags arbeiten mit einer Versorgungsspannung von 0,4 V, um die Kommunikationsreichweite zu maximieren. Die Link-Budgets sind so ausgelegt, dass sie die regulatorischen Beschränkungen einhalten. Die Auswahl des Technologieknotens wird begründet. Verschiedene Aspekte im Zusammenhang mit der Technologie werden diskutiert, wie z. B. Geräteleistung, passiver Qualitätsfaktor, Leistungsdichte der Kondensatoren. Der Backscattering RFID-Tag wird zuerst entworfen, da er eine relativ einfachere Topologie hat. Die Probleme der Gleichrichterempfindlichkeit im Rahmen des analogen Frontends, der On-Chip-Antenneneffizienz und der konjugierten Anpassung beider werden untersucht. Eine Kommunikationsreichweite von 5 mm wird angestrebt und realisiert. Um die Kommunikationsreichweite weiter zu erhöhen, wird in der zweiten Phase ein Tag mit einer aktiven Rückkommunikation implementiert. Hier wird die Gleichrichterempfindlichkeit weiter verbessert. Es wird ein 0,4V ULP Radio entworfen, das sich die Antenne mit dem Gleichrichter über einen Single-Pole- Double-Through (SPDT) Schalter teilt. Ein Abstand von 2 cm erwies sich als realisierbar, wobei die gesetzlichen Bestimmungen eingehalten und der dynamische Bereich des Leseempfängers nicht überschritten wurde. Es wird die höchste normalisierte Kommunikationsreichweite pro Leser-EIRP erreicht. Weitere Verbesserungsmöglichkeiten werden diskutiert

Towards Efficient Resource Allocation for Embedded Systems

Das Hauptthema ist die dynamische Ressourcenverwaltung in eingebetteten Systemen, insbesondere die Verwaltung von Rechenzeit und Netzwerkverkehr auf einem MPSoC. Die Idee besteht darin, eine Pipeline für die Verarbeitung von Mobiler Kommunikation auf dem Chip dynamisch zu schedulen, um die Effizienz der Hardwareressourcen zu verbessern, ohne den Ressourcenverbrauch des dynamischen Schedulings dramatisch zu erhöhen. Sowohl Software- als auch Hardwaremodule werden auf Hotspots im Ressourcenverbrauch untersucht und optimiert, um diese zu entfernen. Da Applikationen im Bereich der Signalverarbeitung normalerweise mit Hilfe von SDF-Diagrammen beschrieben werden können, wird deren dynamisches Scheduling optimiert, um den Ressourcenverbrauch gegenüber dem üblicherweise verwendeten statischen Scheduling zu verbessern. Es wird ein hybrider dynamischer Scheduler vorgestellt, der die Vorteile von Processing-Networks und der Planung von Task-Graphen kombiniert. Es ermöglicht dem Scheduler, ein Gleichgewicht zwischen der Parallelisierung der Berechnung und der Zunahme des dynamischen Scheduling-Aufands optimal abzuwägen. Der resultierende dynamisch erstellte Schedule reduziert den Ressourcenverbrauch um etwa 50%, wobei die Laufzeit im Vergleich zu einem statischen Schedule nur um 20% erhöht wird. Zusätzlich wird ein verteilter dynamischer SDF-Scheduler vorgeschlagen, der das Scheduling in verschiedene Teile zerlegt, die dann zu einer Pipeline verbunden werden, um mehrere parallele Prozessoren einzubeziehen. Jeder Scheduling-Teil wird zu einem Cluster mit Load-Balancing erweitert, um die Anzahl der parallel laufenden Scheduling-Jobs weiter zu erhöhen. Auf diese Weise wird dem vorhandene Engpass bei dem dynamischen Scheduling eines zentralisierten Schedulers entgegengewirkt, sodass 7x mehr Prozessoren mit dem Pipelined-Clustered-Dynamic-Scheduler für eine typische Signalverarbeitungsanwendung verwendet werden können. Das neue dynamische Scheduling-System setzt das Vorhandensein von drei verschiedenen Kommunikationsmodi zwischen den Verarbeitungskernen voraus. Bei der Emulation auf Basis des häufig verwendeten RDMA-Protokolls treten Leistungsprobleme auf. Sehr gut kann RDMA für einmalige Punkt-zu-Punkt-Datenübertragungen verwendet werden, wie sie bei der Ausführung von Task-Graphen verwendet werden. Process-Networks verwenden normalerweise Datenströme mit hohem Volumen und hoher Bandbreite. Es wird eine FIFO-basierte Kommunikationslösung vorgestellt, die einen zyklischen Puffer sowohl im Sender als auch im Empfänger implementiert, um diesen Bedarf zu decken. Die Pufferbehandlung und die Datenübertragung zwischen ihnen erfolgen ausschließlich in Hardware, um den Software-Overhead aus der Anwendung zu entfernen. Die Implementierung verbessert die Zugriffsverwaltung mehrerer Nutzer auf flächen-effiziente Single-Port Speichermodule. Es werden 0,8 der theoretisch möglichen Bandbreite, die normalerweise nur mit flächenmäßig teureren Dual-Port-Speichern erreicht wird. Der dritte Kommunikationsmodus definiert eine einfache Message-Passing-Implementierung, die ohne einen Verbindungszustand auskommt. Dieser Modus wird für eine effiziente prozessübergreifende Kommunikation des verteilten Scheduling-Systems und der engen Ansteuerung der restlichen Prozessoren benötigt. Eine Flusskontrolle in Hardware stellt sicher, dass eine große Anzahl von Sendern Nachrichten an denselben Empfänger senden kann. Dabei wird garantiert, dass alle Nachrichten korrekt empfangen werden, ohne dass eine Verbindung hergestellt werden muss und die Nachrichtenlaufzeit gering bleibt. Die Arbeit konzentriert sich auf die Optimierung des Codesigns von Hardware und Software, um die kompromisslose Ressourceneffizienz der dynamischen SDF-Graphen-Planung zu erhöhen. Besonderes Augenmerk wird auf die Abhängigkeiten zwischen den Ebenen eines verteilten Scheduling-Systems gelegt, das auf der Verfügbarkeit spezifischer hardwarebeschleunigter Kommunikationsmethoden beruht.:1 Introduction 1.1 Motivation 1.2 The Multiprocessor System on Chip Architecture 1.3 Concrete MPSoC Architecture 1.4 Representing LTE/5G baseband processing as Static Data Flow 1.5 Compuation Stack 1.6 Performance Hotspots Addressed 1.7 State of the Art 1.8 Overview of the Work 2 Hybrid SDF Execution 2.1 Addressed Performance Hotspot 2.2 State of the Art 2.3 Static Data Flow Graphs 2.4 Runtime Environment 2.5 Overhead of Deloying Tasks to a MPSoC 2.6 Interpretation of SDF Graphs as Task Graphs 2.7 Interpreting SDF Graphs as Process Networks 2.8 Hybrid Interpretation 2.9 Graph Topology Considerations 2.10 Theoretic Impact of Hybrid Interpretation 2.11 Simulating Hybrid Execution 2.12 Pipeline SDF Graph Example 2.13 Random SDF Graphs 2.14 LTE-like SDF Graph 2.15 Key Lernings 3 Distribution of Management 3.1 Addressed Performance Hotspot 3.2 State of the Art 3.3 Revising Deployment Overhead 3.4 Distribution of Overhead 3.5 Impact of Management Distribution to Resource Utilization 3.6 Reconfigurability 3.7 Key Lernings 4 Sliced FIFO Hardware 4.1 Addressed Performance Hotspot 4.2 State of the Art 4.3 System Environment 4.4 Sliced Windowed FIFO buffer 4.5 Single FIFO Evaluation 4.6 Multiple FIFO Evalutaion 4.7 Hardware Implementation 4.8 Key Lernings 5 Message Passing Hardware 5.1 Addressed Performance Hotspot 5.2 State of the Art 5.3 Message Passing Regarded as Queueing 5.4 A Remote Direct Memory Access Based Implementation 5.5 Hardware Implementation Concept 5.6 Evalutation of Performance 5.7 Key Lernings 6 SummaryThe main topic is the dynamic resource allocation in embedded systems, especially the allocation of computing time and network traffic on an multi processor system on chip (MPSoC). The idea is to dynamically schedule a mobile communication signal processing pipeline on the chip to improve hardware resource efficiency while not dramatically improve resource consumption because of dynamic scheduling overhead. Both software and hardware modules are examined for resource consumption hotspots and optimized to remove them. Since signal processing can usually be described with the help of static data flow (SDF) graphs, the dynamic handling of those is optimized to improve resource consumption over the commonly used static scheduling approach. A hybrid dynamic scheduler is presented that combines benefits from both processing networks and task graph scheduling. It allows the scheduler to optimally balance parallelization of computation and addition of dynamic scheduling overhead. The resulting dynamically created schedule reduces resource consumption by about 50%, with a runtime increase of only 20% compared to a static schedule. Additionally, a distributed dynamic SDF scheduler is proposed that splits the scheduling into different parts, which are then connected to a scheduling pipeli ne to incorporate multiple parallel working processors. Each scheduling stage is reworked into a load-balanced cluster to increase the number of parallel scheduling jobs further. This way, the still existing dynamic scheduling bottleneck of a centralized scheduler is widened, allowing handling 7x more processors with the pipelined, clustered dynamic scheduler for a typical signal processing application. The presented dynamic scheduling system assumes the presence of three different communication modes between the processing cores. When emulated on top of the commonly used remote direct memory access (RDMA) protocol, performance issues are encountered. Firstly, RDMA can neatly be used for single-shot point-to-point data transfers, like used in task graph scheduling. Process networks usually make use of high-volume and high-bandwidth data streams. A first in first out (FIFO) communication solution is presented that implements a cyclic buffer on both sender and receiver to serve this need. The buffer handling and data transfer between them are done purely in hardware to remove software overhead from the application. The implementation improves the multi-user access to area-efficient single port on-chip memory modules. It achieves 0.8 of the theoretically possible bandwidth, usually only achieved with area expensive dual-port memories. The third communication mode defines a lightweight message passing (MP) implementation that is truly connectionless. It is needed for efficient inter-process communication of the distributed and clustered scheduling system and the worker processing units’ tight coupling. A hardware flow control assures that an arbitrary number of senders can spontaneously start sending messages to the same receiver. Yet, all messages are guaranteed to be correctly received while eliminating the need for connection establishment and keeping a low message delay. The work focuses on the hardware-software codesign optimization to increase the uncompromised resource efficiency of dynamic SDF graph scheduling. Special attention is paid to the inter-level dependencies in developing a distributed scheduling system, which relies on the availability of specific hardwareaccelerated communication methods.:1 Introduction 1.1 Motivation 1.2 The Multiprocessor System on Chip Architecture 1.3 Concrete MPSoC Architecture 1.4 Representing LTE/5G baseband processing as Static Data Flow 1.5 Compuation Stack 1.6 Performance Hotspots Addressed 1.7 State of the Art 1.8 Overview of the Work 2 Hybrid SDF Execution 2.1 Addressed Performance Hotspot 2.2 State of the Art 2.3 Static Data Flow Graphs 2.4 Runtime Environment 2.5 Overhead of Deloying Tasks to a MPSoC 2.6 Interpretation of SDF Graphs as Task Graphs 2.7 Interpreting SDF Graphs as Process Networks 2.8 Hybrid Interpretation 2.9 Graph Topology Considerations 2.10 Theoretic Impact of Hybrid Interpretation 2.11 Simulating Hybrid Execution 2.12 Pipeline SDF Graph Example 2.13 Random SDF Graphs 2.14 LTE-like SDF Graph 2.15 Key Lernings 3 Distribution of Management 3.1 Addressed Performance Hotspot 3.2 State of the Art 3.3 Revising Deployment Overhead 3.4 Distribution of Overhead 3.5 Impact of Management Distribution to Resource Utilization 3.6 Reconfigurability 3.7 Key Lernings 4 Sliced FIFO Hardware 4.1 Addressed Performance Hotspot 4.2 State of the Art 4.3 System Environment 4.4 Sliced Windowed FIFO buffer 4.5 Single FIFO Evaluation 4.6 Multiple FIFO Evalutaion 4.7 Hardware Implementation 4.8 Key Lernings 5 Message Passing Hardware 5.1 Addressed Performance Hotspot 5.2 State of the Art 5.3 Message Passing Regarded as Queueing 5.4 A Remote Direct Memory Access Based Implementation 5.5 Hardware Implementation Concept 5.6 Evalutation of Performance 5.7 Key Lernings 6 Summar