Novel Bonding technologies for wafer-level transparent packaging of MOEMS

Depending on the type of Micro-Electro-Mechanical System (MEMS), packaging costs are contributing up to 80% of the total device cost. Each MEMS device category, its function and operational environment will individually dictate the packaging requirement. Due to the lack of standardized testing procedures, the reliability of those MEMS packages sometimes can only be proven by taking into consideration its functionality over lifetime. Innovation with regards to cost reduction and standardization in the field of packaging is therefore of utmost importance to the speed of commercialisation of MEMS devices. Nowadays heavily driven by consumer applications the MEMS device market is forecasted to enjoy a compound annual growth rate (CAGR) above 13%, which is when compared to the IC device market, an outstanding growth rate. Nevertheless this forecasted value can drift upwards or downwards depending on the rate of innovation in the field of packaging. MEMS devices typically require a specific fabrication process where the device wafer is bonded to a second wafer which effectively encapsulates the MEMS structure. This method leaves the device free to move within a vacuum or an inert gas atmosphere.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing

Fabrication of Resistive Thermo-Optic Heaters on Silicon Photonic Integrated Circuits

A reliable process for the fabrication of active heater components on passive silicon photonic integrated circuits is presented in this thesis. The heater components enable modulation of the photonic circuits’ optical response through the concept of Joule heating. This thesis proposes and successfully establishes an optimized process that can be entirely carried out in an academic clean room facility. The entire cycle of design, simulation and modelling, fabrication and testing is covered. Target lithographic resolution of 300 nm was achieved through process optimization (using a spin on carbon hard mask) by using i-line 365 nm lithography. A very good resolution supported by a near-uniform silicon etch enabled successful fabrication and testing of 30 chips (out of the total 36 chips (~80%)) on a 6” wafer. The second target was the successful demonstration of thermal tuning capabilities using a resistive metal heater made from 50 nm Titanium (primary) and 150 nm Aluminum (wire) (bi-layer). A full FSR (Free Spectral Range) shift of 7 nm was measured on a 400 nm double-bus ring resonator (without modulation) and a complete 7 nm shift was achieved on the same circuit with a power supply of 6V at resistance of ~700 Ω. For a 6 dBm (3.98 mW) laser supply, a -25 dBm (0.003 mW) output was measured on a basic loop-back circuit with a propagation loss of -28 dBm. The testing results in this thesis are supported by images from optical microscopes, Scanning Electron Microscopy (SEM) and simulations from Lumerical MODE, DEVICE, FDTD and INTERCONNECT solutions

The CMS Phase-1 Pixel Detector Upgrade

The CMS detector at the CERN LHC features a silicon pixel detector as its innermost subdetector. The original CMS pixel detector has been replaced with an upgraded pixel system (CMS Phase-1 pixel detector) in the extended year-end technical stop of the LHC in 2016/2017. The upgraded CMS pixel detector is designed to cope with the higher instantaneous luminosities that have been achieved by the LHC after the upgrades to the accelerator during the first long shutdown in 2013-2014. Compared to the original pixel detector, the upgraded detector has a better tracking performance and lower mass with four barrel layers and three endcap disks on each side to provide hit coverage up to an absolute value of pseudorapidity of 2.5. This paper describes the design and construction of the CMS Phase-1 pixel detector as well as its performance from commissioning to early operation in collision data-taking

NASA Tech Briefs, April 2012

Topics include: Computational Ghost Imaging for Remote Sensing; Digital Architecture for a Trace Gas Sensor Platform; Dispersed Fringe Sensing Analysis - DFSA; Indium Tin Oxide Resistor-Based Nitric Oxide Microsensors; Gas Composition Sensing Using Carbon Nanotube Arrays; Sensor for Boundary Shear Stress in Fluid Flow; Model-Based Method for Sensor Validation; Qualification of Engineering Camera for Long-Duration Deep Space Missions; Remotely Powered Reconfigurable Receiver for Extreme Environment Sensing Platforms; Bump Bonding Using Metal-Coated Carbon Nanotubes; In Situ Mosaic Brightness Correction; Simplex GPS and InSAR Inversion Software; Virtual Machine Language 2.1; Multi-Scale Three-Dimensional Variational Data Assimilation System for Coastal Ocean Prediction; Pandora Operation and Analysis Software; Fabrication of a Cryogenic Bias Filter for Ultrasensitive Focal Plane; Processing of Nanosensors Using a Sacrificial Template Approach; High-Temperature Shape Memory Polymers; Modular Flooring System; Non-Toxic, Low-Freezing, Drop-In Replacement Heat Transfer Fluids; Materials That Enhance Efficiency and Radiation Resistance of Solar Cells; Low-Cost, Rugged High-Vacuum System; Static Gas-Charging Plug; Floating Oil-Spill Containment Device; Stemless Ball Valve; Improving Balance Function Using Low Levels of Electrical Stimulation of the Balance Organs; Oxygen-Methane Thruster; Lunar Navigation Determination System - LaNDS; Launch Method for Kites in Low-Wind or No-Wind Conditions; Supercritical CO2 Cleaning System for Planetary Protection and Contamination Control Applications; Design and Performance of a Wideband Radio Telescope; Finite Element Models for Electron Beam Freeform Fabrication Process Autonomous Information Unit for Fine-Grain Data Access Control and Information Protection in a Net-Centric System; Vehicle Detection for RCTA/ANS (Autonomous Navigation System); Image Mapping and Visual Attention on the Sensory Ego-Sphere; HyDE Framework for Stochastic and Hybrid Model-Based Diagnosis; and IMAGESEER - IMAGEs for Education and Research

Silicon-organic hybrid devices for high-speed electro-optic signal processing

Among the various elements of the silicon photonics platform, electro-optic IQ modulators play an important role. In this book, silicon-organic hybrid (SOH) integration is used to realize electro-optic IQ modulators for complex signal processing. Leveraging the high nonlinearity of organic materials, SOH IQ modulators provide low energy consumption for high-speed data transmission and frequency shifting. Furthermore, the device design is adapted for commercial foundry processes

Structural Design and Optimization of 65nm Cu/low-k Flipchip Package

Master'sMASTER OF ENGINEERIN

Dielectric reliability of copper/low-k interconnects

Ph.DDOCTOR OF PHILOSOPH

Belle II Technical Design Report

The Belle detector at the KEKB electron-positron collider has collected almost 1 billion Y(4S) events in its decade of operation. Super-KEKB, an upgrade of KEKB is under construction, to increase the luminosity by two orders of magnitude during a three-year shutdown, with an ultimate goal of 8E35 /cm^2 /s luminosity. To exploit the increased luminosity, an upgrade of the Belle detector has been proposed. A new international collaboration Belle-II, is being formed. The Technical Design Report presents physics motivation, basic methods of the accelerator upgrade, as well as key improvements of the detector.Comment: Edited by: Z. Dole\v{z}al and S. Un