Dipole resonances in light neutron-rich nuclei studied with time-dependent calculations of antisymmetrized molecular dynamics

In order to study isovector dipole response of neutron-rich nuclei, we have applied a time-dependent method of antisymmetrized molecular dynamics. The dipole resonances in Be, B and C isotopes have been investigated. In $^{10}$Be, $^{15}$B, $^{16}$C, collective modes of the vibration between a core and valence neutrons cause soft resonances at the excitation energy $E_x=10-15$ MeV below the giant dipole resonance(GDR). In $^{16}$C, we found that a remarkable peak at $E_x=14$ MeV corresponds to coherent motion of four valence neutrons against a $^{12}$C core, while the GDR arises from the core vibration in the $E_x >20$ MeV region. In $^{17}$B and $^{18}$C, the dipole strengths in the low energy region decline compared with those in $^{15}$B and $^{16}$C. We also discuss the energy weighted sum rule for the $E1$ transitions.Comment: 12 figures, submitted to Phys. Rev.

DFM synthesis approach based on product-process interface modelling. Application to the peen forming process.

Engineering design approach are curently CAD-centred design process. Manufacturing information is selected and assessed very late in the design process and above all as a reactive task instead of being proactive to lead the design choices. DFM appraoches are therefore assesment methods that compare several design alternatives and not real design approaches at all. Main added value of this research work concerns the use of a product-process interface model to jointly manage both the product and the manufacturing data in a proactive DFM way. The DFM synthesis approach and the interface model are presented via the description of the DFM software platform

Thermo-mechanical analysis of flexible and stretchable systems

This paper presents a summary of the modeling and technology developed for flexible and stretchable electronics. The integration of ultra thin dies at package level, with thickness in the range of 20 to 30 μ m, into flexible and/or stretchable materials are demonstrated as well as the design and reliability test of stretchable metal interconnections at board level are analyzed by both experiments and finite element modeling. These technologies can achieve mechanically bendable and stretchable subsystems. The base substrate used for the fabrication of flexible circuits is a uniform polyimide layer, while silicones materials are preferred for the stretchable circuits. The method developed for chip embedding and interconnections is named Ultra Thin Chip Package (UTCP). Extensions of this technology can be achieved by stacking and embedding thin dies in polyimide, providing large benefits in electrical performance and still allowing some mechanical flexibility. These flexible circuits can be converted into stretchable circuits by replacing the relatively rigid polyimide by a soft and elastic silicone material. We have shown through finite element modeling and experimental validation that an appropriate thermo mechanical design is necessary to achieve mechanically reliable circuits and thermally optimized packages