1,193 research outputs found
Future of smart cardiovascular implants
Cardiovascular disease remains the leading cause of death in Western society. Recent technological advances have opened the opportunity of developing new and innovative smart stent devices that have advanced electrical properties that can improve diagnosis and even treatment of previously intractable conditions, such as central line access failure, atherosclerosis and reporting on vascular grafts for renal dialysis. Here we review the latest advances in the field of cardiovascular medical implants, providing a broad overview of the application of their use in the context of cardiovascular disease rather than an in-depth analysis of the current state of the art. We cover their powering, communication and the challenges faced in their fabrication. We focus specifically on those devices required to maintain vascular access such as ones used to treat arterial disease, a major source of heart attacks and strokes. We look forward to advances in these technologies in the future and their implementation to improve the human condition
Communication channel analysis and real time compressed sensing for high density neural recording devices
Next generation neural recording and Brain-
Machine Interface (BMI) devices call for high density or distributed
systems with more than 1000 recording sites. As the
recording site density grows, the device generates data on the
scale of several hundred megabits per second (Mbps). Transmitting
such large amounts of data induces significant power
consumption and heat dissipation for the implanted electronics.
Facing these constraints, efficient on-chip compression techniques
become essential to the reduction of implanted systems power
consumption. This paper analyzes the communication channel
constraints for high density neural recording devices. This paper
then quantifies the improvement on communication channel
using efficient on-chip compression methods. Finally, This paper
describes a Compressed Sensing (CS) based system that can
reduce the data rate by > 10x times while using power on
the order of a few hundred nW per recording channel
Modulation Techniques for Biomedical Implanted Devices and Their Challenges
Implanted medical devices are very important electronic devices because of their usefulness in monitoring and diagnosis, safety and comfort for patients. Since 1950s, remarkable efforts have been undertaken for the development of bio-medical implanted and wireless telemetry bio-devices. Issues such as design of suitable modulation methods, use of power and monitoring devices, transfer energy from external to internal parts with high efficiency and high data rates and low power consumption all play an important role in the development of implantable devices. This paper provides a comprehensive survey on various modulation and demodulation techniques such as amplitude shift keying (ASK), frequency shift keying (FSK) and phase shift keying (PSK) of the existing wireless implanted devices. The details of specifications, including carrier frequency, CMOS size, data rate, power consumption and supply, chip area and application of the various modulation schemes of the implanted devices are investigated and summarized in the tables along with the corresponding key references. Current challenges and problems of the typical modulation applications of these technologies are illustrated with a brief suggestions and discussion for the progress of implanted device research in the future. It is observed that the prime requisites for the good quality of the implanted devices and their reliability are the energy transformation, data rate, CMOS size, power consumption and operation frequency. This review will hopefully lead to increasing efforts towards the development of low powered, high efficient, high data rate and reliable implanted devices
Wafer-Level Parylene Packaging With Integrated RF Electronics for Wireless Retinal Prostheses
This paper presents an embedded chip integration
technology that incorporates silicon housings and flexible
Parylene-based microelectromechanical systems (MEMS) devices.
Accelerated-lifetime soak testing is performed in saline at elevated
temperatures to study the packaging performance of Parylene C
thin films. Experimental results show that the silicon chip under
test is well protected by Parylene, and the lifetime of Parylenecoated
metal at body temperature (37°C) is more than 60 years,
indicating that Parylene C is an excellent structural and packaging
material for biomedical applications. To demonstrate the proposed
packaging technology, a flexible MEMS radio-frequency (RF) coil
has been integrated with an RF identification (RFID) circuit die.
The coil has an inductance of 16 μH with two layers of metal
completely encapsulated in Parylene C, which is microfabricated
using a Parylene–metal–Parylene thin-film technology. The chip
is a commercially available read-only RFID chip with a typical
operating frequency of 125 kHz. The functionality of the embedded
chip has been tested using an RFID reader module in both air
and saline, demonstrating successful power and data transmission
through the MEMS coil
Healthy aims: developing new medical implants and diagnostic equipment
Healthy Aims is a €23-million, four-year project, funded under the EU’s Information Society Technology Sixth Framework program to develop intelligent medical implants and diagnostic systems (www.healthyaims.org). The project has 25 partners from 10 countries, including commercial,
clinical, and research groups. This consortium represents a combination of disciplines to design and fabricate new medical devices and components as well as to test them in laboratories and subsequent clinical trials.
The project focuses on medical implants for nerve stimulation and diagnostic equipment based on straingauge
technology
Antennas and Propagation of Implanted RFIDs for Pervasive Healthcare Applications
© 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted
components of this work in other works.This post-acceptance version of the paper is essentially complete, but may differ from the official copy of record, which can be found at the following web location (subscription required to access full paper): http://dx.doi.org/10.1109/JPROC.2010.205101
Wireless body sensor networks for health-monitoring applications
This is an author-created, un-copyedited version of an article accepted for publication in
Physiological Measurement. The publisher is
not responsible for any errors or omissions in this version of the manuscript or any version
derived from it. The Version of Record is available online at http://dx.doi.org/10.1088/0967-3334/29/11/R01
A Three – tier bio-implantable sensor monitoring and communications platform
One major hindrance to the advent of novel bio-implantable sensor technologies is the need for a reliable power source and data communications platform capable of continuously, remotely, and wirelessly monitoring deeply implantable biomedical devices.
This research proposes the feasibility and potential of combining well established, ‘human-friendly' inductive and ultrasonic technologies to produce a proof-of-concept, generic, multi-tier power transfer and data communication platform suitable for low-power, periodically-activated implantable analogue bio-sensors.
In the inductive sub-system presented, 5 W of power is transferred across a 10 mm gap between a single pair of 39 mm (primary) and 33 mm (secondary) circular printed spiral coils (PSCs). These are printed using an 8000 dpi resolution photoplotter and fabricated on PCB by wet-etching, to the maximum permissible density.
Our ultrasonic sub-system, consisting of a single pair of Pz21 (transmitter) and Pz26 (receiver) piezoelectric PZT ceramic discs driven by low-frequency, radial/planar excitation (-31 mode), without acoustic matching layers, is also reported here for the first time. The discs are characterised by propagation tank test and directly driven by the inductively coupled power to deliver 29 μW to a receiver (implant) employing a low voltage start-up IC positioned 70 mm deep within a homogeneous liquid phantom. No batteries are used.
The deep implant is thus intermittently powered every 800 ms to charge a capacitor which enables its microcontroller, operating with a 500 kHz clock, to transmit a single nibble (4 bits) of digitized sensed data over a period of ~18 ms from deep within the phantom, to the outside world.
A power transfer efficiency of 83% using our prototype CMOS logic-gate IC driver is reported for the inductively coupled part of the system. Overall prototype system power consumption is 2.3 W with a total power transfer efficiency of 1% achieved across the tiers
A Wireless Power Transfer Based Implantable ECG Monitoring Device
Implantable medical devices (IMDs) enable patients to monitor their health anytime and receive treatment anywhere. However, due to the limited capacity of a battery, their functionalities are restricted, and the devices may not achieve their intended potential fully. The most promising way to solve this limited capacity problem is wireless power transfer (WPT) technology. In this study, a WPT based implantable electrocardiogram (ECG) monitoring device that continuously records ECG data has been proposed, and its effectiveness is verified through an animal experiment using a rat model. Our proposed device is designed to be of size 24 x 27 x 8 mm, and it is small enough to be implanted in the rat. The device transmits data continuously using a low power Bluetooth Low Energy (BLE) communication technology. To charge the battery wirelessly, transmitting (Tx) and receiving (Rx) antennas were designed and fabricated. The animal experiment results clearly showed that our WPT system enables the device to monitor the ECG of a heart in various conditions continuously, while transmitting all ECG data in real-time.11Ysciescopu
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