Thermal dissipation improvement by new technology approach: study, development and characterization

Semiconductor manufacturing requires a silicon substrate to build devices on its front side. The wafer must be thick enough to ensure a stable support during the processing steps. Since the active region of a semiconductor device is limited at the substrate surface, there is a large unused material amount. The material excess causes heat increasing during the operation of the devices. Once the Frond End of Line is completed, the excess material must be removed. Nowadays, there are different thinning techniques adopted in order to reduce the thermal resistance. The thesis project idea is the thermal dissipation improvement with a different approach: instead of reducing the wafer thickness, the adopted technology is exploiting the excess material as a heat sink. The realization of this intrinsic heat sink is achieved by the developing of a suitable process flow, which involves the selective dry etching of the silicon bulk and the subsequent electrodeposition of thick copper. This new process flow offers the advantage of maintaining the wafer “self-support” and allow working with already existing technologies saving on both dedicated thinning technologies and handling technologies. Furthermore, this new approach permits the thermal resistance improvement of semiconductor devices if compared to the standard devices

Integration of optical interconnections and optoelectronic components in flexible substrates

Licht als informatiedrager voor datacommunicatie kende een ongezien succes in de laatste decennia. Wegens de lage verliezen en hoge datasnelheden hebben ze voor het overbruggen van lange afstanden hun elektrische tegenhangers reeds geruime tijd verdrongen. Deze trend zet zich ook voort voor korte afstand communicatie op printplaten. Naast zijn functie als informatiedrager, wordt licht ook gebruikt om een waaier aan fysische grootheden te meten. Ook hier heeft licht enkele significante voordelen t.o.v elektrische informatiedragers, waardoor optische sensoren wijdverspreid zijn. Een tweede duidelijke trend binnen de elektronica is het gebruik van flexibele printkaarten. Deze zijn veel dunner, lichter en betrouwbaarder dan de klassieke harde printkaarten, waardoor ze uiterst geschikt zijn voor draagbare toepassingen waar compactheid en een laag gewicht hoge vereisten zijn. De flexibiliteit van de printplaten laat ook toe hen te gebruiken op onvlakke oppervlakken en op bewegende onderdelen. Het doel van het gepresenteerde doctoraatswerk is de ontwikkeling van een nieuw technologieplatform dat bovengenoemde trends combineert. Alle bouwblokken van optische communicatie, gaande van actieve opto-elektronische componenten, aanstuurelektronica, golfgeleiderbaantjes en galvanische verbindingen tot optische koppelstructuren tussen de verschillende bouwblokken, worden zodanig gerealiseerd dat elke component flexibel is en geïntegreerd wordt in een dunne folie met een dikte van slechts 150µm. Op die manier bekomen we een flexibele folie met alle passieve en actieve onderdelen voor optische communicatie geïntegreerd met enkel een elektrische interface naar de buitenwereld, wat de aanvaarding en toepassing van deze technologie in de huidige elektronica aanzienlijk kan versnellen. Binnen het doctoraatswerk werden alle voorgestelde technologieën en processen gerealiseerd en geoptimaliseerd. Bovendien werden de optische verliezen, warmteaspecten, hoogfrequent gedrag, mechanisch gedrag en betrouwbaarheid van de technologie gekarakteriseerd en vergeleken met de huidige state-of-the-art

Micromachined three-dimensional electrode arrays for in-vitro and in-vivo electrogenic cellular networks

This dissertation presents an investigation of micromachined three-dimensional microelectrode arrays (3-D MEAs) targeted toward in-vitro and in-vivo biomedical applications. Current 3-D MEAs are predominantly silicon-based, fabricated in a planar fashion, and are assembled to achieve a true 3-D form: a technique that cannot be extended to micro-manufacturing. The integrated 3-D MEAs developed in this work are polymer-based and thus offer potential for large-scale, high volume manufacturing. Two different techniques are developed for microfabrication of these MEAs - laser micromachining of a conformally deposited polymer on a non-planar surface to create 3-D molds for metal electrodeposition; and metal transfer micromolding, where functional metal layers are transferred from one polymer to another during the process of micromolding thus eliminating the need for complex and non-repeatable 3-D lithography processes. In-vitro and in-vivo 3-D MEAs are microfabricated using these techniques and are packaged utilizing Printed Circuit Boards (PCB) or other low-cost manufacturing techniques. To demonstrate in-vitro applications, growth of 3-D co-cultures of neurons/astrocytes and tissue-slice electrophysiology with brain tissue of rat pups were implemented. To demonstrate in-vivo application, measurements of nerve conduction were implemented. Microelectrode impedance models, noise models and various process models were evaluated. The results confirmed biocompatibility of the polymers involved, acceptable impedance range and noise of the microelectrodes, and potential to improve upon an archaic clinical diagnostic application utilizing these 3-D MEAs.Ph.D.Committee Chair: Mark G. Allen; Committee Member: Elliot L. Chaikof; Committee Member: Ionnis (John) Papapolymerou; Committee Member: Maysam Ghovanloo; Committee Member: Oliver Bran

Implantable Low-Noise Fiberless Optoelectrodes for Optogenetic Control of Distinct Neural Populations

The mammalian brain is often compared to an electrical circuit, and its dynamics and function are governed by communication across different types neurons. To treat neurological disorders like Alzheimer’s and Parkinson’s, which are characterized by inhibition or amplification of neural activity in a particular region or lack of communication between different regions of the brain, there is a need to understand troubleshoot neural networks at cellular or local circuit level. In this work, we introduce a novel implantable optoelectrode that can manipulate more than one neuron type at a single site, independently and simultaneously. By delivering multi-color light using a scalable optical waveguide mixer, we demonstrate manipulation of multiple neuron types at precise spatial locations in vivo for the first time. We report design, micro-fabrication and optoelectronic packaging of a fiber-less, multicolor optoelectrode. The compact optoelectrode design consists of a 7 μm x 30 μm dielectric optical waveguide mixer and eight electrical recording sites monolithically integrated on each shank of a 22 μm-thick four-shank silicon neural probe. The waveguide mixers are coupled to eight side-emitting injection laser diodes (ILDs) via gradient-index (GRIN) lenses assembled on the probe backend. GRIN-based optoelectrode enables efficient optical coupling with large alignment tolerance to provide wide optical power range (10 to 3000 mW/mm2 irradiance) at stimulation ports. It also keeps thermal dissipation and electromagnetic interference generated by light sources sufficiently far from the sensitive neural signals, allowing thermal and electrical noise management on a multilayer printed circuit board. We demonstrated device verification and validation in CA1 pyramidal layer of mice hippocampus in both anesthetized and awake animals. The packaged devices were used to manipulate variety of multi-opsin preparations in vivo expressing different combinations of Channelrhodopsin-2, Archaerhodopsin and ChrimsonR in pyramidal and parvalbumin interneuron cells. We show effective stimulation, inhibition and recording of neural spikes at precise spatial locations with less than 100 μV stimulation-locked transients on the recording channels, demonstrating novel use of this technology in the functional dissection of neural circuits.PHDBiomedical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/137171/1/kkomal_1.pd

異種ダイレット積層を用いたフレキシブルハイブリッドデバイスの集積技術に関する研究

Tohoku University福島誉史課

Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approach

Ever growing demands for portability and functionality have always governed the electronic technology innovations. IC downscaling with Moore s law and system miniaturization with System-On-Package (SOP) paradigm has resulted and will continue to result in ultraminiaturized systems with unprecedented functionality at reduced cost. The trend towards 3D silicon system integration is expected to downscale IC I/O pad pitches from 40µm to 1- 5 µm in future. Device- to- system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. As supply currents will increase upto 220 A by 2012, the current density will exceed the maximum allowable current density of solders. The intrinsic delay and electromigration in solders are other daunting issues that become critical at nanometer size technology nodes. In addition, formation of intermetallics is also a bottleneck that poses significant mechanical issues. Recently, many research groups have investigated various techniques for copper-copper direct bonding. Typically, bonding is carried out at 400oC for 30 min followed by annealing for 30 min. High thermal budget in such process makes it less attractive for integrated systems because of the associated process incompatibilities. In the present study, copper-copper bonding at ultra fine-pitch using advanced nano-conductive and non-conductive adhesives is evaluated. The proposed copper-copper based interconnects using advanced conductive and non-conductive adhesives will be a new fundamental and comprehensive paradigm to solve all the four barriers: 1) I/O pitch 2) Electrical performance 3) Reliability and 4) Cost. This thesis investigates the mechanical integrity and reliability of copper-copper bonding using advanced adhesives through test vehicle fabrication and reliability testing. Test vehicles were fabricated using low cost electro-deposition techniques and assembled onto glass carrier. Experimental results show that proposed copper-copper bonding using advanced adhesives could potentially meet all the system performance requirements for the emerging micro/nano-systems.M.S.Committee Chair: Prof. Rao R Tummala; Committee Member: Dr. Jack Moon; Committee Member: Dr. P M Ra