Investigations on electromagnetic noises and interactions in electronic architectures : a tutorial case on a mobile system

Electromagnetic interactions become critic in embedded and smart electronic structures. The increase of electronic performances confined in a finite volume or support for mobile applications defines new electromagnetic environment and compatibility configurations (EMC). With canonical demonstrators developed for tutorials and EMC experiences, this paper present basic principles and experimental techniques to investigate and control these severe interferences. Some issues are reviewed to present actual and future scientific challenges for EMC at electronic circuit level

Aircraft electromagnetic compatibility

Illustrated are aircraft architecture, electromagnetic interference environments, electromagnetic compatibility protection techniques, program specifications, tasks, and verification and validation procedures. The environment of 400 Hz power, electrical transients, and radio frequency fields are portrayed and related to thresholds of avionics electronics. Five layers of protection for avionics are defined. Recognition is given to some present day electromagnetic compatibility weaknesses and issues which serve to reemphasize the importance of EMC verification of equipment and parts, and their ultimate EMC validation on the aircraft. Proven standards of grounding, bonding, shielding, wiring, and packaging are laid out to help provide a foundation for a comprehensive approach to successful future aircraft design and an understanding of cost effective EMC in an aircraft setting

Harmonic balance surrogate-based immunity modeling of a nonlinear analog circuit

A novel harmonic balance surrogate-based technique to create fast and accurate behavioral models predicting, in the early design stage, the performance of nonlinear analog devices during immunity tests is presented. The obtained immunity model hides the real netlist, reduces the simulation time, and avoids expensive and time-consuming measurements after tape-out, while still providing high accuracy. The model can easily be integrated into a circuit simulator together with additional subcircuits, e.g., board and package models, as such allowing to efficiently reproduce complete immunity test setups during the early design stage and without disclosing any intellectual property. The novel method is validated by means of application to an industrial case study, being an automotive voltage regulator, clearly showing the technique's capabilities and practical advantages

Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit

with constraints for high-level integration of electronics, new EMC behaviors have to be considered to prevent real electromagnetic compliance. Especially, in embedded and on-board device's context, environmental temperature has an influence on the circuit behavior and EMC figures. This paper deals with susceptibility studies combined with temperature effects on electronic devices used to control power and transmissions. Specific dual thermal-electromagnetic test set-up developed for this are presented. Main results of an experimental campaign on digital PCB dedicated for generation of Pulse Width Modulation (PWM) patterns are presented. Temperature dependant susceptibility and sensitivity of the PWM parameters are compared and analyzed

Effects of thermal aggressions on susceptibility responses and immunity figures of PWM patterns

In embedded and on-board electronics context, environmental temperature has an influence on the real electromagnetic compliance and EMC figures. We present studies and results of temperature impacts on susceptibility and immunity figures. Specific dual thermal-electromagnetic set-up have been developed for this. A campaign of EMC-Thermal-parametric measurements has been realized on PWM patterns of digital PCBs dedicated for electronic drive and command. Temperature dependent susceptibility behaviors are presented, in the range of 3GHz for harmonic aggressions, that leads to discuss of new cases of EM sensitivity, couplings and immunity approach on electronic devices

Assessment of the Immunity of Unshielded Multicore Integrated Circuits to Near Field Injection

International audienceThis paper presents a comparative assessment of the electromagnetic immunity of 4 integrated logic cores to near-field injection. These cores, located on the same die, are identical from a functional point of view, but differ by their design strategies. The injection is performed above each core according to the 6 components of the electromagnetic field, using appropriate probes. These results demonstrate that the die and bondwires of an integrated circuit can be sensitive to both magnetic and electric fields, and that some design rules can improve the immunity of integrated circuits to near-field interference

EXPERIMENTAL INVESTIGATION ON THE POWER ELECTRONIC TRANSISTOR PARAMETERS INFLUENCE TO THE NEAR-FIELD RADIATION FOR THE EMC APPLICATIONS

Abstract—With the increases of the module integration density and complexity in electrical and power electronic systems, serious problems related to electromagnetic interference (EMI) and electromagnetic compatibility (EMC) can occur. For the safety, these disturbing effects must be considered during the electronic equipment design process. One of the concerns on EMC problems is induced by unintentional near-field (NF) radiations. The modeling and measurement of EM NF radiations is one of the bottlenecks which must be overcome by electronic engineers. To predict the unwanted different misbehaviors caused by the EM radiation, NF test benches for the reconstitution of scanning maps at some millimeters of electrical/electronic circuits under test were developed at the IRSEEM laboratory. Due to the difficulty of the design with commercial simulators, the prediction of EM NF emitted by active electronic systems which are usually based on the use of transistors necessitates more relevant and reliable analysis techniques. For this reason, the main focus of this article is on the experimental analysis of EM NF radiated by an MOSFET transistor with changing electrical parameters. Descriptions of the experimental test bench for the EM map scan of transistors radiation are provided. This experimental setup allows not only to detect the EM NF emission but also to analyze the influence of the excitation signal parameter

Application of Chip-Level EMC in Automotive Product Design

Integrated circuits (ICs) are often the source of the high-frequency noise that drives electromagnetic emissions from electronic products. A case study is presented where emissions from a printed circuit board containing an automotive microcontroller are reduced significantly through analysis of the coupling mechanisms from the chip to the board and attached cables. Noise generated by the IC is explored through measurements in a semi-anechoic chamber and TEM cell, through near-field scans, and through modifications to the printed circuit board. Noise is driven by the IC through both power and I/O connections. Results show that a ferrite in series with I/O power in this application reduced emissions by 10 dB or more at critical frequencies. Possible causes for emissions from the IC and modifications that might reduce these emissions are discussed