On integrating a proprietary and a commercial architecture for optimal BIST performances in SoCs

This paper presents the integration of a proprietary hierarchical and distributed test access mechanism called HD2BIST and a BIST insertion commercial tool. The paper briefly describes the architecture and the features of both the environments and it presents some experimental results obtained on an industrial So

Testing Embedded Memories in Telecommunication Systems

Extensive system testing is mandatory nowadays to achieve high product quality. Telecommunication systems are particularly sensitive to such a requirement; to maintain market competitiveness, manufacturers need to combine reduced costs, shorter life cycles, advanced technologies, and high quality. Moreover, strict reliability constraints usually impose very low fault latencies and a high degree of fault detection for both permanent and transient faults. This article analyzes major problems related to testing complex telecommunication systems, with particular emphasis on their memory modules, often so critical from the reliability point of view. In particular, advanced BIST-based solutions are analyzed, and two significant industrial case studies presente

A programmable BIST architecture for clusters of Multiple-Port SRAMs

This paper presents a BIST architecture, based on a single microprogrammable BIST processor and a set of memory wrappers, designed to simplify the test of a system containing many distributed multi-port SRAMs of different sizes (number of bits, number of words), access protocol (asynchronous, synchronous), and timin

Programmable built-in self-testing of embedded RAM clusters in system-on-chip architectures

Multiport memories are widely used as embedded cores in all communication system-on-chip devices. Due to their high complexity and very low accessibility, built-in self-test (BIST) is the most common solution implemented to test the different memories embedded in the system. This article presents a programmable BIST architecture based on a single microprogrammable BIST processor and a set of memory wrappers designed to simplify the test of a system containing a large number of distributed multiport memories of different sizes (number of bits, number of words), access protocols (asynchronous, synchronous), and timing

HD2BIST: a hierarchical framework for BIST scheduling, data patterns delivering and diagnosis in SoCs

Proposes HD2BIST, a complete hierarchical framework for BIST scheduling, data patterns delivering, and diagnosis of a complex system including embedded cores with different test requirements as full scan cores, partial scan cores, or BIST-ready cores. The main goal of HD2BIST is to maximize and simplify the reuse of the built-in test architectures, giving the chip designer the highest flexibility in planning the overall SoC test strategy. HD2BIST defines a test access method able to provide a direct “virtual” access to each core of the system, and can be conceptually considered as a powerful complement to the P1500 standard, whose main target is to make the test interface of each core independent from the vendo

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements

Towards microagent based DBIST/DBISR

We present some ideas and experiments on using microagents for testing and repairing a distributed system, whose elements may or may not have embedded BIST (built in self test) and BISR (built in self repair) facilities. The microagents are software modules that perform monitoring, diagnosis and repair of the faults. They form together a society whose members communicate, set goals and solve tasks. The platforms taken into consideration for mobile tester microagents include Java Micro Edition, BREW, Symbian, PalmOS, as well as more general small scale platforms. Experimental tester agents in Java 2 Micro Edition and PalmOS are also presented, a solution that ensures portability, flexibility, but also a relatively small memory footprint

Advances in Architectures and Tools for FPGAs and their Impact on the Design of Complex Systems for Particle Physics

The continual improvement of semiconductor technology has provided rapid advancements in device frequency and density. Designers of electronics systems for high-energy physics (HEP) have benefited from these advancements, transitioning many designs from fixed-function ASICs to more flexible FPGA-based platforms. Today’s FPGA devices provide a significantly higher amount of resources than those available during the initial Large Hadron Collider design phase. To take advantage of the capabilities of future FPGAs in the next generation of HEP experiments, designers must not only anticipate further improvements in FPGA hardware, but must also adopt design tools and methodologies that can scale along with that hardware. In this paper, we outline the major trends in FPGA hardware, describe the design challenges these trends will present to developers of HEP electronics, and discuss a range of techniques that can be adopted to overcome these challenges