Exploring Processor and Memory Architectures for Multimedia

Multimedia has become one of the cornerstones of our 21st century society and, when combined with mobility, has enabled a tremendous evolution of our society. However, joining these two concepts introduces many technical challenges. These range from having sufficient performance for handling multimedia content to having the battery stamina for acceptable mobile usage. When taking a projection of where we are heading, we see these issues becoming ever more challenging by increased mobility as well as advancements in multimedia content, such as introduction of stereoscopic 3D and augmented reality. The increased performance needs for handling multimedia come not only from an ongoing step-up in resolution going from QVGA (320x240) to Full HD (1920x1080) a 27x increase in less than half a decade. On top of this, there is also codec evolution (MPEG-2 to H.264 AVC) that adds to the computational load increase. To meet these performance challenges there has been processing and memory architecture advances (SIMD, out-of-order superscalarity, multicore processing and heterogeneous multilevel memories) in the mobile domain, in conjunction with ever increasing operating frequencies (200MHz to 2GHz) and on-chip memory sizes (128KB to 2-3MB). At the same time there is an increase in requirements for mobility, placing higher demands on battery-powered systems despite the steady increase in battery capacity (500 to 2000mAh). This leaves negative net result in-terms of battery capacity versus performance advances. In order to make optimal use of these architectural advances and to meet the power limitations in mobile systems, there is a need for taking an overall approach on how to best utilize these systems. The right trade-off between performance and power is crucial. On top of these constraints, the flexibility aspects of the system need to be addressed. All this makes it very important to reach the right architectural balance in the system. The first goal for this thesis is to examine multimedia applications and propose a flexible solution that can meet the architectural requirements in a mobile system. Secondly, propose an automated methodology of optimally mapping multimedia data and instructions to a heterogeneous multilevel memory subsystem. The proposed methodology uses constraint programming for solving a multidimensional optimization problem. Results from this work indicate that using today’s most advanced mobile processor technology together with a multi-level heterogeneous on-chip memory subsystem can meet the performance requirements for handling multimedia. By utilizing the automated optimal memory mapping method presented in this thesis lower total power consumption can be achieved, whilst performance for multimedia applications is improved, by employing enhanced memory management. This is achieved through reduced external accesses and better reuse of memory objects. This automatic method shows high accuracy, up to 90%, for predicting multimedia memory accesses for a given architecture

Energy-Aware Data Movement In Non-Volatile Memory Hierarchies

While technology scaling enables increased density for memory cells, the intrinsic high leakage power of conventional CMOS technology and the demand for reduced energy consumption inspires the use of emerging technology alternatives such as eDRAM and Non-Volatile Memory (NVM) including STT-MRAM, PCM, and RRAM. The utilization of emerging technology in Last Level Cache (LLC) designs which occupies a signifcant fraction of total die area in Chip Multi Processors (CMPs) introduces new dimensions of vulnerability, energy consumption, and performance delivery. To be specific, a part of this research focuses on eDRAM Bit Upset Vulnerability Factor (BUVF) to assess vulnerable portion of the eDRAM refresh cycle where the critical charge varies depending on the write voltage, storage and bit-line capacitance. This dissertation broaden the study on vulnerability assessment of LLC through investigating the impact of Process Variations (PV) on narrow resistive sensing margins in high-density NVM arrays, including on-chip cache and primary memory. Large-latency and power-hungry Sense Amplifers (SAs) have been adapted to combat PV in the past. Herein, a novel approach is proposed to leverage the PV in NVM arrays using Self-Organized Sub-bank (SOS) design. SOS engages the preferred SA alternative based on the intrinsic as-built behavior of the resistive sensing timing margin to reduce the latency and power consumption while maintaining acceptable access time. On the other hand, this dissertation investigates a novel technique to prioritize the service to 1) Extensive Read Reused Accessed blocks of the LLC that are silently dropped from higher levels of cache, and 2) the portion of the working set that may exhibit distant re-reference interval in L2. In particular, we develop a lightweight Multi-level Access History Profiler to effciently identify ERRA blocks through aggregating the LLC block addresses tagged with identical Most Signifcant Bits into a single entry. Experimental results indicate that the proposed technique can reduce the L2 read miss ratio by 51.7% on average across PARSEC and SPEC2006 workloads. In addition, this dissertation will broaden and apply advancements in theories of subspace recovery to pioneer computationally-aware in-situ operand reconstruction via the novel Logic In Interconnect (LI2) scheme. LI2 will be developed, validated, and re?ned both theoretically and experimentally to realize a radically different approach to post-Moore\u27s Law computing by leveraging low-rank matrices features offering data reconstruction instead of fetching data from main memory to reduce energy/latency cost per data movement. We propose LI2 enhancement to attain high performance delivery in the post-Moore\u27s Law era through equipping the contemporary micro-architecture design with a customized memory controller which orchestrates the memory request for fetching low-rank matrices to customized Fine Grain Reconfigurable Accelerator (FGRA) for reconstruction while the other memory requests are serviced as before. The goal of LI2 is to conquer the high latency/energy required to traverse main memory arrays in the case of LLC miss, by using in-situ construction of the requested data dealing with low-rank matrices. Thus, LI2 exchanges a high volume of data transfers with a novel lightweight reconstruction method under specific conditions using a cross-layer hardware/algorithm approach

Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

Hardware/Software Co-design for Multicore Architectures

Siirretty Doriast

Green Wave : A Semi Custom Hardware Architecture for Reverse Time Migration

Over the course of the last few decades the scientific community greatly benefited from steady advances in compute performance. Until the early 2000's this performance improvement was achieved through rising clock rates. This enabled plug-n-play performance improvements for all codes. In 2005 the stagnation of CPU clock rates drove the computing hardware manufactures to attain future performance through explicit parallelism. Now the HPC community faces a new, even bigger challenge. So far performance gains were achieved through replication of general-purpose cores and nodes. Unfortunately, rising cluster sizes resulted in skyrocketing energy costs - a paradigm change in HPC architecture design is inevitable. In combination with the increasing costs of data movement, the HPC community started exploring alternatives like GPUs and large arrays of simple, low-power cores (e.g. BlueGene) to offer the better performance per Watt and greatest scalability. As in general science, the seismic community faces large-scale, complex computational challenges that can only be limited solved with available compute capabilities. Such challenges include the physically correct modeling of subsurface rock layers. This thesis analyzes the requirements and performance of isotropic (ISO), vertical transverse isotropic (VTI) and tilted transverse isotropic (TTI) wave propagation kernels as they appear in the Reverse Time Migration (RTM) imaging method. It finds that even with leading-edge, commercial off-the-shelf hardware, large-scale survey sizes cannot be imaged within reasonable time and power constraints. This thesis uses a novel architecture design method leveraging a hardware/software co-design approach, adopted from the mobile- and embedded market, for HPC. The methodology tailors an architecture design to a class of applications without loss of generality like in full custom designs. This approach was first applied in the Green Flash project, which proved that the co-design approach has the potential for high energy efficiency gains. This thesis presents the novel Green Wave architecture that is derived from the Green Flash project. Rather than focusing on climate codes, like Green Flash, Green Wave chooses RTM wave propagation kernels as its target application. Thus, the goal of the application-driven, co-design Green Wave approach, is to enable full programmability while allowing greater computational efficiency than general-purpose processors or GPUs by offering custom extensions to the processor's ISA and correctly sizing software-managed memories and an efficient on-chip network interconnect. The lowest level building blocks of the Green Wave design are pre-verified IP components. This minimizes the amount of custom logic in the design, which in turn reduces verification costs and design uncertainty. In this thesis three Green Wave architecture designs derived from ISO, VTI and TTI kernel analysis are introduced. Further, a programming model is proposed capable of hiding all communication latencies. With production-strength, cycle-accurate hardware simulators Green Wave's performance is benchmarked and its performance compared to leading on-market systems from Intel, AMD and NVidia. Based on a large-scale example survey, the results show that Green Wave has the potential of an energy efficiency improvement of 5x compared to x86 and 1.4x-4x to GPU-based clusters for ISO, VTI and TTI kernels

An FPGA implementation of an investigative many-core processor, Fynbos : in support of a Fortran autoparallelising software pipeline

Includes bibliographical references.In light of the power, memory, ILP, and utilisation walls facing the computing industry, this work examines the hypothetical many-core approach to finding greater compute performance and efficiency. In order to achieve greater efficiency in an environment in which Moore’s law continues but TDP has been capped, a means of deriving performance from dark and dim silicon is needed. The many-core hypothesis is one approach to exploiting these available transistors efficiently. As understood in this work, it involves trading in hardware control complexity for hundreds to thousands of parallel simple processing elements, and operating at a clock speed sufficiently low as to allow the efficiency gains of near threshold voltage operation. Performance is there- fore dependant on exploiting a new degree of fine-grained parallelism such as is currently only found in GPGPUs, but in a manner that is not as restrictive in application domain range. While removing the complex control hardware of traditional CPUs provides space for more arithmetic hardware, a basic level of control is still required. For a number of reasons this work chooses to replace this control largely with static scheduling. This pushes the burden of control primarily to the software and specifically the compiler, rather not to the programmer or to an application specific means of control simplification. An existing legacy tool chain capable of autoparallelising sequential Fortran code to the degree of parallelism necessary for many-core exists. This work implements a many-core architecture to match it. Prototyping the design on an FPGA, it is possible to examine the real world performance of the compiler-architecture system to a greater degree than simulation only would allow. Comparing theoretical peak performance and real performance in a case study application, the system is found to be more efficient than any other reviewed, but to also significantly under perform relative to current competing architectures. This failing is apportioned to taking the need for simple hardware too far, and an inability to implement static scheduling mitigating tactics due to lack of support for such in the compiler

Coordinated power management in heterogeneous processors

Coordinated Power Management in Heterogeneous Processors Indrani Paul 164 pages Directed by Dr. Sudhakar Yalamanchili With the end of Dennard scaling, the scaling of device feature size by itself no longer guarantees sustaining the performance improvement predicted by Moore’s Law. As industry moves to increasingly small feature sizes, performance scaling will become dominated by the physics of the computing environment and in particular by the transient behavior of interactions between power delivery, power management and thermal fields. Consequently, performance scaling must be improved by managing interactions between physical properties, which we refer to as processor physics, and system level performance metrics, thereby improving the overall efficiency of the system. The industry shift towards heterogeneous computing is in large part motivated by energy efficiency. While such tightly coupled systems benefit from reduced latency and improved performance, they also give rise to new management challenges due to phenomena such as physical asymmetry in thermal and power signatures between the diverse elements and functional asymmetry in performance. Power-performance tradeoffs in heterogeneous processors are determined by coupled behaviors between major components due to the i) on-die integration, ii) programming model and the iii) processor physics. Towards this end, this thesis demonstrates the needs for coordinated management of functional and physical resources of a heterogeneous system across all major compute and memory elements. It shows that the interactions among performance, power delivery and different types of coupling phenomena are not an artifact of an architecture instance, but is fundamental to the operation of many core and heterogeneous architectures. Managing such coupling effects is a central focus of this dissertation. This awareness has the potential to exert significant influence over the design of future power and performance management algorithms. The high-level contributions of this thesis are i) in-depth examination of characteristics and performance demands of emerging applications using hardware measurements and analysis from state-of-the-art heterogeneous processors and high-performance GPUs, ii) analysis of the effects of processor physics such as power and thermals on system level performance, iii) identification of a key set of run-time metrics that can be used to manage these effects, and iv) development and detailed evaluation of online coordinated power management techniques to optimize system level global metrics in heterogeneous CPU-GPU-memory processors.Ph.D

Temperature-Aware Design and Management for 3D Multi-Core Architectures

Vertically-integrated 3D multiprocessors systems-on-chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area while enhancing manufacturing yields and runtime performance. However, 3D MPSoCs incur amplified thermal challenges that undermine the corresponding reliability. To address these issues, several advanced cooling technologies, alongside temperature-aware design-time optimizations and run-time management schemes have been proposed. In this monograph, we provide an overall survey on the recent advances in temperature-aware 3D MPSoC considerations. We explore the recent advanced cooling strategies, thermal modeling frameworks, design-time optimizations and run-time thermal management schemes that are primarily targeted for 3D MPSoCs. Our aim of proposing this survey is to provide a global perspective, highlighting the advancements and drawbacks on the recent state-of-the-ar

Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka