フィールドにおけるテスト印加と低電力論理BISTに関する研究

Advances in semiconductor process technology have resulted in various aging issues in field operation of Very Large Scale Integration (VLSI) circuits. For example, HCI (Hot carrier injection), BTI (Bias Temperature Instability), TDDB (Time Dependent Dielectric Breakdown) are well-known aging phenomena, and they can increase the circuit delay resulting in serious reliability problems. In order to avoid system failures caused by aging, recent design usually sets a certain timing margin in operational frequency of the circuit. However, it is difficult to determine the size of the proper timing margin because of the difficulty of prediction of its aging speed in actual use that is related to operational environment. Pessimistic prediction may result in performance sacrificing although it will improve the reliability of the system. BIST-based field test is a promising way to guarantee the reliability of the circuit through detecting the aging-induced faults during the circuit operation. However, the field test has a limitation on test application time, which makes it difficult to achieve high test quality. Therefore an effective test application method at field is required. In addition to the requirement of short test application time, the BIST-based field test requires performing at-speed testing in order to detect timing-related defects. However, it is well known that power dissipation during testing is much higher than that in normal circuit operation. Because excessive power dissipation causes higher IR-drop and higher temperature, it results in delay increase during testing, and in turn, causing false at-speed testing and yield loss. While many low power test methods have been proposed to tackle the test power issue, inadequate test power reduction and lower fault coverage still remain as important issues. Moreover, low power testing that just focuses on power reduction is insufficient. When the test power is reduced to a very low level, a timing-related defect may be missed by the test, and a defective circuit will appear to be a good part passing the test. Therefore, appropriate test power control is necessary though it was out of considering in the existing methods. In this dissertation, we first proposed a new test application to satisfy the limitation of short test application time for BIST-based field test, and then we proposed a new low power BIST scheme that focuses on controlling the test power to a specified value for improving the field test quality. In chapter 3, a new field test application method named “rotating test” is presented in which a set of generated test patterns to detect aging-induced faults is partitioned into several subsets, and apply each subset in one test session at field. In order to maximize the test quality for rotating test, we proposed test partitioning methods that refer to two items: First one aims at maximizing fault coverage of each subset obtained by partitioning. Second one aims at minimizing the detection time interval of all faults in rotating test to avoid system failures. Experimental results demonstrated the effectiveness of the proposed partitioning methods. In chapter 4, we proposed a new low power BIST scheme which can control the scan-in power, scan-out power and capture power while keeping test coverage at high level. In this scheme, a new circuit called pseudo low-pass filter (PLPF) is developed for scan-in power control, and a multi-cycle capture test technique is employed to reduce the capture power. In order to control scan-out power dissipated by test responses, we proposed a novel method that selects some flip-flops in scan chains at logic design phase, and fills the selected flip-flops with proper values before starting scan-shift operation so as to reduce the switching activity associated with scan-out. The experimental results for ISCAS-89 and ITC-99 benchmark circuits show that significant scan-in power reduction rate (the original rate of 50% is reduced to 7~8%) and capture power reduction rate (the original rate of 20% is reduced to 6~7%) were derived. With the scan-out controlling method, the scan-out power can be reduced from 17.2% to 8.4%, which could not be achieved by the conventional methods. Moreover, in order to control the test power to the specified rate to accommodate the various test power requirements. A scan-shift power controlling scheme was also discussed. It showed the capability of controlling any scan-shift toggle rate between 6.7% and 50%.九州工業大学博士学位論文 学位記番号:情工博甲第289号　学位授与年月日:平成26年3月25日1. INTRODUCTION|2. PRELIMINARY|3. BIST-BASED FIELD ROTATING TEST FOR AGING-INDUCED FAULT DETECTION|4. TEST POWER REDUCTION FOR LOGIC-BIST|5. SUMMARY九州工業大学平成25年

Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka

Testability considerations for implementing an embedded memory subsystem

textThere are a number of testability considerations for VLSI design, but test coverage, test time, accuracy of test patterns and correctness of design information for DFD (Design for debug) are the most important ones in design with embedded memories. The goal of DFT (Design-for-Test) is to achieve zero defects. When it comes to the memory subsystem in SOCs (system on chips), many flavors of memory BIST (built-in self test) are able to get high test coverage in a memory, but often, no proper attention is given to the memory interface logic (shadow logic). Functional testing and BIST are the most prevalent tests for this logic, but functional testing is impractical for complicated SOC designs. As a result, industry has widely used at-speed scan testing to detect delay induced defects. Compared with functional testing, scan-based testing for delay faults reduces overall pattern generation complexity and cost by enhancing both controllability and observability of flip-flops. However, without proper modeling of memory, Xs are generated from memories. Also, when the design has chip compression logic, the number of ATPG patterns is increased significantly due to Xs from memories. In this dissertation, a register based testing method and X prevention logic are presented to tackle these problems. An important design stage for scan based testing with memory subsystems is the step to create a gate level model and verify with this model. The flow needs to provide a robust ATPG netlist model. Most industry standard CAD tools used to analyze fault coverage and generate test vectors require gate level models. However, custom embedded memories are typically designed using a transistor-level flow, there is a need for an abstraction step to generate the gate models, which must be equivalent to the actual design (transistor level). The contribution of the research is a framework to verify that the gate level representation of custom designs is equivalent to the transistor-level design. Compared to basic stuck-at fault testing, the number of patterns for at-speed testing is much larger than for basic stuck-at fault testing. So reducing test and data volume are important. In this desertion, a new scan reordering method is introduced to reduce test data with an optimal routing solution. With in depth understanding of embedded memories and flows developed during the study of custom memory DFT, a custom embedded memory Bit Mapping method using a symbolic simulator is presented in the last chapter to achieve high yield for memories.Electrical and Computer Engineerin

Integration of a Digital Built-in Self-Test for On-Chip Memories

The ability of testing on-chip circuitry is extremely essential to ASIC implemen- tations today. However, providing functional tests and verification for on-chip (embedded) memories always poses a huge number of challenges to the designer. Therefore, a co-existing automated built-in self-test block with the Design Under Test (DUT) seems crucial to provide comprehensive, efficient and robust testing features. The target DUT of this thesis project is the state-of-the-arts Ultra Low Power (ULP) dual-port SRAMs designed in ASIC group of EIT department at Lund University. This thesis starts from system RTL modeling and verification from an earlier project, and then goes through ASIC design phase in 28 nm FD-SOI technology from ST-Microelectronics. All scripts during the ASIC design phase are developed in TCL. This design is implemented with multiple power domains (using CPF approach and introducing level-shifters at crossing-points between domains) and multiple clock sources in order to make it possible to perform various measurements with a high reliability on different flavours of a dual-port SRAM.This design is able to reduce dramatically the complexity of verification and measurement to integrated memories. This digital integrated circuit (IC) is developed as an application-specific IC (ASIC) chip for functional verification of integrated memories and measuring them in different aspects such as power consumption. The design is automated and capable of being reconfigured easily in terms of required actions and data for testing on-chip memories. Put it in other words, this design has automated and optimized the generation of what data to be stored on which location on memories as well as how they have been treated and interpreted later on. For instance, it refreshes and delivers different operation modes and working patterns to the entire test system in order to fully utilize integrated memories, of which such an automation is instructed by the stimuli to the chip. Besides, the pattern generation of the stimuli is implemented on MATLAB in an automated way. Due to constant advancements in chip manufacturing technology, more devices are squeezed into the same silicon area. Meaning that in order to monitor more internal signals introduced by the increased complexity of the circuits, more dedicated input/output ports (the physical interface between the chip internal signals and outside world) are required, that makes the chip bonding and testing in the future difficult and time-consuming. Additionally, memories usually have a bigger number of pins for signal reactions than other circuit blocks do, the method of dealing with so many pins should also be taken into account. Thus, a few techniques are adopted in this system to assist the designers deal with all mentioned issues. Once the ASIC chip has been fabricated (manufactured) and bonded, the on-chip memories can be tested directly on a printed circuit board in a simple and flexible way: Once test instruction input is loaded into the chip, the system starts to update the system settings and then to generate the internal configurations(parameters) so that all different operations, modes or instructions related to memory testing are automatically processed

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

Dynamic scan chains : a novel architecture to lower the cost of VLSI test

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2003.Includes bibliographical references (p. 61-64).Fast developments in semiconductor industry have led to smaller and cheaper integrated circuit (IC) components. As the designs become larger and more complex, larger amount of test data is required to test them. This results in longer test application times, therefore, increasing cost of testing each chip. This thesis describes an architecture, named Dynamic Scan, that allows to reduce this cost by reducing the test data volume and, consequently, test application time. The Dynamic Scan architecture partitions the scan chains of the IC design into several segments by a set of multiplexers. The multiplexers allow bypassing or including a particular segment during the test application on the automatic test equipment. The optimality criteria for partitioning scan chains into segments, as well as a partitioning algorithm based on this criteria are also introduced. According to our experimental results Dynamic Scan provides almost a factor of five reduction in test data volume and test application time. More theoretical results reach as much as ten times the reductions compared to the classical scan methodologies.by Nodari S. Sitchinava.M.Eng

Low-Capture-Power Test Generation for Scan-Based At-Speed Testing

Scan-based at-speed testing is a key technology to guarantee timing-related test quality in the deep submicron era. However, its applicability is being severely challenged since significant yield loss may occur from circuit malfunction due to excessive IR drop caused by high power dissipation when a test response is captured. This paper addresses this critical problem with a novel low-capture-power X-filling method of assigning 0\u27s and 1\u27s to unspecified (X) bits in a test cube obtained during ATPG. This method reduces the circuit switching activity in capture mode and can be easily incorporated into any test generation flow to achieve capture power reduction without any area, timing, or fault coverage impact. Test vectors generated with this practical method greatly improve the applicability of scan-based at-speed testing by reducing the risk of test yield lossIEEE International Conference on Test, 2005, 8 November 2005, Austin, TX, US

Ensuring a High Quality Digital Device through Design for Testability

An electronic device is reliable if it is available for use most of the times throughout its life. The reliability can be affected by mishandling and use under abnormal operating conditions. High quality product cannot be achieved without proper verification and testing during the product development cycle. If the design is difficult to test, then it is very likely that most of the faults will not be detected before it is shipped to the customer. This paper describes how product quality can be improved by making the hardware design testable. Various designs for testability techniqueswere discussed. A three bit counter circuit was used to illustrate the benefits of design for testability by using scan chain methodology

Innovative Techniques for Testing and Diagnosing SoCs

We rely upon the continued functioning of many electronic devices for our everyday welfare, usually embedding integrated circuits that are becoming even cheaper and smaller with improved features. Nowadays, microelectronics can integrate a working computer with CPU, memories, and even GPUs on a single die, namely System-On-Chip (SoC). SoCs are also employed on automotive safety-critical applications, but need to be tested thoroughly to comply with reliability standards, in particular the ISO26262 functional safety for road vehicles. The goal of this PhD. thesis is to improve SoC reliability by proposing innovative techniques for testing and diagnosing its internal modules: CPUs, memories, peripherals, and GPUs. The proposed approaches in the sequence appearing in this thesis are described as follows: 1. Embedded Memory Diagnosis: Memories are dense and complex circuits which are susceptible to design and manufacturing errors. Hence, it is important to understand the fault occurrence in the memory array. In practice, the logical and physical array representation differs due to an optimized design which adds enhancements to the device, namely scrambling. This part proposes an accurate memory diagnosis by showing the efforts of a software tool able to analyze test results, unscramble the memory array, map failing syndromes to cell locations, elaborate cumulative analysis, and elaborate a final fault model hypothesis. Several SRAM memory failing syndromes were analyzed as case studies gathered on an industrial automotive 32-bit SoC developed by STMicroelectronics. The tool displayed defects virtually, and results were confirmed by real photos taken from a microscope. 2. Functional Test Pattern Generation: The key for a successful test is the pattern applied to the device. They can be structural or functional; the former usually benefits from embedded test modules targeting manufacturing errors and is only effective before shipping the component to the client. The latter, on the other hand, can be applied during mission minimally impacting on performance but is penalized due to high generation time. However, functional test patterns may benefit for having different goals in functional mission mode. Part III of this PhD thesis proposes three different functional test pattern generation methods for CPU cores embedded in SoCs, targeting different test purposes, described as follows: a. Functional Stress Patterns: Are suitable for optimizing functional stress during I Operational-life Tests and Burn-in Screening for an optimal device reliability characterization b. Functional Power Hungry Patterns: Are suitable for determining functional peak power for strictly limiting the power of structural patterns during manufacturing tests, thus reducing premature device over-kill while delivering high test coverage c. Software-Based Self-Test Patterns: Combines the potentiality of structural patterns with functional ones, allowing its execution periodically during mission. In addition, an external hardware communicating with a devised SBST was proposed. It helps increasing in 3% the fault coverage by testing critical Hardly Functionally Testable Faults not covered by conventional SBST patterns. An automatic functional test pattern generation exploiting an evolutionary algorithm maximizing metrics related to stress, power, and fault coverage was employed in the above-mentioned approaches to quickly generate the desired patterns. The approaches were evaluated on two industrial cases developed by STMicroelectronics; 8051-based and a 32-bit Power Architecture SoCs. Results show that generation time was reduced upto 75% in comparison to older methodologies while increasing significantly the desired metrics. 3. Fault Injection in GPGPU: Fault injection mechanisms in semiconductor devices are suitable for generating structural patterns, testing and activating mitigation techniques, and validating robust hardware and software applications. GPGPUs are known for fast parallel computation used in high performance computing and advanced driver assistance where reliability is the key point. Moreover, GPGPU manufacturers do not provide design description code due to content secrecy. Therefore, commercial fault injectors using the GPGPU model is unfeasible, making radiation tests the only resource available, but are costly. In the last part of this thesis, we propose a software implemented fault injector able to inject bit-flip in memory elements of a real GPGPU. It exploits a software debugger tool and combines the C-CUDA grammar to wisely determine fault spots and apply bit-flip operations in program variables. The goal is to validate robust parallel algorithms by studying fault propagation or activating redundancy mechanisms they possibly embed. The effectiveness of the tool was evaluated on two robust applications: redundant parallel matrix multiplication and floating point Fast Fourier Transform

A novel high-speed trellis-coded modulation encoder/decoder ASIC design

Trellis-coded Modulation (TCM) is used in bandlimited communication systems. TCM efficiency improves coding gain by combining modulation and forward error correction coding in one process. In TCM, the bandwidth expansion is not required because it uses the same symbol rate and power spectrum; the differences are the introduction of a redundancy bit and the use of a constellation with double points. In this thesis, a novel TCM encoder/decoder ASIC chip implementation is presented. This ASIC codec not only increases decoding speed but also reduces hardware complexity. The algorithm and technique are presented for a 16-state convolutional code which is used in standard 256-QAM wireless systems. In the decoder, a Hamming distance is used as a cost function to determine output in the maximum likelihood Viterbi decoder. Using the relationship between the delay states and the path state in the Trellis tree of the code, a pre-calculated Hamming distances are stored in a look-up table. In addition, an output look-up-table is generated to determine the decoder output. This table is established by the two relative delay states in the code. The thesis provides details of the algorithm and the structure of TCM codec chip. Besides using parallel processing, the ASIC implementation also uses pipelining to further increase decoding speed. The codec was implemented in ASIC using standard 0.18ƒÝm CMOS technology; the ASIC core occupied a silicon area of 1.1mm2. All register transfer level code of the codec was simulated and synthesized. The chip layout was generated and the final chip was fabricated by Taiwan Semiconductor Manufacturing Company through the Canadian Microelectronics Corporation. The functional testing of the fabricated codec was performed partially successful; the timing testing has not been fully accomplished because the chip was not always stable