55 research outputs found
Design of robust spin-transfer torque magnetic random access memories for ultralow power high performance on-chip cache applications
Spin-transfer torque magnetic random access memories (STT-MRAMs) based on magnetic tunnel junction (MTJ) has become the leading candidate for future universal memory technology due to its potential for low power, non-volatile, high speed and extremely good endurance. However, conflicting read and write requirements exist in STT-MRAM technology because the current path during read and write operations are the same. Read and write failures of STT-MRAMs are degraded further under process variations. The focus of this dissertation is to optimize the yield of STT- MRAMs under process variations by employing device-circuit-architecture co-design techniques. A devices-to-systems simulation framework was developed to evaluate the effectiveness of the techniques proposed in this dissertation. An optimization methodology for minimizing the failure probability of 1T-1MTJ STT-MRAM bit-cell by proper selection of bit-cell configuration and access transistor sizing is also proposed. A failure mitigation technique using assistsin 1T-1MTJ STT-MRAM bit-cells is also proposed and discussed. Assist techniques proposed in this dissertation to mitigate write failures either increase the amount of current available to switch the MTJ during write or decrease the required current to switch the MTJ. These techniques achieve significant reduction in bit-cell area and write power with minimal impact on bit-cell failure probability and read power. However, the proposed write assist techniques may be less effective in scaled STT-MRAM bit-cells. Furthermore, read failures need to be overcome and hence, read assist techniques are required. It has been experimentally demonstrated that a class of materials called multiferroics can enable manipulation of magnetization using electric fields via magnetoelectric effects. A read assist technique using an MTJ structure incorporating multiferroic materials is proposed and analyzed. It was found that it is very difficult to overcome the fundamental design issues with 1T-1MTJ STT-MRAM due to the two-terminal nature of the MTJ. Hence, multi-terminal MTJ structures consisting of complementary polarized pinned layers are proposed. Analysis of the proposed MTJ structures shows significant improvement in bit-cell failures. Finally, this dissertation explores two system-level applications enabled by STT-MRAMs, and shows that device-circuit-architecture co-design of STT-MRAMs is required to fully exploit its benefits
Gestión de jerarquías de memoria híbridas a nivel de sistema
Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu
Design techniques for dense embedded memory in advanced CMOS technologies
University of Minnesota Ph.D. dissertation. February 2012. Major: Electrical Engineering. Advisor: Chris H. Kim. 1 computer file (PDF); viii, 116 pages.On-die cache memory is a key component in advanced processors since it can boost micro-architectural level performance at a moderate power penalty. Demand for denser memories only going to increase as the number of cores in a microprocessor goes up with technology scaling. A commensurate increase in the amount of cache memory is needed to fully utilize the larger and more powerful processing units. 6T SRAMs have been the embedded memory of choice for modern microprocessors due to their logic compatibility, high speed, and refresh-free operation. However, the relatively large cell size and conflicting requirements for read and write make aggressive scaling of 6T SRAMs challenging in sub-22 nm. In this dissertation, circuit techniques and simulation methodologies are presented to demonstrate the potential of alternative options such as gain cell eDRAMs and spin-torque-transfer magnetic RAMs (STT-MRAMs) for high density embedded memories.Three unique test chip designs are presented to enhance the retention time and access speed of gain cell eDRAMs. Proposed bit-cells utilize preferential boostings, beneficial couplings, and aggregated cell leakages for expanding signal window between data `1' and `0'. The design space of power-delay product can be further enhanced with various assist schemes that harness the innate properties of gain cell eDRAMs. Experimental results from the test chips demonstrate that the proposed gain cell eDRAMs achieve overall faster system performances and lower static power dissipations than SRAMs in a generic 65 nm low-power (LP) CMOS process. A magnetic tunnel junction (MTJ) scaling scenario and an efficient HSPICE simulation methodology are proposed for exploring the scalability of STT-MRAMs under variation effects from 65 nm to 8 nm. A constant JC0*RA/VDD scaling method is adopted to achieve optimal read and write performances of STT-MRAMs and thermal stabilities for a 10 year retention are achieved by adjusting free layer thicknesses as well as projecting crystalline anisotropy improvements. Studies based on the proposed methodology show that in-plane STT-MRAM will outperform SRAM from 15 nm node, while its perpendicular counterpart requires further innovations in MTJ material properties in order to overcome the poor write performance from 22 nm node
Reliable Low-Power High Performance Spintronic Memories
Moores Gesetz folgend, ist es der Chipindustrie in den letzten fünf Jahrzehnten gelungen, ein
explosionsartiges Wachstum zu erreichen. Dies hatte ebenso einen exponentiellen Anstieg der
Nachfrage von Speicherkomponenten zur Folge, was wiederum zu speicherlastigen Chips in
den heutigen Computersystemen führt. Allerdings stellen traditionelle on-Chip Speichertech-
nologien wie Static Random Access Memories (SRAMs), Dynamic Random Access Memories
(DRAMs) und Flip-Flops eine Herausforderung in Bezug auf Skalierbarkeit, Verlustleistung
und Zuverlässigkeit dar. Eben jene Herausforderungen und die überwältigende Nachfrage
nach höherer Performanz und Integrationsdichte des on-Chip Speichers motivieren Forscher,
nach neuen nichtflüchtigen Speichertechnologien zu suchen. Aufkommende spintronische Spe-
ichertechnologien wie Spin Orbit Torque (SOT) und Spin Transfer Torque (STT) erhielten
in den letzten Jahren eine hohe Aufmerksamkeit, da sie eine Reihe an Vorteilen bieten. Dazu
gehören Nichtflüchtigkeit, Skalierbarkeit, hohe Beständigkeit, CMOS Kompatibilität und Unan-
fälligkeit gegenüber Soft-Errors. In der Spintronik repräsentiert der Spin eines Elektrons dessen
Information. Das Datum wird durch die Höhe des Widerstandes gespeichert, welche sich durch
das Anlegen eines polarisierten Stroms an das Speichermedium verändern lässt. Das Prob-
lem der statischen Leistung gehen die Speichergeräte sowohl durch deren verlustleistungsfreie
Eigenschaft, als auch durch ihr Standard- Aus/Sofort-Ein Verhalten an. Nichtsdestotrotz sind
noch andere Probleme, wie die hohe Zugriffslatenz und die Energieaufnahme zu lösen, bevor
sie eine verbreitete Anwendung finden können. Um diesen Problemen gerecht zu werden, sind
neue Computerparadigmen, -architekturen und -entwurfsphilosophien notwendig.
Die hohe Zugriffslatenz der Spintroniktechnologie ist auf eine vergleichsweise lange Schalt-
dauer zurückzuführen, welche die von konventionellem SRAM übersteigt. Des Weiteren ist auf
Grund des stochastischen Schaltvorgangs der Speicherzelle und des Einflusses der Prozessvari-
ation ein nicht zu vernachlässigender Zeitraum dafür erforderlich. In diesem Zeitraum wird ein
konstanter Schreibstrom durch die Bitzelle geleitet, um den Schaltvorgang zu gewährleisten.
Dieser Vorgang verursacht eine hohe Energieaufnahme. Für die Leseoperation wird gleicher-
maßen ein beachtliches Zeitfenster benötigt, ebenfalls bedingt durch den Einfluss der Prozess-
variation. Dem gegenüber stehen diverse Zuverlässigkeitsprobleme. Dazu gehören unter An-
derem die Leseintereferenz und andere Degenerationspobleme, wie das des Time Dependent Di-
electric Breakdowns (TDDB). Diese Zuverlässigkeitsprobleme sind wiederum auf die benötigten
längeren Schaltzeiten zurückzuführen, welche in der Folge auch einen über längere Zeit an-
liegenden Lese- bzw. Schreibstrom implizieren. Es ist daher notwendig, sowohl die Energie, als
auch die Latenz zur Steigerung der Zuverlässigkeit zu reduzieren, um daraus einen potenziellen
Kandidaten für ein on-Chip Speichersystem zu machen.
In dieser Dissertation werden wir Entwurfsstrategien vorstellen, welche das Ziel verfolgen,
die Herausforderungen des Cache-, Register- und Flip-Flop-Entwurfs anzugehen. Dies erre-
ichen wir unter Zuhilfenahme eines Cross-Layer Ansatzes. Für Caches entwickelten wir ver-
schiedene Ansätze auf Schaltkreisebene, welche sowohl auf der Speicherarchitekturebene, als
auch auf der Systemebene in Bezug auf Energieaufnahme, Performanzsteigerung und Zuver-
lässigkeitverbesserung evaluiert werden. Wir entwickeln eine Selbstabschalttechnik, sowohl für
die Lese-, als auch die Schreiboperation von Caches. Diese ist in der Lage, den Abschluss der
entsprechenden Operation dynamisch zu ermitteln. Nachdem der Abschluss erkannt wurde,
wird die Lese- bzw. Schreiboperation sofort gestoppt, um Energie zu sparen. Zusätzlich
limitiert die Selbstabschalttechnik die Dauer des Stromflusses durch die Speicherzelle, was
wiederum das Auftreten von TDDB und Leseinterferenz bei Schreib- bzw. Leseoperationen re-
duziert. Zur Verbesserung der Schreiblatenz heben wir den Schreibstrom an der Bitzelle an, um den magnetischen Schaltprozess zu beschleunigen. Um registerbankspezifische Anforderungen
zu berücksichtigen, haben wir zusätzlich eine Multiport-Speicherarchitektur entworfen, welche
eine einzigartige Eigenschaft der SOT-Zelle ausnutzt, um simultan Lese- und Schreiboperatio-
nen auszuführen. Es ist daher möglich Lese/Schreib- Konfilkte auf Bitzellen-Ebene zu lösen,
was sich wiederum in einer sehr viel einfacheren Multiport- Registerbankarchitektur nieder-
schlägt.
Zusätzlich zu den Speicheransätzen haben wir ebenfalls zwei Flip-Flop-Architekturen vorgestellt.
Die erste ist eine nichtflüchtige non-Shadow Flip-Flop-Architektur, welche die Speicherzelle als
aktive Komponente nutzt. Dies ermöglicht das sofortige An- und Ausschalten der Versorgungss-
pannung und ist daher besonders gut für aggressives Powergating geeignet. Alles in Allem zeigt
der vorgestellte Flip-Flop-Entwurf eine ähnliche Timing-Charakteristik wie die konventioneller
CMOS Flip-Flops auf. Jedoch erlaubt er zur selben Zeit eine signifikante Reduktion der statis-
chen Leistungsaufnahme im Vergleich zu nichtflüchtigen Shadow- Flip-Flops. Die zweite ist eine
fehlertolerante Flip-Flop-Architektur, welche sich unanfällig gegenüber diversen Defekten und
Fehlern verhält. Die Leistungsfähigkeit aller vorgestellten Techniken wird durch ausführliche
Simulationen auf Schaltkreisebene verdeutlicht, welche weiter durch detaillierte Evaluationen
auf Systemebene untermauert werden. Im Allgemeinen konnten wir verschiedene Techniken en-
twickeln, die erhebliche Verbesserungen in Bezug auf Performanz, Energie und Zuverlässigkeit
von spintronischen on-Chip Speichern, wie Caches, Register und Flip-Flops erreichen
Embedding Logic and Non-volatile Devices in CMOS Digital Circuits for Improving Energy Efficiency
abstract: Static CMOS logic has remained the dominant design style of digital systems for
more than four decades due to its robustness and near zero standby current. Static
CMOS logic circuits consist of a network of combinational logic cells and clocked sequential
elements, such as latches and flip-flops that are used for sequencing computations
over time. The majority of the digital design techniques to reduce power, area, and
leakage over the past four decades have focused almost entirely on optimizing the
combinational logic. This work explores alternate architectures for the flip-flops for
improving the overall circuit performance, power and area. It consists of three main
sections.
First, is the design of a multi-input configurable flip-flop structure with embedded
logic. A conventional D-type flip-flop may be viewed as realizing an identity function,
in which the output is simply the value of the input sampled at the clock edge. In
contrast, the proposed multi-input flip-flop, named PNAND, can be configured to
realize one of a family of Boolean functions called threshold functions. In essence,
the PNAND is a circuit implementation of the well-known binary perceptron. Unlike
other reconfigurable circuits, a PNAND can be configured by simply changing the
assignment of signals to its inputs. Using a standard cell library of such gates, a technology
mapping algorithm can be applied to transform a given netlist into one with
an optimal mixture of conventional logic gates and threshold gates. This approach
was used to fabricate a 32-bit Wallace Tree multiplier and a 32-bit booth multiplier
in 65nm LP technology. Simulation and chip measurements show more than 30%
improvement in dynamic power and more than 20% reduction in core area.
The functional yield of the PNAND reduces with geometry and voltage scaling.
The second part of this research investigates the use of two mechanisms to improve
the robustness of the PNAND circuit architecture. One is the use of forward and reverse body biases to change the device threshold and the other is the use of RRAM
devices for low voltage operation.
The third part of this research focused on the design of flip-flops with non-volatile
storage. Spin-transfer torque magnetic tunnel junctions (STT-MTJ) are integrated
with both conventional D-flipflop and the PNAND circuits to implement non-volatile
logic (NVL). These non-volatile storage enhanced flip-flops are able to save the state of
system locally when a power interruption occurs. However, manufacturing variations
in the STT-MTJs and in the CMOS transistors significantly reduce the yield, leading
to an overly pessimistic design and consequently, higher energy consumption. A
detailed analysis of the design trade-offs in the driver circuitry for performing backup
and restore, and a novel method to design the energy optimal driver for a given yield is
presented. Efficient designs of two nonvolatile flip-flop (NVFF) circuits are presented,
in which the backup time is determined on a per-chip basis, resulting in minimizing
the energy wastage and satisfying the yield constraint. To achieve a yield of 98%,
the conventional approach would have to expend nearly 5X more energy than the
minimum required, whereas the proposed tunable approach expends only 26% more
energy than the minimum. A non-volatile threshold gate architecture NV-TLFF are
designed with the same backup and restore circuitry in 65nm technology. The embedded
logic in NV-TLFF compensates performance overhead of NVL. This leads to the
possibility of zero-overhead non-volatile datapath circuits. An 8-bit multiply-and-
accumulate (MAC) unit is designed to demonstrate the performance benefits of the
proposed architecture. Based on the results of HSPICE simulations, the MAC circuit
with the proposed NV-TLFF cells is shown to consume at least 20% less power and
area as compared to the circuit designed with conventional DFFs, without sacrificing
any performance.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201
Perpendicular STT-MTJs with Double Reference Layers and its Application to Downscaled Memory Cells
Chip design presents problems due to scaling as the technology node reaches to
the physical limits. The roadmap to 7nm technology node and beyond is already traced
and overcome the problems in power and energy dissipation have become a
fundamental part in the chip design...El diseño del chip presenta problemas debido al escalamiento de dispositivos a
medida que el nodo tecnológico llega a sus límites físicos. La ruta para el desarrollo de
nodos de 7nm en adelante se ha trazado, y superar los problemas de potencia y
disipación de energía se ha convertido una parte fundamental para el diseño de chips..
Exploring Spin-transfer-torque devices and memristors for logic and memory applications
As scaling CMOS devices is approaching its physical limits, researchers have begun exploring newer devices and architectures to replace CMOS.
Due to their non-volatility and high density, Spin Transfer Torque (STT) devices are among the most prominent candidates for logic and memory applications. In this research, we first considered a new logic style called All Spin Logic (ASL). Despite its advantages, ASL consumes a large amount of static power; thus, several optimizations can be performed to address this issue. We developed a systematic methodology to perform the optimizations to ensure stable operation of ASL.
Second, we investigated reliable design of STT-MRAM bit-cells and addressed the conflicting read and write requirements, which results in overdesign of the bit-cells. Further, a Device/Circuit/Architecture co-design framework was developed to optimize the STT-MRAM devices by exploring the design space through jointly considering yield enhancement techniques at different levels of abstraction.
Recent advancements in the development of memristive devices have opened new opportunities for hardware implementation of non-Boolean computing. To this end, the suitability of memristive devices for swarm intelligence algorithms has enabled researchers to solve a maze in hardware. In this research, we utilized swarm intelligence of memristive networks to perform image edge detection. First, we proposed a hardware-friendly algorithm for image edge detection based on ant colony. Next, we designed the image edge detection algorithm using memristive networks
STT-MRAM characterization and its test implications
Spin torque transfer (STT)-magnetoresistive random-access memory (MRAM) has come
a long way in research to meet the speed and power consumption requirements for future
memory applications. The state-of-the-art STT-MRAM bit-cells employ magnetic tunnel
junction (MTJ) with perpendicular magnetic anisotropy (PMA). The process repeatabil-
ity and yield stability for wafer fabrication are some of the critical issues encountered in
STT-MRAM mass production. Some of the yield improvement techniques to combat the
e ect of process variations have been previously explored. However, little research has been
done on defect oriented testing of STT-MRAM arrays. In this thesis, the author investi-
gates the parameter deviation and non-idealities encountered during the development of
a novel MTJ stack con guration. The characterization result provides motivation for the
development of the design for testability (DFT) scheme that can help test and characterize
STT-MRAM bit-cells and the CMOS peripheral circuitry e ciently.
The primary factors for wafer yield degradation are the device parameter variation and
its non-uniformity across the wafer due to the fabrication process non-idealities. There-
fore, e ective in-process testing strategies for exploring and verifying the impact of the
parameter variation on the wafer yield will be needed to achieve fabrication process opti-
mization. While yield depends on the CMOS process variability, quality of the deposited
MTJ lm, and other process non-idealities, test platform can enable parametric optimiza-
tion and veri cation using the CMOS-based DFT circuits. In this work, we develop a DFT
algorithm and implement a DFT circuit for parametric testing and prequali cation of the
critical circuits in the CMOS wafer. The DFT circuit successfully replicates the electrical
characteristics of MTJ devices and captures their spatial variation across the wafer with
an error of less than 4%. We estimate the yield of the read sensing path by implement-
ing the DFT circuit, which can replicate the resistance-area product variation up to 50%
from its nominal value. The yield data from the read sensing path at di erent wafer loca-
tions are analyzed, and a usable wafer radius has been estimated. Our DFT scheme can
provide quantitative feedback based on in-die measurement, enabling fabrication process
optimization through iterative estimation and veri cation of the calibrated parameters.
Another concern that prevents mass production of STT-MRAM arrays is the defect
formation in MTJ devices due to aging. Identifying manufacturing defects in the magnetic
tunnel junction (MTJ) device is crucial for the yield and reliability of spin-torque-transfer
(STT) magnetic random-access memory (MRAM) arrays. Several of the MTJ defects result
in parametric deviations of the device that deteriorate over time. We extend our work on
the DFT scheme by monitoring the electrical parameter deviations occurring due to the
defect formation over time. A programmable DFT scheme was implemented for a sub-arrayin 65 nm CMOS technology to evaluate the feasibility of the test scheme. The scheme utilizes the read sense path to compare the bit-cell electrical parameters against known
DFT cells characteristics. Built-in-self-test (BIST) methodology is utilized to trigger the
onset of the fault once the device parameter crosses a threshold value. We demonstrate
the operation and evaluate the accuracy of detection with the proposed scheme. The
DFT scheme can be exploited for monitoring aging defects, modeling their behavior and
optimization of the fabrication process.
DFT scheme could potentially nd numerous applications for parametric characteriza-
tion and fault monitoring of STT-MRAM bit-cell arrays during mass production. Some of
the applications include a) Fabrication process feedback to improve wafer turnaround time,
b) STT-MRAM bit-cell health monitoring, c) Decoupled characterization of the CMOS pe-
ripheral circuitry such as read-sensing path and sense ampli er characterization within the
STT-MRAM array. Additionally, the DFT scheme has potential applications for detec-
tion of fault formation that could be utilized for deploying redundancy schemes, providing
a graceful degradation in MTJ-based bit-cell array due to aging of the device, and also
providing feedback to improve the fabrication process and yield learning
- …