A Comprehensive Review on Planar Magnetics and the Structures to Reduce the Parasitic Elements and Improve Efficiency

Due to the need for highly efficient and compact power electronic converters to operate at higher frequencies, traditional wire-wound magnetics are not suitable. This paper provides a comprehensive review of planar magnetic technologies, discussing their advantages as well as associated disadvantages. An extensive review of the research literature is presented with the aim of suggesting models for planar magnetics. Several strategies are proposed to overcome the limitations of planar magnetics, including winding conduction loss, leakage inductance, and winding capacitance. The goal of this study is to provide engineers and researchers with a clear roadmap for designing planar magnetic devices

Micro-Fabrication of Planar Inductors for High Frequency DC-DC Power Converters

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Characterization of a planar microcoil for implantable microsystems

This paper discusses the modelling, design and characterization of planar microcoils to be used in telemetry systems that supply energy to miniaturized implants. Parasitic electrical effects that may become important at a.c. frequencies of several megahertz are evaluated. The fabrication process and electrical characterization of planar receiver microcoils will be described, and it will be shown that a power of a few milliwatts is feasible.\u

The manufacture and characterisation of microscale magnetic components.

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Analysis and modeling of monolithic on-chip transformers on silicon substrates

Passive components, including spiral inductors and transformers, fabricated on silicon-based substrates are placing an increasing demand on radio-frequency integrated circuit (RFIC) design. Performance of the RFIC suffers from several non-ideal effects that must be taken into account in order to create a successful design. In particular, monolithic transformers can be a major obstacle for Low-Noise Amplifiers (LNAs), mixers, Voltage Controlled Oscillators (VCOs), and other RFIC circuits. For designers to correctly analyze their designs that include monolithic transformers, lumped-element models suitable for circuit simulation and design optimization are required. This thesis work is mainly concerned with the analysis and the methodology of developing a wide-band compact equivalent circuit model for monolithic transformers fabricated on silicon substrates. A new wide-band compact equivalent circuit model for monolithic transformers fabricated on silicon substrates is presented. The model achieves high wide-band accuracy through the use of the newly developed "Frequency-Dependent Transformer" (FDT) cell, which effectively takes into account the frequency-dependent conductor losses associated with the transformer's windings. A fast extraction technique that allows extraction of the circuit parameters from simulated or measured data is also described. Results are presented for various RFIC transformer configurations including stacked and interleaved topologies. This research provides a complete measurement or simulation-based modeling methodology for four-port transformers on lossy silicon substrates

Analysis and Application of Transmission Line Conductors

Skin effect is usually a concern reserved for radio frequency design and for high current conductors used in utility power distribution. Proximity effect between adjacent conductors has traditionally been a concern for the design of magnetic windings and other applications involving wire bundles. The rise in the ubiquity of high speed bit streams and other signals of very wide bandwidth has broadened the range of applicable contexts and increased the need to account for such effects. This is especially true for transmission lines used to interconnect critical signal paths in applications ranging from microelectronic devices to the signal integrity of printed circuit traces and implementation of system cabling. Optimal conductor design is obviously fundamental to transmission line performance. Researchers have paid considerable attention to the topic but the results are scattered throughout the literature. This thesis collected information on extant conductor designs, and the theoretical considerations behind each solution. A detailed analysis of current fl‡ow in a conducting half-space was included as a foundation. The conductor types discussed were solid cylindrical, rectangular, ribbonoid, bimetallic, tubular, laminated, litz, and stranded constructions. Discussions of the performance of stranded shields and conductor roughness e¤ects were included for completeness of understanding

Sviluppi del trasferimento di energia elettrica mediante risonatori piani a spirale

The aim of this thesis is to develop a depth analysis of the inductive power transfer (or wireless power transfer, WPT) along a metamaterial composed of cells arranged in a planar configuration, in order to deliver power to a receiver sliding on them. In this way, the problem of the efficiency strongly affected by the weak coupling between emitter and receiver can be obviated, and the distance of transmission can significantly be increased. This study is made using a circuital approach and the magnetoinductive wave (MIW) theory, in order to simply explain the behavior of the transmission coefficient and efficiency from the circuital and experimental point of view. Moreover, flat spiral resonators are used as metamaterial cells, particularly indicated in literature for WPT metamaterials operating at MHz frequencies (5-30 MHz). Finally, this thesis presents a complete electrical characterization of multilayer and multiturn flat spiral resonators and, in particular, it proposes a new approach for the resistance calculation through finite element simulations, in order to consider all the high frequency parasitic effects. Multilayer and multiturn flat spiral resonators are studied in order to decrease the operating frequency down to kHz, maintaining small external dimensions and allowing the metamaterials to be supplied by electronic power converters (resonant inverters)

Ferrite-based micro-inductors for power systems on chip : from material elaboration to inductor optimisation

Les composants passifs intégrés sont des éléments clés pour les futures alimentations sur puce, compactes et présentant des performances améliorées: haut rendement et forte densité de puissance. L'objectif de ce travail de thèse est d'étudier les matériaux et la technologie pour réaliser de bobines à base de ferrite, intégrées sur silicium, avec des faibles empreintes (<4 mm ²) et de faible épaisseur (<250 µm). Ces bobines, dédiées à la conversion de puissance (˜ 1 W) doivent présenter une forte inductance spécifique et un facteur de qualité élevé dans la gamme de fréquence visée (5-10 MHz). Des ferrites de NiZn ont été sélectionnées comme matériaux magnétiques pour le noyau des bobines en raison de leur forte résistivité et de leur perméabilité stable dans la gamme de fréquence visée. Deux techniques sont développées pour les noyaux de ferrite: la sérigraphie d'une poudre synthétisée au laboratoire et la découpe automatique de films de ferrite commerciaux, suivi dans chaque cas du frittage et le placement sur les conducteurs pour former une bobine rectangulaire. Des bobines tests ont été réalisées dans un premier temps afin que la caractérisation puisse être effectuée : les propriétés magnétiques du noyau de ferrite notamment les pertes volumiques dans le noyau sont ainsi extraites. L'équation de Steinmetz a permis de corréler les courbes de pertes mesurées avec des expressions analytiques en fonction de la fréquence et de l'induction. La deuxième phase de la thèse est l'optimisation de la conception de la micro-bobine à base de ferrite, en tenant compte des pertes attendues. L'algorithme générique est utilisé pour optimiser les dimensions de la bobine avec pour objectif ; la minimisation des pertes et l'obtention de la valeur d'inductance spécifique souhaitée, sous faible polarisation en courant. La méthode des éléments finis pour le magnétisme FEMM est utilisée pour modéliser le comportement électromagnétique du composant. La deuxième série de prototypes a été réalisée afin de valider la méthode d'optimisation. En perspective, les procédés de photolithographie de résine épaisse et le dépôt électrolytique sont en cours de développement pour réaliser les enroulements de cuivre épais autour des noyaux de ferrite optimisés et ainsi former le composant complet.On-chip inductors are key passive elements for future power supplies on chip (PwrSoC), which are expected to be compact and show enhanced performance: high efficiency and high power density. The objective of this thesis work is to study the material and technology to realize small size (<4 mm²) and low profile (< 250 µm) ferrite-based on-chip inductor. This component is dedicated to low power conversion (˜ 1 W) and should provide high inductance density and high quality factor at medium frequency range (5-10 MHz). Fully sintered NiZn ferrites are selected as soft magnetic materials for the inductor core because of their high resistivity and moderate permeability stable in the frequencies range of interest. Two techniques are developed for the ferrite cores: screen printing of in-house made ferrite powder and cutting of commercial ferrite films, followed in each case by sintering and pick-and place assembling to form the rectangular toroid inductor. Test inductors were realized first so that the characterization could be carried out to study the magnetic properties of the ferrite core and the volumetric core losses. The core losses were fit from the measured curve with Steinmetz equation to obtain analytical expressions of losses versus frequency and induction. The second phase of the thesis is the design optimization for the on-chip ferrite based inductor, taking into account the expected losses. Genetic algorithm is employed to optimize the inductor design with the objective function as minimum losses and satisfying the specification on the inductance values under weak current-bias condition. Finite element method for magnetics FEMM is used as a tool to calculate inductance and losses. The second run of prototypes was done to validate the optimization method. In perspective, processes of thick-photoresist photolithography and electroplating are being developed to realize the completed thick copper windings surrounding ferrite cores