Testability considerations for implementing an embedded memory subsystem

textThere are a number of testability considerations for VLSI design, but test coverage, test time, accuracy of test patterns and correctness of design information for DFD (Design for debug) are the most important ones in design with embedded memories. The goal of DFT (Design-for-Test) is to achieve zero defects. When it comes to the memory subsystem in SOCs (system on chips), many flavors of memory BIST (built-in self test) are able to get high test coverage in a memory, but often, no proper attention is given to the memory interface logic (shadow logic). Functional testing and BIST are the most prevalent tests for this logic, but functional testing is impractical for complicated SOC designs. As a result, industry has widely used at-speed scan testing to detect delay induced defects. Compared with functional testing, scan-based testing for delay faults reduces overall pattern generation complexity and cost by enhancing both controllability and observability of flip-flops. However, without proper modeling of memory, Xs are generated from memories. Also, when the design has chip compression logic, the number of ATPG patterns is increased significantly due to Xs from memories. In this dissertation, a register based testing method and X prevention logic are presented to tackle these problems. An important design stage for scan based testing with memory subsystems is the step to create a gate level model and verify with this model. The flow needs to provide a robust ATPG netlist model. Most industry standard CAD tools used to analyze fault coverage and generate test vectors require gate level models. However, custom embedded memories are typically designed using a transistor-level flow, there is a need for an abstraction step to generate the gate models, which must be equivalent to the actual design (transistor level). The contribution of the research is a framework to verify that the gate level representation of custom designs is equivalent to the transistor-level design. Compared to basic stuck-at fault testing, the number of patterns for at-speed testing is much larger than for basic stuck-at fault testing. So reducing test and data volume are important. In this desertion, a new scan reordering method is introduced to reduce test data with an optimal routing solution. With in depth understanding of embedded memories and flows developed during the study of custom memory DFT, a custom embedded memory Bit Mapping method using a symbolic simulator is presented in the last chapter to achieve high yield for memories.Electrical and Computer Engineerin

Synthesis for circuit reliability

textElectrical and Computer Engineerin

Improving timing verification and delay testing methodologies for IC designs

textThe task of ensuring the correct temporal behavior of IC designs, both before and after fabrication, is extremely important. It is becoming even more imperative as the demand for performance increases and process technology advances into the deep sub-micron region. This dissertation tackles the key issues in the timing verification and delay testing methodologies. An efficient methodology is presented to identify false timing paths in the timing verification methodology which utilizes ATPG technique and timing information from an ordered list of timing paths according to the delay information. This dissertation also presents a speed binning methodology which utilizes structural delay tests successfully instead of functional tests. In addition, it establishes a methodology which quantifies the correlation between the timing verification prediction and actual silicon measurement of timing paths. This quantification methodology lays the foundation for further research to study the impact of deep submicron effects on design performanceElectrical and Computer Engineerin

Cost modelling and concurrent engineering for testable design

This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.As integrated circuits and printed circuit boards increase in complexity, testing becomes a major cost factor of the design and production of the complex devices. Testability has to be considered during the design of complex electronic systems, and automatic test systems have to be used in order to facilitate the test. This fact is now widely accepted in industry. Both design for testability and the usage of automatic test systems aim at reducing the cost of production testing or, sometimes, making it possible at all. Many design for testability methods and test systems are available which can be configured into a production test strategy, in order to achieve high quality of the final product. The designer has to select from the various options for creating a test strategy, by maximising the quality and minimising the total cost for the electronic system. This thesis presents a methodology for test strategy generation which is based on consideration of the economics during the life cycle of the electronic system. This methodology is a concurrent engineering approach which takes into account all effects of a test strategy on the electronic system during its life cycle by evaluating its related cost. This objective methodology is used in an original test strategy planning advisory system, which allows for test strategy planning for VLSI circuits as well as for digital electronic systems. The cost models which are used for evaluating the economics of test strategies are described in detail and the test strategy planning system is presented. A methodology for making decisions which are based on estimated costing data is presented. Results of using the cost models and the test strategy planning system for evaluating the economics of test strategies for selected industrial designs are presented

A comprehensive comparison between design for testability techniques for total dose testing of flash-based FPGAs

Radiation sources exist in different kinds of environments where electronic devices often operate. Correct device operation is usually affected negatively by radiation. The radiation resultant effect manifests in several forms depending on the operating environment of the device like total ionizing dose effect (TID), or single event effects (SEEs) such as single event upset (SEU), single event gate rupture (SEGR), and single event latch up (SEL). CMOS circuits and Floating gate MOS circuits suffer from an increase in the delay and the leakage current due to TID effect. This may damage the proper operation of the integrated circuit. Exhaustive testing is needed for devices operating in harsh conditions like space and military applications to ensure correct operations in the worst circumstances. The use of worst case test vectors (WCTVs) for testing is strongly recommended by MIL-STD-883, method 1019, which is the standard describing the procedure for testing electronic devices under radiation. However, the difficulty of generating these test vectors hinders their use in radiation testing. Testing digital circuits in the industry is usually done nowadays using design for testability (DFT) techniques as they are very mature and can be relied on. DFT techniques include, but not limited to, ad-hoc technique, built-in self test (BIST), muxed D scan, clocked scan and enhanced scan. DFT is usually used with automatic test patterns generation (ATPG) software to generate test vectors to test application specific integrated circuits (ASICs), especially with sequential circuits, against faults like stuck at faults and path delay faults. Despite all these recommendations for DFT, radiation testing has not benefited from this reliable technology yet. Also, with the big variation in the DFT techniques, choosing the right technique is the bottleneck to achieve the best results for TID testing. In this thesis, a comprehensive comparison between different DFT techniques for TID testing of flash-based FPGAs is made to help designers choose the best suitable DFT technique depending on their application. The comparison includes muxed D scan technique, clocked scan technique and enhanced scan technique. The comparison is done using ISCAS-89 benchmarks circuits. Points of comparisons include FPGA resources utilization, difficulty of designs bring-up, added delay by DFT logic and robust testable paths in each technique

Identifying worst case test vectors for FPGA exposed to total ionization dose using design for testability techniques

Electronic devices often operate in harsh environments which contain a variation of radiation sources. Radiation may cause different kinds of damage to proper operation of the devices. Their sources can be found in terrestrial environments, or in extra-terrestrial environments like in space, or in man-made radiation sources like nuclear reactors, biomedical devices and high energy particles physics experiments equipment. Depending on the operation environment of the device, the radiation resultant effect manifests in several forms like total ionizing dose effect (TID), or single event effects (SEEs) such as single event upset (SEU), single event gate rupture (SEGR), and single event latch up (SEL). TID effect causes an increase in the delay and the leakage current of CMOS circuits which may damage the proper operation of the integrated circuit. To ensure proper operation of these devices under radiation, thorough testing must be made especially in critical applications like space and military applications. Although the standard which describes the procedure for testing electronic devices under radiation emphasizes the use of worst case test vectors (WCTVs), they are never used in radiation testing due to the difficulty of generating these vectors for circuits under test. For decades, design for testability (DFT) has been the best choice for test engineers to test digital circuits in industry. It has become a very mature technology that can be relied on. DFT is usually used with automatic test patterns generation (ATPG) software to generate test vectors to test application specific integrated circuits (ASICs), especially with sequential circuits, against faults like stuck at faults and path delay faults. Surprisingly, however, radiation testing has not yet made use of this reliable technology. In this thesis, a novel methodology is proposed to extend the usage of DFT to generate WCTVs for delay failure in Flash based field programmable gate arrays (FPGAs) exposed to total ionizing dose (TID). The methodology is validated using MicroSemi ProASIC3 FPGA and cobalt 60 facility

Optimization of Pseudo Functional Path Delay Test Through Embedded Memories

Traditional automatic test pattern generation achieves high coverage of logic faults in integrated circuits. Automatic test of embedded memory arrays uses built-in self-test. Testing the memories and logic separately does not fully test the critical timing paths that go into or out of memories. Prior research has developed algorithms and software to test the longest paths into and out of embedded memories. However, in this prior work, the test generation time increased superlinearly with memory size. This is contrary to the intuition that the time should rise approximately linearly with memory size. This behavior limits the algorithm to circuits with relatively small memories. The focus of this research is to analyze the time complexity of the algorithm and propose changes to reduce the time required to test circuits with large memories. We use our prior work on pseudo functional K longest path per gate test generation, and the benchmark circuits with embedded memories developed in the prior work. Since the cells within a memory array are not scan cells, a value that is captured in a memory cell must be moved to a scan cell using low-speed coda cycles. This approach will also support the test of any non-scan flip-flop or latch, in addition to embedded memory arrays. In addition to testing the critical timing paths, testing through memories eliminates the logic “shadows” around the memory where faults cannot be tested. In this research our complexity analysis has identified the reason for the superlinear increase in test generation time with larger memories and verified this analysis with experimental results. We have also developed and implemented several heuristics to increase performance, with experimental results. This research also identifies the major algorithm changes required to further increase performance

Design of On-Chip Self-Testing Signature Register

Over the last few years, scan test has turn out to be too expensive to implement for industry standard designs due to increasing test data volume and test time. The test cost of a chip is mainly governed by the resource utilization of Automatic Test Equipment (ATE). Also, it directly depends upon test time that includes time required to load test program, to apply test vectors and to analyze generated test response of the chip. An issue of test time and data volume is increasingly appealing designers to use on-chip test data compactors, either on input side or output side or both. Such techniques significantly address the former issues but have little hold over increasing number of input-outputs under test mode. Further, test pins on DUT are increasing over the generations. Thus, scan channels on test floor are falling short in number for placement of such ICs. To address issues discussed above, we introduce an on-chip self-testing signature register. It comprises a response compactor and a comparator. The compactor compacts large chunk of response data to a small test signature whereas the comparator compares this test signature with desired one. The overall test result for the design is generated on single output pin. Being no storage of test response is demanded, the considerable reduction in ATE memory can be observed. Also, with only single pin to be monitored for test result, the number of tester channels and compare edges on ATE side significantly reduce at the end of the test. This cuts down maintenance and usage cost of test floor and increases its life time. Furthermore reduction in test pins gives scope for DFT engineers to increase number of scan chains so as to further reduce test time

Fault simulation and test generation for small delay faults

Delay faults are an increasingly important test challenge. Traditional delay fault models are incomplete in that they model only a subset of delay defect behaviors. To solve this problem, a more realistic delay fault model has been developed which models delay faults caused by the combination of spot defects and parametric process variation. According to the new model, a realistic delay fault coverage metric has been developed. Traditional path delay fault coverage metrics result in unrealistically low fault coverage, and the real test quality is not reflected. The new metric uses a statistical approach and the simulation based fault coverage is consistent with silicon data. Fast simulation algorithms are also included in this dissertation. The new metric suggests that testing the K longest paths per gate (KLPG) has high detection probability for small delay faults under process variation. In this dissertation, a novel automatic test pattern generation (ATPG) methodology to find the K longest testable paths through each gate for both combinational and sequential circuits is presented. Many techniques are used to reduce search space and CPU time significantly. Experimental results show that this methodology is efficient and able to handle circuits with an exponential number of paths, such as ISCAS85 benchmark circuit c6288. The ATPG methodology has been implemented on industrial designs. Speed binning has been done on many devices and silicon data has shown significant benefit of the KLPG test, compared to several traditional delay test approaches

Efficient verification/testing of system-on-chip through fault grading and analog behavioral modeling

textThis dissertation presents several cost-effective production test solutions using fault grading and mixed-signal design verification cases enabled by analog behavioral modeling. Although the latest System-on-Chip (SOC) is getting denser, faster, and more complex, the manufacturing technology is dominated by subtle defects that are introduced by small-scale technology. Thus, SOC requires more mature testing strategies. By performing various types of testing, better quality SoC can be manufactured, but test resources are too limited to accommodate all those tests. To create the most efficient production test flow, any redundant or ineffective tests need to be removed or minimized. Chapter 3 proposes new method of test data volume reduction by combining the nonlinear property of feedback shift register (FSR) and dictionary coding. Instead of using the nonlinear FSR for actual hardware implementation, the expanded test set by nonlinear expansion is used as the one-column test sets and provides big reduction ratio for the test data volume. The experimental results show the combined method reduced the total test data volume and increased the fault coverage. Due to the increased number of test patterns, total test time is increased. Chapter 4 addresses a whole process of functional fault grading. Fault grading has always been a ”desire-to-have” flow because it can bring up significant value for cost saving and yield analysis. However, it is very hard to perform the fault grading on the complex large scale SOC. A commercial tool called Z01X is used as a fault grading platform, and whole fault grading process is coordinated and each detailed execution is performed. Simulation- based functional fault grading identifies the quality of the given functional tests against the static faults and transition delay faults. With the structural tests and functional tests, functional fault grading can indicate the way to achieve the same test coverage by spending minimal test time. Compared to the consumed time and resource for fault grading, the contribution to the test time saving might not be acceptable as very promising, but the fault grading data can be reused for yield analysis and test flow optimization. For the final production testing, confident decisions on the functional test selection can be made based on the fault grading results. Chapter 5 addresses the challenges of Package-on-Package (POP) testing. Because POP devices have pins on both the top and the bottom of the package, the increased test pins require more test channels to detect packaging defects. Boundary scan chain testing is used to detect those continuity defects by relying on leakage current from the power supply. This proposed test scheme does not require direct test channels on the top pins. Based on the counting algorithm, minimal numbers of test cycles are generated, and the test achieved full test coverage for any combinations of pin-to-pin shortage defects on the top pins of the POP package. The experimental results show about 10 times increased leakage current from the shorted defect. Also, it can be expanded to multi-site testing with less test channels for high-volume production. Fault grading is applied within different structural test categories in Chapter 6. Stuck-at faults can be considered as TDFs having infinite delay. Hence, the TDF Automatic Test Pattern Generation (ATPG) tests can detect both TDFs and stuck-at faults. By removing the stuck-at faults being detected by the given TDF ATPG tests, the tests that target stuck-at faults can be reduced, and the reduced stuck-at fault set results in fewer stuck-at ATPG patterns. The structural test time is reduced while keeping the same test coverage. This TDF grading is performed with the same ATPG tool used to generate the stuck-at and TDF ATPG tests. To expedite the mixed-signal design verification of complex SoC, analog behavioral modeling methods and strategies are addressed in Chapter 7 and case studies for detailed verification with actual mixed-signal design are ad- dressed in Chapter 8. Analog modeling effort can enhance verification quality for a mixed-signal design with less turnaround time, and it enables compatible integration of the mixed-signal design cores into the SoC. The modeling process may reveal any potential design errors or incorrect testbench setup, and it results in minimizing unnecessary debugging time for quality devices. Two mixed-signal design cases were verified by me using the analog models. A fully hierarchical digital-to-analog converter (DAC) model is implemented and silicon mismatches caused by process variation are modeled and inserted into the DAC model, and the calibration algorithm for the DAC is successfully verified by model-based simulation at the full DAC-level. When the mismatch amount is increased and exceeded the calibration capability of the DAC, the simulation results show the increased calibration error with some outliers. This verification method can identify the saturation range of the DAC and predict the yield of the devices from process variation. A phase-locked loop (PLL) design cases were also verified by me using the analog model. Both open-loop PLL model and closed-loop PLL model cases are presented. Quick bring-up of open-loop PLL model provides low simulation overhead for widely-used PLLs in the SOC and enables early starting of design verification for the upper-level design using the PLL generated clocks. Accurate closed-loop PLL model is implemented for DCO-based PLL design, and the mixed-simulation with analog models and schematic designs enables flexible analog verification. Only focused analog design block is set to the schematic design and the rest of the analog design is replaced by the analog model. Then, this scaled-down SPICE simulation is performed about 10 times to 100 times faster than full-scale SPICE simulation. The analog model of the focused block is compared with the scaled-down SPICE simulation result and the quality of the model is iteratively enhanced. Hence, the analog model enables both compatible integration and flexible analog design verification. This dissertation contributes to reduce test time and to enhance test quality, and helps to set up efficient production testing flows. Depending on the size and performance of CUT, proper testing schemes can maximize the efficiency of production testing. The topics covered in this dissertation can be used in optimizing the test flow and selecting the final production tests to achieve maximum test capability. In addition, the strategies and benefits of analog behavioral modeling techniques that I implemented are presented, and actual verification cases shows the effectiveness of analog modeling for better quality SoC products.Electrical and Computer Engineerin