Hybrid Microassembly in Environmental Scanning Electron Microscope Using Robotic Manipulator and Adhesives

Peer reviewe

Hybrid Microassembly with Surface Tension Driven Self-alignment: Handling Strategies and Micro-fabricated Patterns

Hybrid microassembly combines self-assembly technology with traditional robotic pick-and-place technology or other robotic feeding mechanics to construct microsystems. In a typical hybrid microassembly process, a micro part is brought adjacent to the assembly site by a robot handling tool at a high speed but with a relatively low precision, and liquid droplets dispensed by a dispenser at the assembly site align the part at a higher precision. By combing both the robotic pick-and-place technique and self-assembly technique, hybrid microassembly technique can achieve high speed and high precision simultaneously. This thesis explores the adaptability of hybrid microassembly technique by investigating different hybrid microassembly methods and different types of the patterns. Three hybrid microassembly approaches have been investigated: 1) droplet assisted hybrid microassembly, 2) water mist induced hybrid microassembly and 3) hybrid microassembly with forced wetting. The droplet assisted hybrid microassembly has been studied using patterns with segments and patterns with jagged edges. Parallel microassembly of microchips with water mist induced hybrid microassembly has also been explored. Hybrid microassembly on hydrophobic receptor site with super-hydrophobic substrate has been experimentally investigated with two forced wetting techniques. Four different types of patterns have been investigated for hybrid microassembly technique: (a) oleophilic/phobic patterns, (2) hydrophobic/super-hydrophobic patterns, (3) segmented patterns and (4) patterns with jagged edges. Hybrid microassembly has been studied on a new patterned oleophilic/oleophobic surface using adhesive droplet in ambient air environment. A patterned hydrophobic/super-hydrophobic surface has also been investigated and hybrid microassembly has been demonstrated with both water and adhesive. Application relevant patterns such as segmented patterns and patterns with jagged edges have been investigated. In summary, this thesis shows that hybrid microassembly can adapt to large varieties of patterns. Several new hybrid microassembly methods are developed and demonstrated. Such a wide adaptability and a variety of the processes indicate that hybrid microassembly can be a very promising approach for many potential applications, such as integration of surface emitting lasers, integration of small dies and 3D integration of chips with high density pin counts

Workshop on "Robotic assembly of 3D MEMS".

Proceedings of a workshop proposed in IEEE IROS'2007.The increase of MEMS' functionalities often requires the integration of various technologies used for mechanical, optical and electronic subsystems in order to achieve a unique system. These different technologies have usually process incompatibilities and the whole microsystem can not be obtained monolithically and then requires microassembly steps. Microassembly of MEMS based on micrometric components is one of the most promising approaches to achieve high-performance MEMS. Moreover, microassembly also permits to develop suitable MEMS packaging as well as 3D components although microfabrication technologies are usually able to create 2D and "2.5D" components. The study of microassembly methods is consequently a high stake for MEMS technologies growth. Two approaches are currently developped for microassembly: self-assembly and robotic microassembly. In the first one, the assembly is highly parallel but the efficiency and the flexibility still stay low. The robotic approach has the potential to reach precise and reliable assembly with high flexibility. The proposed workshop focuses on this second approach and will take a bearing of the corresponding microrobotic issues. Beyond the microfabrication technologies, performing MEMS microassembly requires, micromanipulation strategies, microworld dynamics and attachment technologies. The design and the fabrication of the microrobot end-effectors as well as the assembled micro-parts require the use of microfabrication technologies. Moreover new micromanipulation strategies are necessary to handle and position micro-parts with sufficiently high accuracy during assembly. The dynamic behaviour of micrometric objects has also to be studied and controlled. Finally, after positioning the micro-part, attachment technologies are necessary

Self-transport and self-alignment of microchips using microscopic rain

Alignment of microchips with receptors is an important process step in the construction of integrated micro- and nanosystems for emerging technologies, and facilitating alignment by spontaneous self-assembly processes is highly desired. Previously, capillary self-alignment of microchips driven by surface tension effects on patterned surfaces has been reported, where it was essential for microchips to have sufficient overlap with receptor sites. Here we demonstrate for the first time capillary self-transport and self-alignment of microchips, where microchips are initially placed outside the corresponding receptor sites and can be self-transported by capillary force to the receptor sites followed by self-alignment. The surface consists of hydrophilic silicon receptor sites surrounded by superhydrophobic black silicon. Rain-induced microscopic droplets are used to form the meniscus for the self-transport and self-alignment. The boundary conditions for the self-transport have been explored by modeling and confirmed experimentally. The maximum permitted gap between a microchip and a receptor site is determined by the volume of the liquid and by the wetting contrast between receptor site and substrate. Microscopic rain applied on hydrophilic-superhydrophobic patterned surfaces greatly improves the capability, reliability and error-tolerance of the process, avoiding the need for accurate initial placement of microchips, and thereby greatly simplifying the alignment process.Peer reviewe

Laser induced die transferring and patterning

The benefits of the use of lasers in the field of assembly of heterogeneous microsystems is demonstrated, by two applications. First, a laser induced pyrolitic process successfully transfers an chip (semiconductior die) from its carrier onto a receiving substrate. Secondly, a laser induced photolitic processes creates a hyhdrophobic/phillic pattern required for fluidic self-alignment of micro-fabricated component

Experimental study on droplet self-alignment assisted robotic microhandling

Tämän diplomityön päätavoite on tutkia kokeellisesti eri prosessiparametrien vaikutusta Teknillisessä korkeakoulussa kehitetyn hybridimenetelmän tuloksiin mikrokokoonpanossa. Menetelmässä yhdistetään robottimikrotarttujan käyttö ja mikrokappaleiden pisara-avusteinen itseorganisoituminen kapillaarivoimien avulla. Työn selvitysosuudessa on kaksi osiota. Ensimmäisessä osiossa tutustutaan mikrokokoluokan erityispiirteisiin ja mikrokokoonpanomenetelmiin sekä robottiavusteisten ja itseorganisoituvuutta käyttävien menetelmien kautta. Toisessa osiossa keskitytään kapillaarivoimaan ja sen sovelluksiin mikrokappaleiden käsittelyssä. Kokeellinen menetelmä ja koelaitteisto esitellään työn toisessa osuudessa. Myös parametrit, joita ovat vapautuspaikan ero lopulliseen paikkaan, nesteen määrä ja palan koko, esitellään tarkemmin. Testien kulun yksityskohdat käsitellään. Kokeellisessa osassa suoritettujen testien tulokset esitetään. Kokoonpanon onnistumistodennäköisyyttä tarkastellaan ja vertaillaan eri prosessiparametrien funktiona. Menetelmän tarkkuutta arvioidaan pyyhkäisyelektronimikroskooppikuvien avulla. Tulokset osoittavat, että tutkitulla robotiikaa ja pisaran itseasennoitumista hyödyntävällä menetelmällä voidaan luotettavasti kokoonpanna mikrokappaleita. Saavutettu tarkkuus (1-2 µm) on vertailukelpoinen itseorganisoitumista käyttävien menetelmien kanssa.The main objective of this thesis is to experimentally study the effect of different process parameters on the results of a hybrid micro assembly method previously developed at TKK. The hybrid method is a combination of robotic micro handling and droplet self-alignment. The survey part of the thesis has two sections. The first part gives an overview of the micro world and the state-of-the-art of micro assembly methods including both robotic and self-assembly methods. The second part concentrates on capillary force and its applications in micro handling. The experimental method, the test set-up and key test parameters are discussed in the second part of the thesis. The key parameters include biases (the initial error in the part location before self-alignment) in three axes, the amount of liquid for self-alignment and the size of the parts. Moreover, the test procedure is described in details. Several sets of tests were conducted and the results are analyzed carefully in the third, experimental part of the thesis. Especially the success rates and areas of success as a function of different parameters are studied and compared. The accuracy of the final assembly is analyzed by a scanning electron microscope. The results show that the hybrid micro assembly method is reliable for assembling micro parts. The study on the effects of the process parameters prove that accuracy requirements of the handling robot are very low while the accuracy obtained with the method is in the range of 1-2 µm, comparable with what has been achieved by self-assembly

Positioning accuracy characterization of assembled microscale components for micro-optical benches

International audienceThis paper deals with the measurement of microscale components' positioning accuracies used in the assembly of Micro-Optical Benches (MOB). The concept of MOB is presented to explain how to build optical MEMS based on out-of-plane micro-assembly of microcomponents. The micro-assembly platform is then presented and used to successfully assemble MOB. This micro-assembly platform includes a laser sensor that enables the measure of the microcomponent's position after its assembly. The measurement set-up and procedure is displayed and applied on several micro-assembly sets. The measurement system provides results with a maximum deviation less than +/- 0.005°. Based on this measurement system and micro-assembly procedure, the article shows that it is possible to obtain a positioning errors down to 0.009°. These results clearly state that micro-assembly is a possible way to manufacture complex, heterogeneous and 3D optical MEMS with very good optical performances

Microclamping principles from the perspective of micrometrology – A review

This paper gives an overview of the field of clamping and gripping principles from the viewpoint of sample fixturing for dimensional metrology for microobjects. The requirements for clamping microcomponents that allow dimensional measurements are therefore explained before principles and solutions of microclamps as found in literature are reviewed and evaluated on basis of these requirements. Results show that there is no single superior clamping principle or method of implementation but rather several effective solutions for specific applications. The core value of this paper is the link between requirements for sample fixturing in dimensional micrometrology and the many approaches already investigated in the field of microclamping. A radar chart and a decision tree summarize and visualize the major aspects of this review. Finally, directions of future key research areas are suggested

Design, characterisation and testing of SU8 polymer based electrothermal microgrippers

Microassembly systems are designed to combine micro-component parts with high accuracy. These micro-components are fabricated using different manufacturing processes in sizes of several micrometers. This technology is essential to produce miniaturised devices and equipment, especially those built from parts requiring different fabrication procedures. The most important task in microassembly systems is the manipulator, which should have the ability to handle and control micro-particles. Different techniques have been developed to carry out this task depending on the application, required accuracy, and cost. In this thesis, the most common methods are identified and briefly presented, and some advantages and disadvantages are outlined. A microgripper is the most important device utilized to handle micro-objects with high accuracy. However, it is a device that can be used only in sequential microassembly techniques. It has the potential to become the most important tool in the field of micro-robotics, research and development, and assembly of parts with custom requirements. Different actuation mechanisms are employed to design microgrippers such as electromagnetic force, electrostatic force, piezoelectric effect, and electrothermal expansions. Also, different materials are used to fabricate these microgrippers, for example metals, silicon, and polymers such as SU-8. To investigate the limitation and disadvantages of the conventional SU-8 electrothermal based microgrippers, different devices designed and fabricated at IMT, Romania, were studied. The results of these tests showed a small end-effector displacement and short cycling on/off (lifetime). In addition, the actuator part of these microgrippers was deformed after each operation, which results in reduced displacement and inconsistent openings at off state every time it was operated in a power ON/OFF cycle. One of these limitations was caused by the existence of conductors in arms of the end-effectors. These conductor designs have two disadvantages: firstly, it raises temperature in the arms and causing an expansion in the opposite direction of the desired displacement. Secondly, since the conductors pass through the hinges, they should be designed wide enough to reduce the conductor resistance as much as possible. Therefore, the wider the hinges are, the higher the in-plane stiffness and the less out of plane deflection. As a result, it increases the reaction force of the arm reducing the effect of deformation. Based on these limitations a new actuatorstructure of L-shape was proposed to reduce the effects of these drawbacks. This actuator has no conductor in the hinges or the arms of the end-effectors which reduce limitation on the hinge width. . In addition, a further development of this actuator was proposed to increase the stiffness of the actuator by doubling its thickness compared with the other parts of the griper. The results of this actuator proved the improvement in performance and reduction of the actuator deformation. This new actuator structure was used to design several different microgrippers with large displacement and suitable for a wide range of applications. Demonstrations of the capabilities of the microgrippers to be used in microassembly are presented. In addition, a novel tri-directional microactuator is proposed in this thesis. This actuator’s end-effector is capable of displacements in three different directions. This actuator was used with the other designs to develop a novel three-arm (three fingers) multidirectional microgripper. To study the microgripper displacement as a function to the heater temperature, the TCR of the conductor layer of each device was measured. Because different configurations of conductor layers were studied, a significant effect of the metal layer structure on TCR was discovered. The TCR value of gold film is reduced significantly by adding the chromium layers below and about it which were used to improve the adhesion between the gold film and the SU layers. In this thesis, a new method based on a robotic system was developed to characterise these microgrippers and to study the steady state, dynamic response, and reliability (lifetime cycling on/off). An electronic interface was developed and integrated to the robotic system to control and drive the microgrippers. This new system was necessary to carry out automated testing of the microgrippers with accurate and reliable results. Four different new groups of microgrippers were designed and studied. The first group was indirectly actuated using an L-Shaped actuator and two different actuator widths. The initial opening was 120 μm for both designs. The maximum displacement was about 140 μm for both designs. However, the actuator in the wider heater width showed more stable behavior during the cycling and the dynamic tests. The second group was based on direct actuation approach using the L-Shaped actuator. There were eight different designs based on this method with different heater conductor shape, actuator width, and arm thickness. The initial opening was 100 μm and there were different displacements for the eight designs. The study of these microgrippers proved that the actuator stiffness has a significant effect on the microgripper displacement. In addition, the shape of the heater conductor has less effect. The largest displacement achieved using this method of design was about 70 μm. The third group was designed for dual mode operation and has three different designs. The initial openings were 90 μm and 250 μm. The displacement was about 170 μm in both modes. The last microgripper design was a tri-arm design for multi-mode operation. The lifetime study of SU8 based microgrippers in this thesis was the first time such an investigation was carried out. The results of IMT designs showed that the larger is the displacement the less stable is the gripper design because of the high rection force acting on the actuators. The L-shape based microgrippers had better performance and they did not break after more than 400 cycles. In addition, the studies of static displacement and dynamic response of different designed microgripper proved that better performance of the proposed actuator can be obtained by using double thickness for the actuator as compared to the arm thickness