A study of phase noise and jitter in submicron CMOS phase-locked loop circuits

Phase-locked loops (PLLs) are widely used in communication systems. With the continuously expanding of market for high speed, portable communication devices, low noise CMOS submicron integrated circuit designs of PLL for different applications are in large demand. In this dissertation, phase noise and jitter properties of PLL and its building blocks are investigated both at the physical and system levels. At the physical level, hot carrier effect in submicron MOSFETs has been considered. As one of the most dominant noise sources of PLL, the voltage-controlled oscillator (VCO) is considered when investigating the noise degradation induced by the hot carrier effect. Experimental results of jitter degradation due to hot carrier effects are presented for different ring oscillator types VCOs designed in 0.5 micron n-well CMOS technology. An increase in RMS jitter by 25% and 10% decrease in oscillation frequency of VCO can be observed after 4 hours hot carrier stress. The hot carrier induced noise degradation on PLL is also presented based on the performance degradation in VCO. Simulation results show 40% decrease in VCO gain after 4 hours stress and a 23% decrease in damping factor and loop bandwidth. Moreover, degradation on PLL noise performance includes a left shift peak in phase noise and a 17% increase in RMS jitter. At the system level, noise sources in a PLL system are investigated including the input reference noise, VCO noise and the frequency divider noise. Phase noise prediction method for PLL is developed. Experimental phase noise measurement results on 0.5 micron CMOS PLL systems based on different types of VCOs are in close agreement with the predicted phase noise. Therefore, the phase noise prediction method is verified. On the other hand, a 3 GHz adaptive bandwidth PLL based on LC-VCO is designed in 0.25 micron n-well CMOS technology to investigate the phase noise and jitter performance by varying the loop parameters. By considering the noise simulation results based on the adaptive bandwidth feature and the quality factor of the on-chip inductor, PLL loop parameters can be carefully chosen at the design phase to achieve an optimal noise performance

Study Of Design For Reliability Of Rf And Analog Circuits

Due to continued device dimensions scaling, CMOS transistors in the nanometer regime have resulted in major reliability and variability challenges. Reliability issues such as channel hot electron injection, gate dielectric breakdown, and negative bias temperature instability (NBTI) need to be accounted for in the design of robust RF circuits. In addition, process variations in the nanoscale CMOS transistors are another major concern in today‟s circuits design. An adaptive gate-source biasing scheme to improve the RF circuit reliability is presented in this work. The adaptive method automatically adjusts the gate-source voltage to compensate the reduction in drain current subjected to various device reliability mechanisms. A class-AB RF power amplifier shows that the use of a source resistance makes the power-added efficiency robust against threshold voltage and mobility variations, while the use of a source inductance is more reliable for the input third-order intercept point. A RF power amplifier with adaptive gate biasing is proposed to improve the circuit device reliability degradation and process variation. The performances of the power amplifier with adaptive gate biasing are compared with those of the power amplifier without adaptive gate biasing technique. The adaptive gate biasing makes the power amplifier more resilient to process variations as well as the device aging such as mobility and threshold voltage degradation. Injection locked voltage-controlled oscillators (VCOs) have been examined. The VCOs are implemented using TSMC 0.18 µm mixed-signal CMOS technology. The injection locked oscillators have improved phase noise performance than free running oscillators. iv A differential Clapp-VCO has been designed and fabricated for the evaluation of hot electron reliability. The differential Clapp-VCO is formed using cross-coupled nMOS transistors, on-chip transformers/inductors, and voltage-controlled capacitors. The experimental data demonstrate that the hot carrier damage increases the oscillation frequency and degrades the phase noise of Clapp-VCO. A p-channel transistor only VCO has been designed for low phase noise. The simulation results show that the phase noise degrades after NBTI stress at elevated temperature. This is due to increased interface states after NBTI stress. The process variability has also been evaluated

A New Technique for the Design of Multi-Phase Voltage Controlled Oscillators

© 2017 World Scientific Publishing Company.In this work, a novel circuit structure for second-harmonic multi-phase voltage controlled oscillator (MVCO) is presented. The proposed MVCO is composed of (Formula presented.) ((Formula presented.) being an integer number and (Formula presented.)2) identical inductor–capacitor ((Formula presented.)) tank VCOs. In theory, this MVCO can provide 2(Formula presented.) different phase sinusoidal signals. A six-phase VCO based on the proposed structure is designed in a TSMC 0.18(Formula presented.)um CMOS process. Simulation results show that at the supply voltage of 0.8(Formula presented.)V, the total power consumption of the six-phase VCO circuit is about 1(Formula presented.)mW, the oscillation frequency is tunable from 2.3(Formula presented.)GHz to 2.5(Formula presented.)GHz when the control voltage varies from 0(Formula presented.)V to 0.8(Formula presented.)V, and the phase noise is lower than (Formula presented.)128(Formula presented.)dBc/Hz at 1(Formula presented.)MHz offset frequency. The proposed MVCO has lower phase noise, lower power consumption and more outputs than other related works in the literature.Peer reviewedFinal Accepted Versio

Reliability Prediction with MTOL

Here, we develop a comprehensive reliability prediction of FPGA devices solely from data motivated by physics of failure. The Multiple Temperature Operational Life (MTOL) testing method calculates the failure in time (FIT) of 3 different failure mechanisms on both 45nm and 28nm technologies. From a comparison of the two technologies, we found significant hot carrier injection (HCI) and Electromigration (EM) throughout the operating range in 45nm technology. However, it seems that 28nm exhibits no HCI or EM degradation even up to 1.6V on the core. As a result, we show that there is no effect of frequency on the reliability for that technology. This means that at 28nm, the devices can be de-rated or up-rated based only on the NBTI model and therefore reliability is dependent only on operating Voltage and Temperature with a single activation energy. Notably, the activation energies and voltage acceleration factors for both technologies are remarkably similar. This demonstration shows that, unlike other conventional qualification procedures, the MTOL testing procedure gives a broad description of the reliability in sub-zero and high temperatures. This procedure provides FIT prediction using reduced materials and test time, which can be applied to newer technologies, specifically 20nm and 16nm and beyond

Phase Noise in CMOS Phase-Locked Loop Circuits

Phase-locked loops (PLLs) have been widely used in mixed-signal integrated circuits. With the continuously increasing demand of market for high speed, low noise devices, PLLs are playing a more important role in communications. In this dissertation, phase noise and jitter performances are investigated in different types of PLL designs. Hot carrier and negative bias temperature instability effects are analyzed from simulations and experiments. Phase noise of a CMOS phase-locked loop as a frequency synthesizer circuit is modeled from the superposition of noises from its building blocks: voltage-controlled oscillator, frequency divider, phase-frequency detector, loop filter and auxiliary input reference clock. A linear time invariant model with additive noise sources in frequency domain is presented to analyze the phase noise. The modeled phase noise results are compared with the corresponding experimentally measured results on phase-locked loop chips fabricated in 0.5 m n-well CMOS process. With the scaling of CMOS technology and the increase of electrical field, MOS transistors have become very sensitive to hot carrier effect (HCE) and negative bias temperature instability (NBTI). These two reliability issues pose challenges to designers for designing of chips in deep submicron CMOS technologies. A new strategy of switchable CMOS phase-locked loop frequency synthesizer is proposed to increase its tuning range. The switchable PLL which integrates two phase-locked loops with different tuning frequencies are designed and fabricated in 0.5 µm CMOS process to analyze the effects under HCE and NBTI. A 3V 1.2 GHz programmable phase-locked loop frequency synthesizer is designed in 0.5 μm CMOS technology. The frequency synthesizer is implemented using LC voltage-controlled oscillator (VCO) and a low power dual-modulus prescaler. The LC VCO working range is from 900MHz to 1.4GHz. Current mode logic (CML) is used in designing high speed D flip-flop in the dual-modulus prescaler circuits for low power consumption. The power consumption of the PLL chip is under 30mW. Fully differential LC VCO is used to provide high oscillation frequency. A new design of LC VCO using carbon nanotube (CNT) wire inductor has been proposed. The PLL design using CNT-LC VCO shows significant improvement in phase noise due to high-Q LC circuit

Design of a tunable multi-band differential LC VCO using 0.35 mu m SiGe BiCMOS technology for multi-standard wireless communication systems

In this paper, an integrated 2.2-5.7GHz multi-band differential LC VCO for multi-standard wireless communication systems was designed utilizing 0.35 mu m SiGe BiCMOS technology. The topology, which combines the switching inductors and capacitors together in the same circuit, is a novel approach for wideband VCOs. Based on the post-layout simulation results, the VCO can be tuned using a DC voltage of 0 to 3.3 V for 5 different frequency bands (2.27-2.51 GHz, 2.48-2.78 GHz, 3.22-3.53 GHz, 3.48-3.91 GHz and 4.528-5.7 GHz) with a maximum bandwidth of 1.36 GHz and a minimum bandwidth of 300 MHz. The designed and simulated VCO can generate a differential output power between 0.992 and -6.087 dBm with an average power consumption of 44.21 mW including the buffers. The average second and third harmonics level were obtained as -37.21 and -47.6 dBm, respectively. The phase noise between -110.45 and -122.5 dBc/Hz, that was simulated at 1 MHz offset, can be obtained through the frequency of interest. Additionally, the figure of merit (FOM), that includes all important parameters such as the phase noise, the power consumption and the ratio of the operating frequency to the offset frequency, is between -176.48 and -181.16 and comparable or better than the ones with the other current VCOs. The main advantage of this study in comparison with the other VCOs, is covering 5 frequency bands starting from 2.27 up to 5.76 GHz without FOM and area abandonment. Output power of the fundamental frequency changes between -6.087 and 0.992 dBm, depending on the bias conditions (operating bands). Based on the post-layout simulation results, the core VCO circuit draws a current between 2.4-6.3 mA and between 11.4 and 15.3 mA with the buffer circuit from 3.3 V supply. The circuit occupies an area of 1.477 mm(2) on Si substrate, including DC, digital and RF pads

Characterization of self-heating effects and assessment of its impact on reliability in finfet technology

The systematically growing power (heat) dissipation in CMOS transistors with each successive technology node is reaching levels which could impact its reliable operation. The emergence of technologies such as bulk/SOI FinFETs has dramatically confined the heat in the device channel due to its vertical geometry and it is expected to further exacerbate with gate-all-around transistors. This work studies heat generation in the channel of semiconductor devices and measures its dissipation by means of wafer level characterization and predictive thermal simulation. The experimental work is based on several existing device thermometry techniques to which additional layout improvements are made in state of the art bulk FinFET and SOI FinFET 14nm technology nodes. The sensors produce excellent matching results which are confirmed through TCAD thermal simulation, differences between sensor types are quantified and error bars on measurements are established. The lateral heat transport measurements determine that heat from the source is mostly dissipated at a distance of 1µm and 1.5µm in bulk FinFET and SOI FinFET, respectively. Heat additivity is successfully confirmed to prove and highlight the fact that the whole system needs to be considered when performing thermal analysis. Furthermore, an investigation is devoted to study self-heating with different layout densities by varying the number of fins and fingers per active region (RX). Fin thermal resistance is measured at different ambient temperatures to show its variation of up to 70% between -40°C to 175°C. Therefore, the Si fin has a more dominant effect in heat transport and its varying thermal conductivity should be taken into account. The effect of ambient temperature on self-heating measurement is confirmed by supplying heat through thermal chuck and adjacent heater devices themselves. Motivation for this work is the continuous evolution of the transistor geometry and use of exotic materials, which in the recent technology nodes made heat removal more challenging. This poses reliability and performance concerns. Therefore, this work studies the impact of self-heating on reliability testing at DC conditions as well as realistic CMOS logic operating (AC) conditions. Front-end-of-line (FEOL) reliability mechanisms, such as hot carrier injection (HCI) and non-uniform time dependent dielectric breakdown (TDDB), are studied to show that self-heating effects can impact measurement results and recommendations are given on how to mitigate them. By performing an HCI stress at moderate bias conditions, this dissertation shows that the laborious techniques of heat subtraction are no longer necessary. Self-heating is also studied at more realistic device switching conditions by utilizing ring oscillators with several densities and stage counts to show that self-heating is considerably lower compared to constant voltage stress conditions and degradation is not distinguishable

Hysteresis-Free Nanosecond Pulsed Electrical Characterization of Top-Gated Graphene Transistors

We measure top-gated graphene field effect transistors (GFETs) with nanosecond-range pulsed gate and drain voltages. Due to high-k dielectric or graphene imperfections, the drain current decreases ~10% over time scales of ~10 us, consistent with charge trapping mechanisms. Pulsed operation leads to hysteresis-free I-V characteristics, which are studied with pulses as short as 75 ns and 150 ns at the drain and gate, respectively. The pulsed operation enables reliable extraction of GFET intrinsic transconductance and mobility values independent of sweep direction, which are up to a factor of two higher than those obtained from simple DC characterization. We also observe drain-bias-induced charge trapping effects at lateral fields greater than 0.1 V/um. In addition, using modeling and capacitance-voltage measurements we extract charge trap densities up to 10^12 1/cm^2 in the top gate dielectric (here Al2O3). Our study illustrates important time- and field-dependent imperfections of top-gated GFETs with high-k dielectrics, which must be carefully considered for future developments of this technologyComment: to appear in IEEE Transactions on Electron Devices (2014