19,044 research outputs found
Effective Launch-to-Capture Power Reduction for LOS Scheme with Adjacent-Probability-Based X-Filling
It has become necessary to reduce power during LSI testing. Particularly, during at-speed testing, excessive power consumed during the Launch-To-Capture (LTC) cycle causes serious issues that may lead to the overkill of defect-free logic ICs. Many successful test generation approaches to reduce IR-drop and/or power supply noise during LTC for the launch-off capture (LOC) scheme have previously been proposed, and several of X-filling techniques have proven especially effective. With X-filling in the launch-off shift (LOS) scheme, however, adjacent-fill (which was originally proposed for shift-in power reduction) is used frequently. In this work, we propose a novel X-filling technique for the LOS scheme, called Adjacent-Probability-based X-Filling (AP-fill), which can reduce more LTC power than adjacent-fill. We incorporate AP-fill into a post-ATPG test modification flow consisting of test relaxation and X-filling in order to avoid the fault coverage loss and the test vector count inflation. Experimental results for larger ITC\u2799 circuits show that the proposed AP-fill technique can achieve a higher power reduction ratio than 0-fill, 1-fill, and adjacent-fill.2011 Asian Test Symposium, 20-23 November 2011, New Delhi, Indi
A survey of scan-capture power reduction techniques
With the advent of sub-nanometer geometries, integrated circuits (ICs) are required to be checked for newer defects. While scan-based architectures help detect these defects using newer fault models, test data inflation happens, increasing test time and test cost. An automatic test pattern generator (ATPG) exercise’s multiple fault sites simultaneously to reduce test data which causes elevated switching activity during the capture cycle. The switching activity results in an IR drop exceeding the devices under test (DUT) specification. An increase in IR-drop leads to failure of the patterns and may cause good DUTs to fail the test. The problem is severe during at-speed scan testing, which uses a functional rated clock with a high frequency for the capture operation. Researchers have proposed several techniques to reduce capture power. They used various methods, including the reduction of switching activity. This paper reviews the recently proposed techniques. The principle, algorithm, and architecture used in them are discussed, along with key advantages and limitations. In addition, it provides a classification of the techniques based on the method used and its application. The goal is to present a survey of the techniques and prepare a platform for future development in capture power reduction during scan testing
Algorithms for Power Aware Testing of Nanometer Digital ICs
At-speed testing of deep-submicron digital very large scale integrated (VLSI) circuits
has become mandatory to catch small delay defects. Now, due to continuous shrinking
of complementary metal oxide semiconductor (CMOS) transistor feature size, power
density grows geometrically with technology scaling. Additionally, power dissipation
inside a digital circuit during the testing phase (for test vectors under all fault models
(Potluri, 2015)) is several times higher than its power dissipation during the normal
functional phase of operation. Due to this, the currents that flow in the power grid during
the testing phase, are much higher than what the power grid is designed for (the
functional phase of operation). As a result, during at-speed testing, the supply grid
experiences unacceptable supply IR-drop, ultimately leading to delay failures during
at-speed testing. Since these failures are specific to testing and do not occur during
functional phase of operation of the chip, these failures are usually referred to false
failures, and they reduce the yield of the chip, which is undesirable.
In nanometer regime, process parameter variations has become a major problem.
Due to the variation in signalling delays caused by these variations, it is important to
perform at-speed testing even for stuck faults, to reduce the test escapes (McCluskey
and Tseng, 2000; Vorisek et al., 2004). In this context, the problem of excessive peak
power dissipation causing false failures, that was addressed previously in the context of
at-speed transition fault testing (Saxena et al., 2003; Devanathan et al., 2007a,b,c), also
becomes prominent in the context of at-speed testing of stuck faults (Maxwell et al.,
1996; McCluskey and Tseng, 2000; Vorisek et al., 2004; Prabhu and Abraham, 2012;
Potluri, 2015; Potluri et al., 2015). It is well known that excessive supply IR-drop during
at-speed testing can be kept under control by minimizing switching activity during
testing (Saxena et al., 2003). There is a rich collection of techniques proposed in the past
for reduction of peak switching activity during at-speed testing of transition/delay faults
ii
in both combinational and sequential circuits. As far as at-speed testing of stuck faults
are concerned, while there were some techniques proposed in the past for combinational
circuits (Girard et al., 1998; Dabholkar et al., 1998), there are no techniques concerning
the same for sequential circuits. This thesis addresses this open problem. We
propose algorithms for minimization of peak switching activity during at-speed testing
of stuck faults in sequential digital circuits under the combinational state preservation
scan (CSP-scan) architecture (Potluri, 2015; Potluri et al., 2015). First, we show that,
under this CSP-scan architecture, when the test set is completely specified, the peak
switching activity during testing can be minimized by solving the Bottleneck Traveling
Salesman Problem (BTSP). This mapping of peak test switching activity minimization
problem to BTSP is novel, and proposed for the first time in the literature.
Usually, as circuit size increases, the percentage of don’t cares in the test set increases.
As a result, test vector ordering for any arbitrary filling of don’t care bits
is insufficient for producing effective reduction in switching activity during testing of
large circuits. Since don’t cares dominate the test sets for larger circuits, don’t care
filling plays a crucial role in reducing switching activity during testing. Taking this
into consideration, we propose an algorithm, XStat, which is capable of performing test
vector ordering while preserving don’t care bits in the test vectors, following which, the
don’t cares are filled in an intelligent fashion for minimizing input switching activity,
which effectively minimizes switching activity inside the circuit (Girard et al., 1998).
Through empirical validation on benchmark circuits, we show that XStat minimizes
peak switching activity significantly, during testing.
Although XStat is a very powerful heuristic for minimizing peak input-switchingactivity,
it will not guarantee optimality. To address this issue, we propose an algorithm
that uses Dynamic Programming to calculate the lower bound for a given sequence
of test vectors, and subsequently uses a greedy strategy for filling don’t cares in this
sequence to achieve this lower bound, thereby guaranteeing optimality. This algorithm,
which we refer to as DP-fill in this thesis, provides the globally optimal solution for
minimizing peak input-switching-activity and also is the best known in the literature
for minimizing peak input-switching-activity during testing. The proof of optimality of
DP-fill in minimizing peak input-switching-activity is also provided in this thesis
A GA-Based Method for High-Quality X-Filling to Reduce Launch Switching Activity in At-speed Scan Testing
Power-aware X-filling is a preferable approach to avoiding IR-drop-induced yield loss in at-speed scan testing. However, the quality of previous X-filling methods for reducing launch switching activity may be unsatisfactory, due to low effect (insufficient and global-only reduction) and/or low scalability (long CPU time). This paper addresses this quality problem with a novel, GA (Genetic Algorithm) based X-filling method, called GA-fill. Its goals are (1) to achieve both effectiveness and scalability in a more balanced manner, and (2) to make the reduction effect of launch switching activity more concentrated on critical areas that have higher impact on IR-drop-induced yield loss. Evaluation experiments are being conducted on benchmark and industrial circuits, and initial results have demonstrated the usefulness of GA-fill.2009 15th IEEE Pacific Rim International Symposium on Dependable Computing, 16-18 November 2009, Shanghai, Chin
A Novel Scheme to Reduce Power Supply Noise for High-Quality At-Speed Scan Testing
High-quality at-speed scan testing, characterized by high small-delay-defect detecting capability, is indispensable to achieve high delay test quality for DSM circuits. However, such testing is susceptible to yield loss due to excessive power supply noise caused by high launch-induced switching activity. This paper addresses this serious problem with a novel and practical post-ATPG X-filling scheme, featuring (1) a test relaxation method, called path keeping X-identification, that finds don\u27t-care bits from a fully-specified transition delay test set while preserving its delay test quality by keeping the longest paths originally sensitized for fault detection, and (2) an X-filling method, called justification-probability-based fill (JP-fill), that is both effective and scalable for reducing launch-induced switching activity. This scheme can be easily implemented into any ATPG flow to effectively reduce power supply noise, without any impact on delay test quality, test data volume, area overhead, and circuit timing.2007 IEEE International Test Conference, 21-26 October 2007, Santa Clara, CA, US
Test Strategies for Low Power Devices
Ultra low-power devices are being developed for embedded applications in bio-medical electronics, wireless sensor networks, environment monitoring and protection, etc. The testing of these low-cost, low-power devices is a daunting task. Depending on the target application, there are stringent guidelines on the number of defective parts per million shipped devices. At the same time, since such devices are cost-sensitive, test cost is a major consideration. Since system-level power-management techniques are employed in these devices, test generation must be power-management-aware to avoid stressing the power distribution infrastructure in the test mode. Structural test techniques such as scan test, with or without compression, can result in excessive heat dissipation during testing and damage the package. False failures may result due to the electrical and thermal stressing of the device in the test mode of operation, leading to yield loss. This paper considers different aspects of testing low-power devices and some new techniques to address these problems.Design, Automation and Test in Europe (DATE \u2708), 10-14 March 2008, Munich, German
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