Near-Zero-Power Temperature Sensing via Tunneling Currents Through Complementary Metal-Oxide-Semiconductor Transistors.

Temperature sensors are routinely found in devices used to monitor the environment, the human body, industrial equipment, and beyond. In many such applications, the energy available from batteries or the power available from energy harvesters is extremely limited due to limited available volume, and thus the power consumption of sensing should be minimized in order to maximize operational lifetime. Here we present a new method to transduce and digitize temperature at very low power levels. Specifically, two pA current references are generated via small tunneling-current metal-oxide-semiconductor field effect transistors (MOSFETs) that are independent and proportional to temperature, respectively, which are then used to charge digitally-controllable banks of metal-insulator-metal (MIM) capacitors that, via a discrete-time feedback loop that equalizes charging time, digitize temperature directly. The proposed temperature sensor was integrated into a silicon microchip and occupied 0.15 mm2 of area. Four tested microchips were measured to consume only 113 pW with a resolution of 0.21 °C and an inaccuracy of ±1.65 °C, which represents a 628× reduction in power compared to prior-art without a significant reduction in performance

Interface Circuits for Microsensor Integrated Systems

ca. 200 words; this text will present the book in all promotional forms (e.g. flyers). Please describe the book in straightforward and consumer-friendly terms. [Recent advances in sensing technologies, especially those for Microsensor Integrated Systems, have led to several new commercial applications. Among these, low voltage and low power circuit architectures have gained growing attention, being suitable for portable long battery life devices. The aim is to improve the performances of actual interface circuits and systems, both in terms of voltage mode and current mode, in order to overcome the potential problems due to technology scaling and different technology integrations. Related problems, especially those concerning parasitics, lead to a severe interface design attention, especially concerning the analog front-end and novel and smart architecture must be explored and tested, both at simulation and prototype level. Moreover, the growing demand for autonomous systems gets even harder the interface design due to the need of energy-aware cost-effective circuit interfaces integrating, where possible, energy harvesting solutions. The objective of this Special Issue is to explore the potential solutions to overcome actual limitations in sensor interface circuits and systems, especially those for low voltage and low power Microsensor Integrated Systems. The present Special Issue aims to present and highlight the advances and the latest novel and emergent results on this topic, showing best practices, implementations and applications. The Guest Editors invite to submit original research contributions dealing with sensor interfacing related to this specific topic. Additionally, application oriented and review papers are encouraged.

High-accuracy Motion Estimation for MEMS Devices with Capacitive Sensors

With the development of micro-electro-mechanical system (MEMS) technologies, emerging MEMS applications such as in-situ MEMS IMU calibration, medical imaging via endomicroscopy, and feedback control for nano-positioning and laser scanning impose needs for especially accurate measurements of motion using on-chip sensors. Due to their advantages of simple fabrication and integration within system level architectures, capacitive sensors are a primary choice for motion tracking in those applications. However, challenges arise as often the capacitive sensing scheme in those applications is unconventional due to the nature of the application and/or the design and fabrication restrictions imposed, and MEMS sensors are traditionally susceptible to accuracy errors, as from nonlinear sensor behavior, gain and bias drift, feedthrough disturbances, etc. Those challenges prevent traditional sensing and estimation techniques from fulfilling the accuracy requirements of the candidate applications. The goal of this dissertation is to provide a framework for such MEMS devices to achieve high-accuracy motion estimation, and specifically to focus on innovative sensing and estimation techniques that leverage unconventional capacitive sensing schemes to improve estimation accuracy. Several research studies with this specific aim have been conducted, and the methodologies, results and findings are presented in the context of three applications. The general procedure of the study includes proposing and devising the capacitive sensing scheme, deriving a sensor model based on first principles of capacitor configuration and sensing circuit, analyzing the sensor’s characteristics in simulation with tuning of key parameters, conducting experimental investigations by constructing testbeds and identifying actuation and sensing models, formulating estimation schemes is to include identified actuation dynamics and sensor models, and validating the estimation schemes and evaluating their performance against ground truth measurements. The studies show that the proposed techniques are valid and effective, as the estimation schemes adopted either fulfill the requirements imposed or improve the overall estimation performance. Highlighted results presented in this dissertation include a scale factor calibration accuracy of 286 ppm for a MEMS gyroscope (Chapter 3), an improvement of 15.1% of angular displacement estimation accuracy by adopting a threshold sensing technique for a scanning micro-mirror (Chapter 4), and a phase shift prediction error of 0.39 degree for a electrostatic micro-scanner using shared electrodes for actuation and sensing (Chapter 5).PHDMechanical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/147568/1/davidsky_1.pd

A novel readout method for focal plane array imaging in the presence of large dark current

This research was an investigation of a novel readout method for focal plane array (FPA) optical imaging, especially for very sensitive detectors with large dark current. The readout method is based on periodically blocking the optical input enabling the removal of the dark current integration from the output. The research demonstrated that it is feasible to modulate the optical input with the designed readout circuit and thus achieve longer signal integration time to enhance the signal-to-noise ratio. Study of a proposed circuit model showed that in theory the correlated readout method could increase the output voltage swing and reduce the noise level by attenuating low frequency noise, thereby effectively improving the FPA dynamic range. Circuits based on standard CMOS circuitry were designed, simulated by PSpice, fabricated using Orbit 2µm n-well technology, and tested with a PI-4000 system. In the circuit evaluation, the output noise due to the clock switching phenomena, the gate signal feedthrough and the charge relaxation, was considered to be the critical problem. The most promising design for minimizing this problem had a CMOS current steering circuit at the input of a high CMRR operational amplifier. Simulation and test results showed that a modified capacitive transimpedance amplifier (CTIA) could subtract dark current output and reduce the output signal due to any difference between the frequencies of the optical input modulation signal and the switch modulation signal. In conclusion, the correlated readout circuit was shown to be a promising approach for advancing FPA technology

Low-Noise Energy-Efficient Sensor Interface Circuits

Today, the Internet of Things (IoT) refers to a concept of connecting any devices on network where environmental data around us is collected by sensors and shared across platforms. The IoT devices often have small form factors and limited battery capacity; they call for low-power, low-noise sensor interface circuits to achieve high resolution and long battery life. This dissertation focuses on CMOS sensor interface circuit techniques for a MEMS capacitive pressure sensor, thermopile array, and capacitive microphone. Ambient pressure is measured in the form of capacitance. This work propose two capacitance-to-digital converters (CDC): a dual-slope CDC employs an energy efficient charge subtraction and dual comparator scheme; an incremental zoom-in CDC largely reduces oversampling ratio by using 9b zoom-in SAR, significantly improving conversion energy. An infrared gesture recognition system-on-chip is then proposed. A hand emits infrared radiation, and it forms an image on a thermopile array. The signal is amplified by a low-noise instrumentation chopper amplifier, filtered by a low-power 30Hz LPF to remove out-band noise including the chopper frequency and its harmonics, and digitized by an ADC. Finally, a motion history image based DSP analyzes the waveform to detect specific hand gestures. Lastly, a microphone preamplifier represents one key challenge in enabling voice interfaces, which are expected to play a dominant role in future IoT devices. A newly proposed switched-bias preamplifier uses switched-MOSFET to reduce 1/f noise inherently.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/137061/1/chaseoh_1.pd

Polymeric Microsensors for Intraoperative Contact Pressure Measurement

Biocompatible sensors have been demonstrated using traditional microfabrication techniques modified for polymer substrates and utilize only materials suitable for implantation or bodily contact. Sensor arrays for the measurement of the load condition of polyethylene spacers in the total knee arthroplasty (TKA) prosthesis have been developed. Arrays of capacitive sensors are used to determine the three-dimensional strain within the polyethylene prosthesis component. Data from these sensors can be used to give researchers a better understanding of component motion, loading, and wear phenomena for a large range of activities. This dissertation demonstrates both analytically and experimentally the fabrication of these sensor arrays using biocompatible polymer substrates and dielectrics while preserving industry-standard microfabrication processing for micron-level resolution. An array of sensors for real-time measurement of pressure profiles is the long-term goal of this research. A custom design using capacitive-based sensors is an excellent selection for such measurement, giving high spatial resolution across the sensing surface and high load resolution for pressures applied normal to that surface while operating at low power

A double-sided, shield-less stave prototype for the ATLAS upgrade strip tracker for the high luminosity LHC

A detailed description of the integration structures for the barrel region of the silicon strips tracker of the ATLAS Phase-II upgrade for the upgrade of the Large Hadron Collider, the so-called High Luminosity LHC (HL-LHC), is presented. This paper focuses on one of the latest demonstrator prototypes recently assembled, with numerous unique features. It consists of a shortened, shield-less, and double sided stave, with two candidate power distributions implemented. Thermal and electrical performances of the prototype are presented, as well as a description of the assembly procedures and tools

Design and standalone characterisation of a capacitively coupled HV-CMOS sensor chip for the CLIC vertex detector

The concept of capacitive coupling between sensors and readout chips is under study for the vertex detector at the proposed high-energy CLIC electron positron collider. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is an active High-Voltage CMOS sensor, designed to be capacitively coupled to the CLICpix2 readout chip. The chip is implemented in a commercial $180$ nm HV-CMOS process and contains a matrix of $128\times128$ square pixels with $25$ $\mu$m pitch. First prototypes have been produced with a standard resistivity of $\sim20$ $\Omega$cm for the substrate and tested in standalone mode. The results show a rise time of $\sim20$ ns, charge gain of $190$ mV/ke$^{-}$ and $\sim40$ e$^{-}$ RMS noise for a power consumption of $4.8$ $\mu$W/pixel. The main design aspects, as well as standalone measurement results, are presented.Comment: 13 pages, 13 figures, 2 tables. Work carried out in the framework of the CLICdp collaboratio

Capacitive Touch Panel with Low Sensitivity to Water Drop employing Mutual-coupling Electrical Field Shaping Technique

This paper proposes a novel method to reduce the water interference on the touch panel based on mutual-capacitance sensing in human finger detection. As the height of a finger (height >10 mm) is far larger than that of a water-drop (height 10 mm) and low in the low-height space (height <1 mm), the sensing cell can be designed to distinguish the finger from the water-drop. To achieve this density distribution of the electrical field, the mutual-coupling electrical field shaping (MEFS) technique is employed to build the sensing cell. The drawback of the MEFS sensing cell is large parasitic capacitance, which can be overcome by a readout IC with low sensitivity to parasitic capacitance. Experiments show that the output of the IC with the MEFS sensing cell is 1.11 V when the sensing cell is touched by the water-drop and 1.23 V when the sensing cell is touched by the finger, respectively. In contrast, the output of the IC with the traditional sensing cell is 1.32 and 1.33 V when the sensing cell is touched by the water-drop and the finger, respectively. This demonstrates that the MEFS sensing cell can better distinguish the finger from the water-drop than the traditional sensing cell does.National Research Foundation (NRF)Accepted versionThis work was supported in part by the National Natural Science Foundation of China (NSFC) under Grant 61771363, in part by the China Scholarship Council (CSC) under Grant 201706960042, and in part by the National Research Foundation of Singapore under Grant NRF-CRP11-2012-01