8 research outputs found

    Pilot study for subgroup classification for autism spectrum disorder based on dysmorphology and physical measurements in Chinese children

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    Poster Sessions: 157 - Comorbid Medical Conditions: abstract 157.058 58BACKGROUND: Autism Spectrum Disorder (ASD) is a complex neurodevelopmental disorder affecting individuals along a continuum of severity in communication, social interaction and behaviour. The impact of ASD significantly varies amongst individuals, and the cause of ASD can originate broadly between genetic and environmental factors. Objectives: Previous ASD researches indicate that early identification combined with a targeted treatment plan involving behavioural interventions and multidisciplinary therapies can provide substantial improvement for ASD patients. Currently there is no cure for ASD, and the clinical variability and uncertainty of the disorder still remains. Hence, the search to unravel heterogeneity within ASD by subgroup classification may provide clinicians with a better understanding of ASD and to work towards a more definitive course of action. METHODS: In this study, a norm of physical measurements including height, weight, head circumference, ear length, outer and inner canthi, interpupillary distance, philtrum, hand and foot length was collected from 658 Typical Developing (TD) Chinese children aged 1 to 7 years (mean age of 4.19 years). The norm collected was compared against 80 ASD Chinese children aged 1 to 12 years (mean age of 4.36 years). We then further attempted to find subgroups within ASD based on identifying physical abnormalities; individuals were classified as (non) dysmorphic with the Autism Dysmorphology Measure (ADM) from physical examinations of 12 body regions. RESULTS: Our results show that there were significant differences between ASD and TD children for measurements in: head circumference (p=0.009), outer (p=0.021) and inner (p=0.021) canthus, philtrum length (p=0.003), right (p=0.023) and left (p=0.20) foot length. Within the 80 ASD patients, 37(46%) were classified as dysmorphic (p=0.00). CONCLUSIONS: This study attempts to identify subgroups within ASD based on physical measurements and dysmorphology examinations. The information from this study seeks to benefit ASD community by identifying possible subtypes of ASD in Chinese population; in seek for a more definitive diagnosis, referral and treatment plan.published_or_final_versio

    Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability

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    Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management; and, Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998.Includes bibliographical references (p. 109-110).by Sherry L. Clough.M.S

    Through-Life Monitoring of the impact of vibration on the reliability of area array packages using Non- Destructive Testing

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    In order to keep up with the demands for faster, cheaper and smaller electronics, the packaging industry has evolved tremendously. Area array packages like flip chips and ball grid arrays are therefore widely used in modern day electronics. However, from the reliability standpoint, solder joints in these area array packages are often the weakest link. In case of harsh vibration environments like military and automobile applications, joint failure mainly occurs due to the high stress incurred during extreme environmental conditions that lead to fatigue failures. This thesis aims to study the effects of real time vibration on area array packages (flip chips in particular) using acoustic micro imaging for through life monitoring of the solder joints. Since real time vibration on solder joints have not been studied before, the various steps for successful testing, through life monitoring of the solder joints and data analysis will be investigated and discussed. Based on automobile industry standards, a real time vibration profile was obtained with the help of Delphi experts, who are the industry collaborators of this project. Due to its strong capability to detect discontinuities within materials and interconnections, Acoustic Micro Imaging (AMI) also known as Scanning Acoustic Microscopy (CSAM) has been used to monitor the solder joints. This approach has not previously been used as an effective tool in monitoring solder joints through life performance in vibration testing. The research regime proposed in this thesis was to monitor the health of solder joints through ultrasound images from beginning to failure, and to see how cracks initiate and propagate in them. The effect of the relative position and orientation on the reliability of the solder joints and the flip chips in the PCB was also studied. The data collected was analysed using MATLAB. The results have shown that three types of solder joints- healthy, partially fractured or fractured are formed near the time of complete failure of a flip chip. When about 70- 80% of the flip chips are either partially fractured or fractured a flip chip is expected to fail. The mean pixel intensity and area change in the acoustic image of a partially fractured or fully fractured joint tends to be higher compared to a healthy joint. Crack initiation in a joint occurs at around 35-40% cycling and propagates linearly till 80-85% cycling after which a joint fails. A statistical analysis done on the solder joints showed that the intensity distribution of healthy joints follow a simple Gaussian distribution while that of partially fractured or fractured joint can only be represented by using a mixture of Gaussians. The solder joints near the board edges are the least reliable in a vibration environment. However, solder joints with back to back connections are more reliable than the ones placed in one sided orientation. The most reliable flip chip orientation in a vibration environment is the back to back connection with no offset which was actually found to be the least reliable in the case of thermal cycling. Based on the analysis of the results, a few design guidelines for flip chip layout and orientations in a PCB has also been proposed in this work

    Innovation: Key to the future

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    The NASA Marshall Space Flight Center Annual Report is presented. A description of research and development projects is included. Topics covered include: space science; space systems; transportation systems; astronomy and astrophysics; earth sciences; solar terrestrial physics; microgravity science; diagnostic and inspection system; information, electronic, and optical systems; materials and manufacturing; propulsion; and structures and dynamics

    Research and Technology 1995

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    This report selectively summarizes the NASA Lewis Research Center's research and technology accomplishments for fiscal year 1995. It comprises over 150 short articles submitted by the staff members of the technical directorates. The report is organized into six major sections: aeronautics, aerospace technology, space flight systems, engineering support, Lewis Research Academy, and technology transfer. A table of contents, an author index, and a list of NASA Headquarters program offices have been included to assist the reader in finding articles of special interest. This report is not intended to be a comprehensive summary of all research and technology work done over the past fiscal year. Most of the work is reported in Lewis-published technical reports, journal articles, and presentations prepared by Lewis staff members and contractors (for abstracts of these Lewis-authored reports, visit the Lewis Technical Report Server (LETRS) on the World Wide Web-http://letrs.lerc.nasa.gov/LeTRS/). In addition, university grants have enabled faculty members and graduate students to engage in sponsored research that is reported at technical meetings or in journal articles. For each article in this report, a Lewis contact person has been identified, and where possible, reference documents are listed so that additional information can be easily obtained. The diversity of topics attests to the breadth of research and technology being pursued and to the skill mix of the staff that makes it possible. For more information about Lewis' research, visit us on the World Wide web-http://www.lerc.nasa.gov
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