6,317 research outputs found

    A review of advances in pixel detectors for experiments with high rate and radiation

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    The Large Hadron Collider (LHC) experiments ATLAS and CMS have established hybrid pixel detectors as the instrument of choice for particle tracking and vertexing in high rate and radiation environments, as they operate close to the LHC interaction points. With the High Luminosity-LHC upgrade now in sight, for which the tracking detectors will be completely replaced, new generations of pixel detectors are being devised. They have to address enormous challenges in terms of data throughput and radiation levels, ionizing and non-ionizing, that harm the sensing and readout parts of pixel detectors alike. Advances in microelectronics and microprocessing technologies now enable large scale detector designs with unprecedented performance in measurement precision (space and time), radiation hard sensors and readout chips, hybridization techniques, lightweight supports, and fully monolithic approaches to meet these challenges. This paper reviews the world-wide effort on these developments.Comment: 84 pages with 46 figures. Review article.For submission to Rep. Prog. Phy

    Study of optoelectronic switch for satellite-switched time-division multiple access

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    The use of optoelectronic switching for satellite switched time division multiple access will improve the isolation and reduce the crosstalk of an IF switch matrix. The results are presented of a study on optoelectronic switching. Tasks include literature search, system requirements study, candidate switching architecture analysis, and switch model optimization. The results show that the power divided and crossbar switching architectures are good candidates for an IF switch matrix

    Programmable photonics : an opportunity for an accessible large-volume PIC ecosystem

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    We look at the opportunities presented by the new concepts of generic programmable photonic integrated circuits (PIC) to deploy photonics on a larger scale. Programmable PICs consist of waveguide meshes of tunable couplers and phase shifters that can be reconfigured in software to define diverse functions and arbitrary connectivity between the input and output ports. Off-the-shelf programmable PICs can dramatically shorten the development time and deployment costs of new photonic products, as they bypass the design-fabrication cycle of a custom PIC. These chips, which actually consist of an entire technology stack of photonics, electronics packaging and software, can potentially be manufactured cheaper and in larger volumes than application-specific PICs. We look into the technology requirements of these generic programmable PICs and discuss the economy of scale. Finally, we make a qualitative analysis of the possible application spaces where generic programmable PICs can play an enabling role, especially to companies who do not have an in-depth background in PIC technology

    Four-channel WDM transmitter with heterogeneously integrated III-V/Si photonics and low power 32 nm CMOS drivers

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    Artículo científicoWe experimentally demonstrate a novel four-channel wavelength division multiplexing transmitter operating at 1.3 μm wavelength employing heterogeneously integrated III-V/Si photonic circuit copackaged with low-power 32-nm SOI CMOS driver integrated circuits (ICs). Error-free operation (BER < 10−12 ) has been achieved across all four channels for back-to-back, 2 and 10 km single-mode fiber transmission at 25 Gb/s per each channel, targeting intra- and inter-datacenter interconnect applications. Power consumption as low as 19.2 mW for four CMOS driver ICs has been recorded, which yields 0.19 pJ/bit energy efficiency

    Advanced digital modulation: Communication techniques and monolithic GaAs technology

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    Communications theory and practice are merged with state-of-the-art technology in IC fabrication, especially monolithic GaAs technology, to examine the general feasibility of a number of advanced technology digital transmission systems. Satellite-channel models with (1) superior throughput, perhaps 2 Gbps; (2) attractive weight and cost; and (3) high RF power and spectrum efficiency are discussed. Transmission techniques possessing reasonably simple architectures capable of monolithic fabrication at high speeds were surveyed. This included a review of amplitude/phase shift keying (APSK) techniques and the continuous-phase-modulation (CPM) methods, of which MSK represents the simplest case

    A 30 GHz monolithic receive module technology assessment

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    This report is a technology assessment relevant to the 30 GHz Monolithic Receive Module development. It is based on results obtained on the present NASA Contract (NAS3-23356) as well as on information gathered from literature and other industry sources. To date the on-going Honeywell program has concentrated on demonstrating the so-called interconnected receive module which consists of four monolithic chips - the low noise front-end amplifier (LNA), the five bit phase shifter (PS), the gain control amplifier (GC), and the RF to IF downconverter (RF/IF). Results on all four individual chips have been obtained and interconnection of the first three functions has been accomplished. Future work on this contract is aimed at a higher level of integration, i.e., integration of the first three functions (LNA + PS + GC) on a single GaAs chip. The report presents the status of this technology and projections of its future directions

    A low power 2 x 28 Gb/s electroabsorption modulator driver array with on-chip duobinary encoding

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    An integrated 2 x 28 Gb/s dual-channel duobinary driver IC is presented. Each channel has integrated coding blocks, transforming a non-return-to-zero input signal into a 3-level electrical duobinary signal to achieve an optical duobinary modulation. To the best of our knowledge this is the fastest modulator driver including on-chip duobinary encoding and precoding. Moreover, it only consumes 652 mW per channel at a differential output swing of 6 V-pp

    Microsystems technology: objectives

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    This contribution focuses on the objectives of microsystems technology (MST). The reason for this is two fold. First of all, it should explain what MST actually is. This question is often posed and a simple answer is lacking, as a consequence of the diversity of subjects that are perceived as MST. The second reason is that a map of the somewhat chaotic field of MST is needed to identify sub-territories, for which standardization in terms of system modules an interconnections is feasible. To define the objectives a pragmatic approach has been followed. From the literature a selection of topics has been chosen and collected that are perceived as belonging to the field of MST by a large community of workers in the field (more than 250 references). In this way an overview has been created with `applications¿ and `generic issues¿ as the main characteristics
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