PMMA-based wafer-bonded capacitive micromachined ultrasonic transducer for underwater applications

This article presents a new wafer-bonding fabrication technique for Capacitive Micromachined Ultrasonic Transducers (CMUTs) using polymethyl methacrylate (PMMA). The PMMA-based single-mask and single-dry-etch step-bonding device is much simpler, and reduces process steps and cost as compared to other wafer-bonding methods and sacrificial-layer processes. A low-temperature (<180 ◦ C) bonding process was carried out in a purpose-built bonding tool to minimize the involvement of expensive laboratory equipment. A single-element CMUT comprising 16 cells of 2.5 mm radius and 800 nm cavity was fabricated. The center frequency of the device was set to 200 kHz for underwater communication purposes. Characterization of the device was carried out in immersion, and results were subsequently validated with data from Finite Element Analysis (FEA). Results show the feasibility of the fabricated CMUTs as receivers for underwater applications

Fabrication of CMUTS based on PMMA adhesive wafer bonding

Capacitive Micromachined Ultrasonic Transducers (CMUTs) are the potential alternatives for the conventional piezoelectric ultrasonic transducers. CMUTs have been under an extensive research and development since their first development in the mid- 1990s. Initially developed for air-coupled applications, CMUTs have shown far better acceptability in immersion-based applications (i.e. medical ultrasonic imaging, medical therapy, and underwater imaging) when compared to the piezoelectric ultrasonic transducers. CMUTs are parallel-plate capacitors fabricated using the Micro Electro Mechanical Systems (MEMS) technology. Despite of the fact that various CMUT fabrication methods have been reported in the literature, there are still many challenges to address in CMUTs design and fabrication. Standard fabrication techniques are further sub-divided into the Sacrificial Layer Release Process and the Wafer Bonding methods. A number of complications are associated with these techniques, such as optimization of the design parameters, process complexity, sacrificial layer material with the corresponding etchant selection, wafer cost and selection. In particular, the sacrificial release methods consist of complex fabrication steps. Furthermore, structural parameters like gap height and radius have optimization issues during the sacrificial release process. On the other hand, the wafer bonding techniques for the CMUTs fabrication are simple and have a great control over the structure parameters in contrast to the sacrificial release methods. At the same time, the wafer-bonded CMUTs require very high quality wafer surface and have a very high contamination sensitivity. For this purpose, this dissertation aims to develop a simple, low cost and lower constraint thermocompression-based technique for the CMUT fabrication. The proposed wafer bonding technique for the CMUT fabrication in the dissertation uses Polymethyl methacrylate (PMMA) adhesive as an intermediate layer for the thermocompression wafer bonding. The advantages associated with the PMMA adhesivebased wafer bonding over the other wafer bonding methods include low process temperature (usually 200 C or less), high wafer surface defects and contamination tolerance, high surface energy and low bonding stresses. These factors will add cost effectiveness and simplicity to the CMUTs fabrication process. Furthermore, the achieved receive sensitivity with the reported CMUT is found comparable to the commercially available ultrasonic transducer

MEMS Technology for Biomedical Imaging Applications

Biomedical imaging is the key technique and process to create informative images of the human body or other organic structures for clinical purposes or medical science. Micro-electro-mechanical systems (MEMS) technology has demonstrated enormous potential in biomedical imaging applications due to its outstanding advantages of, for instance, miniaturization, high speed, higher resolution, and convenience of batch fabrication. There are many advancements and breakthroughs developing in the academic community, and there are a few challenges raised accordingly upon the designs, structures, fabrication, integration, and applications of MEMS for all kinds of biomedical imaging. This Special Issue aims to collate and showcase research papers, short commutations, perspectives, and insightful review articles from esteemed colleagues that demonstrate: (1) original works on the topic of MEMS components or devices based on various kinds of mechanisms for biomedical imaging; and (2) new developments and potentials of applying MEMS technology of any kind in biomedical imaging. The objective of this special session is to provide insightful information regarding the technological advancements for the researchers in the community

Acoustic sensor

A method of designing and manufacturing an acoustic sensor having a high degree of directivity is disclosed. The sensor includes a rotatable plate that is attached to a substrate with mounts. In one aspect the mounts are freely rotatable and the torque on the plate is measured using detectors disposed on springs that provide a resistance to rotation of the plate. In another aspect the plate is mounted to the substrate with mounts that torsionally deform during rotation of the plate. These detectors measure the torque on the plate according to the torsional deformation of the mounts. Methods of improving the signal to noise ratio of acoustic sensors having multiple detectors are also disclosed.Board of Regents, University of Texas Syste

UV-LIGA micro-fabrication of inertia type electrostatic transducers and their application

This dissertation discusses the design, working principles, static & dynamic analysis and simulation, mechanics of material, applied MEMS technology, micro-fabrication, and experimental testing of two types of micro-transducers: micro-power relay and micro-accelerometer. Several possible design concepts were proposed, and the advantages and disadvantages of electrostatic working principles were also discussed. Transducers presented in this research used electrostatic force as a driving force in the micro-relay and capacitance as a sensing parameter in the micro-accelerometer. There was an analogy between the micro-relay and the micro-accelerometer in their theoretical approach and fabrication processes. The proposed micro-transducers (micro-relay and micro-accelerometer) were fabricated using UV lithograph of SU-8 & SPR and UV-LIGA process. The advantages and disadvantages of these processes were discussed. The micro-relays fabricated by UV-LIGA technology had the following advantages compared with other reported relays: fast switching speed, high power capacity, high off-resistance, lower on-resistance, low power consumption, and low heat generation. The polymer-based micro-accelerometers were designed and fabricated. Instead of applying SU-8 only as a photo resist, cured SU-8 was used as the primary structural material in fabricating the micro-accelerometers. The great flexibility in size and aspect ratio of cured SU-8 made it feasible to produce highly sensitive accelerometers. The prototype micro-relays and micro-accelerometers were tested for the dynamic characteristics and power capacity. The experimental results in micro-relays had confirmed that reasonably large current capacity and fast response speed was able to be achieved using electromagnetic actuation and the multilayer UV-LIGA fabrication process

Air-coupled Capacitive Micromachined Ultrasonic Transducers based on Annular Cell Geometry

Air-coupled ultrasound is gaining increasing industry momentum due to the demands and development of non-destructive evaluation (NDE) of aerospace composite materials. Currently, the micromachining technology has advanced such that vacuum cavities sealed by thin plates, known as Capacitive Micromachined Ultrasonic Transducers (CMUTs), can be fabricated through silicon micromachining processes in a low cost manner. Given the thin plates, a CMUT is able to vibrate with a low mechanical impedance and thus a high coupling efficiency with the ambient atmosphere. Nevertheless, air-coupled applications are still highly limited by the transmit power of air-coupled CMUTs. A circle is the routine geometry in most CMUT cell designs. Even though efforts have been put forward to address the limitations of circular design in terms of sensitivity, more investigation about other cell geometries is prudent. In this work, a novel air-coupled CMUT design with annular cell geometry is proposed. Finite element analysis and experimental studies demonstrated its significant improvement in transmit efficiency over the conventional circular-cell CMUTs. A lumped element model was constructed to facilitate a better understanding and provide an efficient design technique of the annular CMUT. Three optimization schemes were developed to optimize the transmit efficiency and achieve a reasonable comparison between the novel annular and conventional circular CMUT cells. Based on the lumped models, a design optimization flow chart was constructed to facilitate the analytical optimization of the three schemes. To further enhance the transmit power as well as offer depth focusing, a 9-element concentric annular-cell array was designed, fabricated, and characterized. A pillar-free etching process was developed to create the deep large-area cavities. The cross-talk between neighbouring cells and the plate-cracking phenomenon were discussed with suggestions for improvement being provided. This study provides a systematic framework for designing and studying annular-cell CMUTs and demonstrates their great potential in transmitting high-power ultrasound in air

Experimental Characterization of A Piezoelectric Transducer Array Taking into Account Crosstalk Phenomenon

Ultrasonic transducer arrays are generally composed of several piezoelectric elements arranged in 1D or 2D ways. Crosstalk is an undesirable phenomenon decreasing the performance of these devices. It generates parasitic displacements at the elements' radiating surfaces, which changes the directivity of the array. Furthermore, the transducer's displacement plays a critical role in terms of the focal area and transferred intensities. The objective of this paper is to characterize a piezoelectric array composed of seven-elements made of PZ 27 ceramic experimentally. It investigates the effects of the crosstalk phenomenon on the array's performance in particular. The results have shown that the array's elements vibrate mainly in thickness mode, but the displacement is not uniform along their length due to the contribution of a parasitic length mode. Moreover, the major parasitic displacements are obtained on the neighboring passive elements: about -7.3 dB, -11 dB, and -12 dB, on the first, the second, and the third elements, respectively

Surface micromachined MEMS variable capacitor with two-cavity for energy harvesting

In this research, a novel MEMS variable capacitor with two capacitive cavities for energy harvesting was developed that use the wasted energy associated with undesirable mechanical vibrations to power microelectronic sensors and actuators widely found in structures and systems surrounding us. The harvested power, though very small, can have a profound effect on the usage of microsensors. First, the self-powered sensors will no longer require regular battery maintenance. Second, the self-powered chip is a liberating technology. On a circuit board, it can simplify the connection. On a commercial jet, the sensors can greatly simplify cabling. The design, fabrication, modeling and complete set of characterization of MEMS variable capacitors with two-cavity are presented in details in this thesis. The MEMS variable capacitors are unique in its two-cavity design and use of electroplated nickel as the main structural material. The device consists of 2x2 mm² movable capacitive proof mass plates with a thickness of 30 [mu]m suspended between two fixed electrodes forming two vertical capacitors. When the capacitance increases for one cavity, it decreases for the other. This allows using both up and down directions to generate energy. The suspended movable plates are supported by four serpentine springs with a thickness of 3-5 [mu]m that are attached to the address lines on a silicon substrate only at the anchors' points which is made of electroplated nickel. The serpentine suspension beams are made with a width, thickness and total length (four serpentine turns) of 15 [mu]m, 5 [mu]m and 1485 [mu]m. Five gold stoppers with height of 2-4 [mu]m were electroplated on the fixed plates to prevent snap-down of the movable plates by overwhelming electrostatic force. SiO2 and Si3N4 thin layers were patterned on the fixed plates to insulate the stoppers and enhance the dielectric property of capacitive cavities. The MEMS variable capacitor with two-cavity has been designed and modeled using MEMS CAD tool and COMSOL Multi-PhysIncludes bibliographical references (pages 108-118)

Semiconductor Infrared Devices and Applications

Infrared (IR) technologies—from Herschel’s initial experiment in the 1800s to thermal detector development in the 1900s, followed by defense-focused developments using HgCdTe—have now incorporated a myriad of novel materials for a wide variety of applications in numerous high-impact fields. These include astronomy applications; composition identifications; toxic gas and explosive detection; medical diagnostics; and industrial, commercial, imaging, and security applications. Various types of semiconductor-based (including quantum well, dot, ring, wire, dot in well, hetero and/or homo junction, Type II super lattice, and Schottky) IR (photon) detectors, based on various materials (type IV, III-V, and II-VI), have been developed to satisfy these needs. Currently, room temperature detectors operating over a wide wavelength range from near IR to terahertz are available in various forms, including focal plane array cameras. Recent advances include performance enhancements by using surface Plasmon and ultrafast, high-sensitivity 2D materials for infrared sensing. Specialized detectors with features such as multiband, selectable wavelength, polarization sensitive, high operating temperature, and high performance (including but not limited to very low dark currents) are also being developed. This Special Issue highlights advances in these various types of infrared detectors based on various material systems