A low-speed BIST framework for high-performance circuit testing

Testing of high performance integrated circuits is becoming increasingly a challenging task owing to high clock frequencies. Often testers are not able to test such devices due to their limited high frequency capabilities. In this article we outline a design-for-test methodology such that high performance devices can be tested on relatively low performance testers. In addition, a BIST framework is discussed based on this methodology. Various implementation aspects of this technique are also addresse

Architectures for dependable modern microprocessors

Η εξέλιξη των ολοκληρωμένων κυκλωμάτων σε συνδυασμό με τους αυστηρούς χρονικούς περιορισμούς καθιστούν την επαλήθευση της ορθής λειτουργίας των επεξεργαστών μία εξαιρετικά απαιτητική διαδικασία. Με κριτήριο το στάδιο του κύκλου ζωής ενός επεξεργαστή, από την στιγμή κατασκευής των πρωτοτύπων και έπειτα, οι τεχνικές ελέγχου ορθής λειτουργίας διακρίνονται στις ακόλουθες κατηγορίες: (1) Silicon Debug: Τα πρωτότυπα ολοκληρωμένα κυκλώματα ελέγχονται εξονυχιστικά, (2) Manufacturing Testing: ο τελικό ποιοτικός έλεγχος και (3) In-field verification: Περιλαμβάνει τεχνικές, οι οποίες διασφαλίζουν την λειτουργία του επεξεργαστή σύμφωνα με τις προδιαγραφές του. Η διδακτορική διατριβή προτείνει τα ακόλουθα: (1) Silicon Debug: Η εργασία αποσκοπεί στην επιτάχυνση της διαδικασίας ανίχνευσης σφαλμάτων και στον αυτόματο εντοπισμό τυχαίων προγραμμάτων που δεν περιέχουν νέα -χρήσιμη- πληροφορία σχετικά με την αίτια ενός σφάλματος. Η κεντρική ιδέα αυτής της μεθόδου έγκειται στην αξιοποίηση της έμφυτης ποικιλομορφίας των αρχιτεκτονικών συνόλου εντολών και στην δυνατότητα από-διαμόρφωσης τμημάτων του κυκλώματος, (2) Manufacturing Testing: προτείνεται μία μέθοδο για την βελτιστοποίηση του έλεγχου ορθής λειτουργίας των πολυνηματικών και πολυπύρηνων επεξεργαστών μέσω της χρήση λογισμικού αυτοδοκιμής, (3) Ιn-field verification: Αναλύθηκε σε βάθος η επίδραση που έχουν τα μόνιμα σφάλματα σε μηχανισμούς αύξησης της απόδοσης. Επιπρόσθετα, προτάθηκαν τεχνικές για την ανίχνευση και ανοχή μόνιμων σφαλμάτων υλικού σε μηχανισμούς πρόβλεψης διακλάδωσης.Technology scaling, extreme chip integration and the compelling requirement to diminish the time-to-market window, has rendered microprocessors more prone to design bugs and hardware faults. Microprocessor validation is grouped into the following categories, based on where they intervene in a microprocessor’s lifecycle: (a) Silicon debug: the first hardware prototypes are exhaustively validated, (b) Μanufacturing testing: the final quality control during massive production, and (c) In-field verification: runtime error detection techniques to guarantee correct operation. The contributions of this thesis are the following: (1) Silicon debug: We propose the employment of deconfigurable microprocessor architectures along with a technique to generate self-checking random test programs to avoid the simulation step and triage the redundant debug sessions, (2) Manufacturing testing: We propose a self-test optimization strategy for multithreaded, multicore microprocessors to speedup test program execution time and enhance the fault coverage of hard errors; and (3) In-field verification: We measure the effect of permanent faults performance components. Then, we propose a set of low-cost mechanisms for the detection, diagnosis and performance recovery in the front-end speculative structures. This thesis introduces various novel methodologies to address the validation challenges posed throughout the life-cycle of a chip

Test and Diagnosis of Integrated Circuits

The ever-increasing growth of the semiconductor market results in an increasing complexity of digital circuits. Smaller, faster, cheaper and low-power consumption are the main challenges in semiconductor industry. The reduction of transistor size and the latest packaging technology (i.e., System-On-a-Chip, System-In-Package, Trough Silicon Via 3D Integrated Circuits) allows the semiconductor industry to satisfy the latest challenges. Although producing such advanced circuits can benefit users, the manufacturing process is becoming finer and denser, making chips more prone to defects.The work presented in the HDR manuscript addresses the challenges of test and diagnosis of integrated circuits. It covers:- Power aware test;- Test of Low Power Devices;- Fault Diagnosis of digital circuits

Integrated circuit outlier identification by multiple parameter correlation

Semiconductor manufacturers must ensure that chips conform to their specifications before they are shipped to customers. This is achieved by testing various parameters of a chip to determine whether it is defective or not. Separating defective chips from fault-free ones is relatively straightforward for functional or other Boolean tests that produce a go/no-go type of result. However, making this distinction is extremely challenging for parametric tests. Owing to continuous distributions of parameters, any pass/fail threshold results in yield loss and/or test escapes. The continuous advances in process technology, increased process variations and inaccurate fault models all make this even worse. The pass/fail thresholds for such tests are usually set using prior experience or by a combination of visual inspection and engineering judgment. Many chips have parameters that exceed certain thresholds but pass Boolean tests. Owing to the imperfect nature of tests, to determine whether these chips (called "outliers") are indeed defective is nontrivial. To avoid wasted investment in packaging or further testing it is important to screen defective chips early in a test flow. Moreover, if seemingly strange behavior of outlier chips can be explained with the help of certain process parameters or by correlating additional test data, such chips can be retained in the test flow before they are proved to be fatally flawed. In this research, we investigate several methods to identify true outliers (defective chips, or chips that lead to functional failure) from apparent outliers (seemingly defective, but fault-free chips). The outlier identification methods in this research primarily rely on wafer-level spatial correlation, but also use additional test parameters. These methods are evaluated and validated using industrial test data. The potential of these methods to reduce burn-in is discussed

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

Investigation into voltage and process variation-aware manufacturing test

Increasing integration and complexity in IC design provides challenges for manufacturing testing. This thesis studies how process and supply voltage variation influence defect behaviour to determine the impact on manufacturing test cost and quality. The focus is on logic testing of static CMOS designs with respect to two important defect types in deep submicron CMOS: resistive bridges and full opens. The first part of the thesis addresses testing for resistive bridge defects in designs with multiple supply voltage settings. To enable analysis, a fault simulator is developed using a supply voltage-aware model for bridge defect behaviour. The analysis shows that for high defect coverage it is necessary to perform test for more than one supply voltage setting, due to supply voltage-dependent behaviour. A low-cost and effective test method is presented consisting of multi-voltage test generation that achieves high defect coverage and test set size reduction without compromise to defect coverage. Experiments on synthesised benchmarks with realistic bridge locations validate the proposed method.The second part focuses on the behaviour of full open defects under supply voltage variation. The aim is to determine the appropriate value of supply voltage to use when testing. Two models are considered for the behaviour of full open defects with and without gate tunnelling leakage influence. Analysis of the supply voltage-dependent behaviour of full open defects is performed to determine if it is required to test using more than one supply voltage to detect all full open defects. Experiments on synthesised benchmarks using an extended version of the fault simulator tool mentioned above, measure the quantitative impact of supply voltage variation on defect coverage.The final part studies the impact of process variation on the behaviour of bridge defects. Detailed analysis using synthesised ISCAS benchmarks and realistic bridge model shows that process variation leads to additional faults. If process variation is not considered in test generation, the test will fail to detect some of these faults, which leads to test escapes. A novel metric to quantify the impact of process variation on test quality is employed in the development of a new test generation tool, which achieves high bridge defect coverage. The method achieves a user-specified test quality with test sets which are smaller than test sets generated without consideration of process variation

Cross layer reliability estimation for digital systems

Forthcoming manufacturing technologies hold the promise to increase multifuctional computing systems performance and functionality thanks to a remarkable growth of the device integration density. Despite the benefits introduced by this technology improvements, reliability is becoming a key challenge for the semiconductor industry. With transistor size reaching the atomic dimensions, vulnerability to unavoidable fluctuations in the manufacturing process and environmental stress rise dramatically. Failing to meet a reliability requirement may add excessive re-design cost to recover and may have severe consequences on the success of a product. %Worst-case design with large margins to guarantee reliable operation has been employed for long time. However, it is reaching a limit that makes it economically unsustainable due to its performance, area, and power cost. One of the open challenges for future technologies is building ``dependable'' systems on top of unreliable components, which will degrade and even fail during normal lifetime of the chip. Conventional design techniques are highly inefficient. They expend significant amount of energy to tolerate the device unpredictability by adding safety margins to a circuit's operating voltage, clock frequency or charge stored per bit. Unfortunately, the additional cost introduced to compensate unreliability are rapidly becoming unacceptable in today's environment where power consumption is often the limiting factor for integrated circuit performance, and energy efficiency is a top concern. Attention should be payed to tailor techniques to improve the reliability of a system on the basis of its requirements, ending up with cost-effective solutions favoring the success of the product on the market. Cross-layer reliability is one of the most promising approaches to achieve this goal. Cross-layer reliability techniques take into account the interactions between the layers composing a complex system (i.e., technology, hardware and software layers) to implement efficient cross-layer fault mitigation mechanisms. Fault tolerance mechanism are carefully implemented at different layers starting from the technology up to the software layer to carefully optimize the system by exploiting the inner capability of each layer to mask lower level faults. For this purpose, cross-layer reliability design techniques need to be complemented with cross-layer reliability evaluation tools, able to precisely assess the reliability level of a selected design early in the design cycle. Accurate and early reliability estimates would enable the exploration of the system design space and the optimization of multiple constraints such as performance, power consumption, cost and reliability. This Ph.D. thesis is devoted to the development of new methodologies and tools to evaluate and optimize the reliability of complex digital systems during the early design stages. More specifically, techniques addressing hardware accelerators (i.e., FPGAs and GPUs), microprocessors and full systems are discussed. All developed methodologies are presented in conjunction with their application to real-world use cases belonging to different computational domains